Kunihiko Nishi

Person

Tokyo-to, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,937,390
- Issue date Jan 20, 2015
- PS4 Luxco S.A.R.L.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,704,352
- Issue date Apr 22, 2014
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number RE44148
- Issue date Apr 16, 2013
- Renesas Electronics Corporation
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number RE43444
- Issue date Jun 5, 2012
- Renesas Electronics Corporation
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number RE42972
- Issue date Nov 29, 2011
- Renesas Electronics Corporation
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device having an improved connected arrangement betwe...
- Patent number RE41721
- Issue date Sep 21, 2010
- Renesas Electronics Corporation
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number RE41722
- Issue date Sep 21, 2010
- Renesas Electronics Corp.
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device having an improved connection arrangement betw...
- Patent number RE41478
- Issue date Aug 10, 2010
- Renesas Electronics Corporation
- Atsushi Nakamura
- 257 - Active solid-state devices
Information Patent Grant
Method for manufacturing a three-dimensional semiconductor device a...
- Patent number 7,754,581
- Issue date Jul 13, 2010
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,678,706
- Issue date Mar 16, 2010
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor and laminated structure fabricated...
- Patent number 7,618,847
- Issue date Nov 17, 2009
- Elpida Memory, Inc.
- Hiroyuki Tenmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,541,667
- Issue date Jun 2, 2009
- Hitachi, Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,528,014
- Issue date May 5, 2009
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,420,284
- Issue date Sep 2, 2008
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,247,576
- Issue date Jul 24, 2007
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,091,620
- Issue date Aug 15, 2006
- Renesas Technology Corp.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 6,989,334
- Issue date Jan 24, 2006
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface package type semiconductor package and method of producing...
- Patent number 6,981,585
- Issue date Jan 3, 2006
- Renesas Technology Corp.
- Wahei Kitamura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,960,823
- Issue date Nov 1, 2005
- Renesas Technology Corp.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,943,456
- Issue date Sep 13, 2005
- Hitachi ULSI Systems Co., Ltd.
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,919,622
- Issue date Jul 19, 2005
- Renesas Technology Corp.
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device and its manufacturing method
- Patent number 6,867,123
- Issue date Mar 15, 2005
- Renesas Technology Corp.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the devices
- Patent number 6,861,294
- Issue date Mar 1, 2005
- Renesas Technology Corp.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,720,208
- Issue date Apr 13, 2004
- Renesas Technology Corporation
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic molded type semiconductor device and fabrication process th...
- Patent number 6,692,989
- Issue date Feb 17, 2004
- Renesas Technology Corporation
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device a ball grid array pa...
- Patent number 6,686,226
- Issue date Feb 3, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,670,215
- Issue date Dec 30, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ball grid array type semiconductor package
- Patent number 6,664,135
- Issue date Dec 16, 2003
- Renesas Technology Corporation
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,642,083
- Issue date Nov 4, 2003
- Hitachi, Ltd.
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20140183730
- Publication date Jul 3, 2014
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20100171213
- Publication date Jul 8, 2010
- Elpida Memory, Inc.
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090134498
- Publication date May 28, 2009
- Elpida Memory, Inc.
- Hiroaki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
- Publication number 20090109641
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...
- Publication number 20090072414
- Publication date Mar 19, 2009
- Hiroyuki TENMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...
- Publication number 20080164575
- Publication date Jul 10, 2008
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080136024
- Publication date Jun 12, 2008
- Elpida Memory, Inc.
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20070298545
- Publication date Dec 27, 2007
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060261494
- Publication date Nov 23, 2006
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060049499
- Publication date Mar 9, 2006
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050258524
- Publication date Nov 24, 2005
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing metthod thereof
- Publication number 20050212142
- Publication date Sep 29, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050200019
- Publication date Sep 15, 2005
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050196903
- Publication date Sep 8, 2005
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, its fabrication method and electronic device
- Publication number 20050167808
- Publication date Aug 4, 2005
- Masako Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20040159922
- Publication date Aug 19, 2004
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040155323
- Publication date Aug 12, 2004
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040061220
- Publication date Apr 1, 2004
- Chuichi Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of making the devices
- Publication number 20040063272
- Publication date Apr 1, 2004
- Hitachi, Ltd.
- Shigeharu Tsunoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and its manufacturing method
- Publication number 20040023450
- Publication date Feb 5, 2004
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20030207572
- Publication date Nov 6, 2003
- Miyaki Yoshinori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030127712
- Publication date Jul 10, 2003
- Gen Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plastic molded type semiconductor device and fabrication process th...
- Publication number 20030124770
- Publication date Jul 3, 2003
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20030057113
- Publication date Mar 27, 2003
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for mounting a thin semiconductor device
- Publication number 20030027376
- Publication date Feb 6, 2003
- Mitsuo Usami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, its fabrication method and electronic device
- Publication number 20030017652
- Publication date Jan 23, 2003
- Masako Sakaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020179460
- Publication date Dec 5, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface package type semiconductor package and method of producing...
- Publication number 20020174627
- Publication date Nov 28, 2002
- Wahei Kitamura
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020146864
- Publication date Oct 10, 2002
- Yoshinori Miyaki
- H01 - BASIC ELECTRIC ELEMENTS

Kunihiko Nishi

Person

Patents Grantslast 30 patents

Semiconductor device having a liquid cooling module

Semiconductor device having a liquid cooling module

Semiconductor device having an improved connection arrangement betw...

Wafer of circuit board and joining structure of wafer or circuit board

Semiconductor device having an improved connection arrangement betw...

Semiconductor device having an improved connection arrangement betw...

Semiconductor device having an improved connected arrangement betwe...

Semiconductor device having an improved connection arrangement betw...

Semiconductor device having an improved connection arrangement betw...

Method for manufacturing a three-dimensional semiconductor device a...

Method of manufacturing a semiconductor device

Bonding method of semiconductor and laminated structure fabricated...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Manufacturing method of a semiconductor device

Surface package type semiconductor package and method of producing...

Semiconductor device and method of manufacturing the same

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device

Semiconductor integrated circuit device and its manufacturing method

Semiconductor devices and methods of making the devices

Semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Method of manufacturing a semiconductor device a ball grid array pa...

Semiconductor device and manufacturing method thereof

Method of manufacturing a ball grid array type semiconductor package

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

SEMICONDUCTOR APPARATUS

Wafer of circuit board and joining structure of wafer or circuit board

BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...

METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing metthod thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device, its fabrication method and electronic device

Plastic molded type semiconductor device and fabrication process th...

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor devices and methods of making the devices

Semiconductor integrated circuit device and its manufacturing method

Semiconductor device and its manufacturing method

Semiconductor device

Plastic molded type semiconductor device and fabrication process th...

Surface package type semiconductor package and method of producing...

Method for mounting a thin semiconductor device

Semiconductor device, its fabrication method and electronic device

Surface package type semiconductor package and method of producing...

Surface package type semiconductor package and method of producing...

Semiconductor device and method of manufacturing the same