Marc Robinson

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 9,824,999
- Issue date Nov 21, 2017
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 9,305,862
- Issue date Apr 5, 2016
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 9,252,116
- Issue date Feb 2, 2016
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly having stacked die mounted on substrate
- Patent number 8,729,690
- Issue date May 20, 2014
- Invensas Corporation
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,723,332
- Issue date May 13, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die mount by conformal die coating
- Patent number 8,704,379
- Issue date Apr 22, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically interconnected stacked die assemblies
- Patent number 8,629,543
- Issue date Jan 14, 2014
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly having stacked die mounted on substrate
- Patent number 8,357,999
- Issue date Jan 22, 2013
- Vertical Circuits (Assignment for the Benefit of Creditors), LLC
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 8,178,978
- Issue date May 15, 2012
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional six surface conformal die coating
- Patent number 7,705,432
- Issue date Apr 27, 2010
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die assembly having electrical interconnect
- Patent number 7,535,109
- Issue date May 19, 2009
- Vertical Circuits, Inc.
- Marc E. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropede stacked die component assembly
- Patent number 7,245,021
- Issue date Jul 17, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die BGA or LGA component assembly
- Patent number 7,215,018
- Issue date May 8, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive epoxy flip-chip on chip
- Patent number 6,271,598
- Issue date Aug 7, 2001
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming conductive epoxy flip-chip on chip
- Patent number 6,098,278
- Issue date Aug 8, 2000
- Cubic Memory, Inc.
- Alfons Vindasius
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY
- Publication number 20160218088
- Publication date Jul 28, 2016
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20160104689
- Publication date Apr 14, 2016
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20140213020
- Publication date Jul 31, 2014
- Invensas Corporation
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE
- Publication number 20130207249
- Publication date Aug 15, 2013
- Invensas Corporation
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support mounted electrically interconnected die assembly
- Publication number 20130099392
- Publication date Apr 25, 2013
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Interconnected Stacked Die Assemblies
- Publication number 20110037159
- Publication date Feb 17, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor
- Publication number 20100117224
- Publication date May 13, 2010
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor
- Publication number 20100052087
- Publication date Mar 4, 2010
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Mounted Electrically Interconnected Die Assembly
- Publication number 20090230528
- Publication date Sep 17, 2009
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE STACKED DIE PACKAGE
- Publication number 20090102038
- Publication date Apr 23, 2009
- Vertical Circuits, Inc.
- SIMON J.S. MCELREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING
- Publication number 20090065916
- Publication date Mar 12, 2009
- VERTICAL CIRCUITS, INC.
- Scott Jay Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES
- Publication number 20080303131
- Publication date Dec 11, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Six Surface Conformal Die Coating
- Publication number 20070290377
- Publication date Dec 20, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Having Stacked Die Mounted On Substrate
- Publication number 20070284716
- Publication date Dec 13, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Assembly Having Electrical Interconnect
- Publication number 20070252262
- Publication date Nov 1, 2007
- Vertical Circuits, Inc.
- Marc Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micropede stacked die component assembly
- Publication number 20050258530
- Publication date Nov 24, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die BGA or LGA component assembly
- Publication number 20050230802
- Publication date Oct 20, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional six surface conformal die coating
- Publication number 20050224952
- Publication date Oct 13, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS

Marc Robinson

Person

Patents Grantslast 30 patents

Semiconductor die mount by conformal die coating

Support mounted electrically interconnected die assembly

Semiconductor die mount by conformal die coating

Assembly having stacked die mounted on substrate

Electrically interconnected stacked die assemblies

Semiconductor die mount by conformal die coating

Electrically interconnected stacked die assemblies

Assembly having stacked die mounted on substrate

Support mounted electrically interconnected die assembly

Three dimensional six surface conformal die coating

Die assembly having electrical interconnect

Micropede stacked die component assembly

Stacked die BGA or LGA component assembly

Conductive epoxy flip-chip on chip

Method for forming conductive epoxy flip-chip on chip

Patents Applicationslast 30 patents

SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE

Support mounted electrically interconnected die assembly

Electrically Interconnected Stacked Die Assemblies

Sensor

Image Sensor

Support Mounted Electrically Interconnected Die Assembly

CHIP SCALE STACKED DIE PACKAGE

SEMICONDUCTOR DIE MOUNT BY CONFORMAL DIE COATING

ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES

Three Dimensional Six Surface Conformal Die Coating

Assembly Having Stacked Die Mounted On Substrate

Die Assembly Having Electrical Interconnect

Micropede stacked die component assembly

Stacked die BGA or LGA component assembly

Three dimensional six surface conformal die coating