Claims
- 1. A wire bonding method for a lead finger of a lead frame used in a wire bonding apparatus comprising:
supporting a portion of a lead finger of a lead frame in said wire bonding apparatus; contacting a portion of said lead finger with a penetrating portion of a penetrating clamp for deforming a portion of said lead finger of said lead frame for retaining said lead finger; providing a bonding apparatus to bond a portion of a wire to said lead finger; actuating said bonding apparatus to bond said portion of said wire to said lead finger; and removing at least a portion of said penetrating portion of said penetrating clamp from contact with said portion of said lead finger before removal of said bonding apparatus from said lead finger.
- 2. The method of claim 1, wherein said penetrating clamp is resiliently mounted.
- 3. The method of claim 1, wherein said penetrating clamp is movable in an x-axis direction, a y-axis direction, and a z-axis direction.
- 4. The method of claim 1, wherein said penetrating clamp is located on one portion of said lead finger and said bonding apparatus is located on another portion of said lead finger.
- 5. A method for making a semiconductor device having at least one bond pad and lead frame having at least one lead finger using a wire bonding apparatus comprising:
supporting a portion of said lead finger in said wire bonding apparatus; contacting a portion of said at least one lead finger with a portion of a first clamp for temporarily retaining said at least one lead finger in position for connecting a conductor thereto; contacting another portion of said at least one lead finger with a portion of a penetrating clamp for retaining said at least one lead finger in position for connecting said conductor thereto, said portion of said penetrating clamp deforming a portion of said at least one lead finger of said lead frame; providing a bonding apparatus to connect said conductor to said at least one lead finger; actuating said bonding apparatus to connect said conductor to said at least one lead finger; and removing at least a portion of said penetrating clamp from engagement with said portion of said at least one lead finger before removal of said bonding apparatus from said at least one lead finger.
- 6. The method of claim 5, wherein said penetrating clamp is resiliently mounted.
- 7. The method of claim 5, wherein said penetrating clamp is movable in an x-axis direction, a y-axis direction, and a z-axis direction.
- 8. The method of claim 5, wherein said penetrating clamp is located on a portion of said at least one lead finger and said bonding apparatus is located on another portion of said at least one lead finger.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 10/091,688, filed Mar. 5, 2002, now U.S. Pat. No. 6,604,670, issued Aug. 12, 2003, which is a continuation of application Ser. No. 09/797,380, filed Mar. 1, 2001, now U.S. Pat. No. 6,419,145, issued Jul. 16, 2002, which is a continuation of application Ser. No. 09/421,170, filed Oct. 19, 1999, now U.S. Pat. No. 6,206,274, issued Mar. 27, 2001, which is a continuation of application Ser. No. 08/909,230, filed Aug. 11, 1997, now U.S. Pat. No. 6,047,877, issued Apr. 11, 2000, which is a continuation of application Ser. No. 08/631,143, filed Jun. 17, 1996, now U.S. Pat. No. 5,673,845, issued Oct. 7, 1997.
[0002] This application is related to Ser. No. 08/597,616, filed Feb. 6, 1996, now U.S. Pat. No. 5,647,528, issued Jul. 15, 1997, entitled “BONDHEAD LEAD CLAMP APPARATUS AND METHOD” and assigned to Micron Technology, Inc. and is also related to Ser. No. 08/592,058, filed Jan. 26, 1996, now U.S. Pat. No. 5,954,842, issued Sep. 21, 1999, entitled “LEADFINGER CLAMP ASSEMBLY AND METHOD OF STABILIZING LEAD FRAME ELEMENTS” and assigned to Micron Technology, Inc.
Continuations (5)
|
Number |
Date |
Country |
Parent |
10091688 |
Mar 2002 |
US |
Child |
10635843 |
Aug 2003 |
US |
Parent |
09797380 |
Mar 2001 |
US |
Child |
10091688 |
Mar 2002 |
US |
Parent |
09421170 |
Oct 1999 |
US |
Child |
09797380 |
Mar 2001 |
US |
Parent |
08909230 |
Aug 1997 |
US |
Child |
09421170 |
Oct 1999 |
US |
Parent |
08631143 |
Jun 1996 |
US |
Child |
08909230 |
Aug 1997 |
US |