Jon Chadwick

Person

Greensboro, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 11,069,590
- Issue date Jul 20, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 11,063,021
- Issue date Jul 13, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 11,011,498
- Issue date May 18, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,964,672
- Issue date Mar 30, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,950,518
- Issue date Mar 16, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fan-out package with enhanced performance
- Patent number 10,903,132
- Issue date Jan 26, 2021
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance and manufacturing met...
- Patent number 10,882,740
- Issue date Jan 5, 2021
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,804,179
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,804,246
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,773,952
- Issue date Sep 15, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,755,992
- Issue date Aug 25, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,679,918
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,676,348
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,658,259
- Issue date May 19, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,636,720
- Issue date Apr 28, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,622,271
- Issue date Apr 14, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,615,147
- Issue date Apr 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,600,711
- Issue date Mar 24, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,589,993
- Issue date Mar 17, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,586,747
- Issue date Mar 10, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,549,988
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked dies
- Patent number 10,553,564
- Issue date Feb 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,529,639
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,490,471
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,490,476
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,963
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,453,765
- Issue date Oct 22, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,684
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,418,297
- Issue date Sep 17, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,377,627
- Issue date Aug 13, 2019
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200115220
- Publication date Apr 16, 2020
- Qorvo US, Inc.
- Jonathan Hale Hammond
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20200102217
- Publication date Apr 2, 2020
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES
- Publication number 20190378819
- Publication date Dec 12, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES
- Publication number 20190378821
- Publication date Dec 12, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20190057922
- Publication date Feb 21, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013254
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
- Publication number 20190013255
- Publication date Jan 10, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180047653
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044169
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Merrill Albert Hatcher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20170334710
- Publication date Nov 23, 2017
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP MODULE WITH ENHANCED PROPERTIES
- Publication number 20160343592
- Publication date Nov 24, 2016
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE
- Publication number 20160284568
- Publication date Sep 29, 2016
- RF Micro Devices, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE
- Publication number 20160284570
- Publication date Sep 29, 2016
- RF Micro Devices, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS

Jon Chadwick

Person

Patents Grantslast 30 patents

Wafer-level fan-out package with enhanced performance

Microelectronics package with vertically stacked dies

Microelectronics package with vertically stacked dies

Microelectronics package with vertically stacked dies

Wafer-level fan-out package with enhanced performance

Wafer-level fan-out package with enhanced performance

Wafer-level package with enhanced performance and manufacturing met...

Wafer-level package with enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Microelectronics package with vertically stacked dies

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Wafer-level packaging for enhanced performance

Wafer-level package with enhanced performance

Patents Applicationslast 30 patents

WAFER-LEVEL FAN-OUT PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED DIES

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

FLIP CHIP MODULE WITH ENHANCED PROPERTIES

ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE