Claims
- 1. Apparatus for increase stability for lead fingers of a lead frame during a wire bonding operation comprising:
a clamp for engaging said portion of each lead finger of a lead frame during a wire bonding operation of at least one lead finger of a lead frame for connecting a bond pad of a semiconductor die to said portion of said lead finger using a piece of wire, the clamp having a portion thereof for penetrating said portion of said lead finger for immobilizing said portion of said lead finger.
- 2. The apparatus of claim 1, wherein the clamp comprises:
an independent clamp having an ability to move independently in x-axis, y-axis and z-axis directions.
- 3. The apparatus of claim 1, wherein the clamp is moveable independently in any direction of movement of the apparatus.
- 4. The apparatus of claim 1, wherein the clamp comprises:
a fixed clamp for engaging said portion of said lead finger of said lead frame.
- 5. The apparatus of claim 1, wherein said apparatus exerts a force of substantially 50 to 100 grams for contacting said portion of said lead finger.
- 6. The apparatus of claim 1, further comprising:
heating apparatus located beneath said semiconductor die.
- 7. The apparatus of claim 6, further comprising:
heating apparatus located beneath said lead finger.
- 8. The apparatus of claim 6, wherein the heating apparatus operates at substantially at least 200 degrees Centigrade to heat said semiconductor die.
- 9. The apparatus of claim 6, wherein said semiconductor die is heated before being connected to said lead finger.
- 10. The apparatus of claim 1, wherein the clamp is resiliently mounted with respect to said lead finger of said lead frame.
- 11. The apparatus of claim 10, wherein the clamp is resiliently mounted through use of a spring engaging a portion of the clamp.
- 12. The apparatus of claim 1, wherein the clamp has an end portion thereof including an edge.
- 13. The apparatus of claim 1, wherein the clamp includes an end portion thereof having a substantially semicircular shape.
- 14. The apparatus of claim 1, wherein the clamp includes an end portion thereof having a substantially arcuate shape.
- 15. The apparatus of claim 1, wherein the clamp includes a substantially articulated end portion thereof for movement for contacting said portion of said lead finger.
- 16. The apparatus of claim 1, wherein the clamp includes a portion for penetrating a portion of a thickness of a soft metal coating located on said lead finger.
- 17. The apparatus of claim 1, wherein the clamp includes a point on an end thereof.
- 18. The apparatus of claim 1, further including:
a fixed clamp for engaging another portion of said lead finger.
- 19. The apparatus of claim 1, wherein the clamp includes a sharp edge thereon.
- 20. The apparatus of claim 1, wherein the clamp includes a rounded portion on a bottom thereof.
- 21. The apparatus of claim 1, wherein the clamp includes a plurality of rounded portions on a bottom thereof.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 09/876,806, filed Jun. 7, 2001, pending, which is a continuation of application Ser. No. 09/419,851, filed Oct. 19, 1999, now U.S. Pat. No. 6,305,593, issued Oct. 23, 2001, which is a divisional of application Ser. No. 08/909,230, filed Aug. 11, 1997, now U.S. Pat. No. 6,047,877, issued Apr. 11, 2000, which is a continuation of application Ser. No. 08/631,143, filed Jun. 17, 1996, now U.S. Pat. No. 5,673,845, issued Oct. 7, 1997.
Divisions (1)
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Number |
Date |
Country |
Parent |
08909230 |
Aug 1997 |
US |
Child |
09419851 |
Oct 1999 |
US |
Continuations (3)
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Number |
Date |
Country |
Parent |
09876806 |
Jun 2001 |
US |
Child |
10213019 |
Aug 2002 |
US |
Parent |
09419851 |
Oct 1999 |
US |
Child |
09876806 |
Jun 2001 |
US |
Parent |
08631143 |
Jun 1996 |
US |
Child |
08909230 |
Aug 1997 |
US |