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Bondhead lead clamp apparatus
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Patent number 6,845,898
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Issue date Jan 25, 2005
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Micron Technology, Inc.
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Michael B. Ball
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Lead penetrating clamping system
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Patent number 6,732,902
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Issue date May 11, 2004
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Micron Technology, Inc.
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Michael B. Ball
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Bondhead lead clamp apparatus
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Patent number 6,662,993
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Issue date Dec 16, 2003
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Micron Technology, Inc.
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Michael B. Ball
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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