Ken Kaung Lai

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for selective nitridation process
- Patent number 10,049,881
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Matthew S. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 9,031,685
- Issue date May 12, 2015
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 8,626,330
- Issue date Jan 7, 2014
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 8,027,746
- Issue date Sep 27, 2011
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 7,860,597
- Issue date Dec 28, 2010
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing tungsten layers employing atomic layer depos...
- Patent number 7,745,333
- Issue date Jun 29, 2010
- Applied Materials, Inc.
- Ken Kaung Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing tungsten-containing layers by vapor depositio...
- Patent number 7,709,385
- Issue date May 4, 2010
- Applied Materials, Inc.
- Ming Xi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed deposition process for tungsten nucleation
- Patent number 7,695,563
- Issue date Apr 13, 2010
- Applied Materials, Inc.
- Xinliang Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 7,660,644
- Issue date Feb 9, 2010
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 7,605,083
- Issue date Oct 20, 2009
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing tungsten-containing layers by vapor depositio...
- Patent number 7,465,665
- Issue date Dec 16, 2008
- Applied Materials, Inc.
- Ming Xi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing tungsten layers employing atomic layer depos...
- Patent number 7,405,158
- Issue date Jul 29, 2008
- Applied Materials, Inc.
- Ken Kaung Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 7,384,867
- Issue date Jun 10, 2008
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing tungsten-containing layers by vapor depositio...
- Patent number 7,220,673
- Issue date May 22, 2007
- Applied Materials, Inc.
- Ming Xi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed nucleation deposition of tungsten layers
- Patent number 7,211,144
- Issue date May 1, 2007
- Applied Materials, Inc.
- Xinliang Lu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for depositing refractory metal layers employi...
- Patent number 7,101,795
- Issue date Sep 5, 2006
- Applied Materials, Inc.
- Ming Xi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus
- Patent number 7,085,616
- Issue date Aug 1, 2006
- Applied Materials, Inc.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of composite tungsten films
- Patent number 6,939,804
- Issue date Sep 6, 2005
- Applied Materials, Inc.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing refractory metal layers employing sequential...
- Patent number 6,797,340
- Issue date Sep 28, 2004
- Applied Materials, Inc.
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead with reduced contact area
- Patent number 6,461,435
- Issue date Oct 8, 2002
- Applied Materials, Inc.
- Karl A. Littau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for aligning and controlling edge deposition o...
- Patent number 6,328,808
- Issue date Dec 11, 2001
- Applied Materials, Inc.
- Kenneth Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Anti-notch thinning heater
- Patent number 6,210,483
- Issue date Apr 3, 2001
- Applied Materials, Inc.
- Ken Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for aligning and controlling edge deposition o...
- Patent number 6,186,092
- Issue date Feb 13, 2001
- Applied Materials, Inc.
- Kenneth Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS
- Publication number 20190088485
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Matthew Scott ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS
- Publication number 20140130739
- Publication date May 15, 2014
- Barry L. CHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS
- Publication number 20130040444
- Publication date Feb 14, 2013
- Applied Materials, Inc.
- MATTHEW S. ROGERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS
- Publication number 20120006265
- Publication date Jan 12, 2012
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS
- Publication number 20110111603
- Publication date May 12, 2011
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS
- Publication number 20100099270
- Publication date Apr 22, 2010
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...
- Publication number 20090156003
- Publication date Jun 18, 2009
- MING XI
- C30 - CRYSTAL GROWTH
Information Patent Application
PULSED DEPOSITION PROCESS FOR TUNGSTEN NUCLEATION
- Publication number 20080317954
- Publication date Dec 25, 2008
- XINLIANG LU
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS FOR DEPOSITING TUNGSTEN LAYERS EMPLOYING ATOMIC LAYER DEPOS...
- Publication number 20080280438
- Publication date Nov 13, 2008
- Ken Kaung Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FORMATION OF COMPOSITE TUNGSTEN FILMS
- Publication number 20080227291
- Publication date Sep 18, 2008
- KEN K. LAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...
- Publication number 20070218688
- Publication date Sep 20, 2007
- Ming Xi
- C30 - CRYSTAL GROWTH
Information Patent Application
Pulse nucleation enhanced nucleation technique for improved step co...
- Publication number 20070009658
- Publication date Jan 11, 2007
- Jong Hyun Yoo
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...
- Publication number 20060264031
- Publication date Nov 23, 2006
- Ming Xi
- C30 - CRYSTAL GROWTH
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS
- Publication number 20060223286
- Publication date Oct 5, 2006
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for depositing tungsten layers employing atomic layer depos...
- Publication number 20060040052
- Publication date Feb 23, 2006
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for depositing tungsten layers employing atomic layer depos...
- Publication number 20060009034
- Publication date Jan 12, 2006
- Ken Kaung Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of composite tungsten films
- Publication number 20050287807
- Publication date Dec 29, 2005
- APPLIED MATERIALS, INC.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing refractory metal layers employing sequential...
- Publication number 20040247788
- Publication date Dec 9, 2004
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for depositing refractory metal layers employi...
- Publication number 20040209465
- Publication date Oct 21, 2004
- APPLIED MATERIALS, INC.
- Ming Xi
- C30 - CRYSTAL GROWTH
Information Patent Application
Formation of composite tungsten films
- Publication number 20040014315
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Ken K. Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of titanium nitride films using a cyclical deposition pro...
- Publication number 20040013803
- Publication date Jan 22, 2004
- APPLIED MATERIALS, INC.
- Hua Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pulsed nucleation deposition of tungsten layers
- Publication number 20030127043
- Publication date Jul 10, 2003
- APPLIED MATERIALS, INC.
- Xinliang Lu
- C30 - CRYSTAL GROWTH
Information Patent Application
Deposition of tungsten for the formation of conformal tungsten sili...
- Publication number 20030123216
- Publication date Jul 3, 2003
- Hyungsuk A. Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for depositing refractory metal layers employing sequential...
- Publication number 20030104126
- Publication date Jun 5, 2003
- Hongbin Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Microwave heat shield for plasma chamber
- Publication number 20030066486
- Publication date Apr 10, 2003
- Applied Materials, Inc.
- Bo Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic layer deposition apparatus
- Publication number 20030023338
- Publication date Jan 30, 2003
- APPLIED MATERIALS, INC.
- Barry L. Chin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of reducing particle density in a cool down chamber
- Publication number 20030013312
- Publication date Jan 16, 2003
- Hougong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Ken Kaung Lai

Person

Patents Grantslast 30 patents

Method and apparatus for selective nitridation process

Atomic layer deposition apparatus

Atomic layer deposition apparatus

Atomic layer deposition apparatus

Atomic layer deposition apparatus

Methods for depositing tungsten layers employing atomic layer depos...

Method for depositing tungsten-containing layers by vapor depositio...

Pulsed deposition process for tungsten nucleation

Atomic layer deposition apparatus

Formation of composite tungsten films

Method for depositing tungsten-containing layers by vapor depositio...

Methods for depositing tungsten layers employing atomic layer depos...

Formation of composite tungsten films

Method for depositing tungsten-containing layers by vapor depositio...

Pulsed nucleation deposition of tungsten layers

Method and apparatus for depositing refractory metal layers employi...

Atomic layer deposition apparatus

Formation of composite tungsten films

Method for depositing refractory metal layers employing sequential...

Showerhead with reduced contact area

Apparatus and method for aligning and controlling edge deposition o...

Anti-notch thinning heater

Apparatus and method for aligning and controlling edge deposition o...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS

ATOMIC LAYER DEPOSITION APPARATUS

METHOD AND APPARATUS FOR SELECTIVE NITRIDATION PROCESS

ATOMIC LAYER DEPOSITION APPARATUS

ATOMIC LAYER DEPOSITION APPARATUS

ATOMIC LAYER DEPOSITION APPARATUS

METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...

PULSED DEPOSITION PROCESS FOR TUNGSTEN NUCLEATION

METHODS FOR DEPOSITING TUNGSTEN LAYERS EMPLOYING ATOMIC LAYER DEPOS...

FORMATION OF COMPOSITE TUNGSTEN FILMS

METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...

Pulse nucleation enhanced nucleation technique for improved step co...

METHOD FOR DEPOSITING TUNGSTEN-CONTAINING LAYERS BY VAPOR DEPOSITIO...

ATOMIC LAYER DEPOSITION APPARATUS

Methods for depositing tungsten layers employing atomic layer depos...

Methods for depositing tungsten layers employing atomic layer depos...

Formation of composite tungsten films

Method for depositing refractory metal layers employing sequential...

Method and apparatus for depositing refractory metal layers employi...

Formation of composite tungsten films

Formation of titanium nitride films using a cyclical deposition pro...

Pulsed nucleation deposition of tungsten layers

Deposition of tungsten for the formation of conformal tungsten sili...

Method for depositing refractory metal layers employing sequential...

Microwave heat shield for plasma chamber

Atomic layer deposition apparatus

Method of reducing particle density in a cool down chamber