Claims
- 1. Apparatus for supporting at least one lead finger of at least one lead frame for a wire bonding process connecting said at least one lead finger to a semiconductor device comprising:
at least one support for positioning below said at least one lead finger for said wire bonding process, a surface of said at least one support for contacting a bearing surface and for moving on a portion thereof, said at least one support including a portion for positioning at a location between said lead finger and said semiconductor device, the portion of said at least one support contacting a lower surface of said at least one lead finger located above the semiconductor device without providing support therefore; and a heating apparatus for heating at least said semiconductor device.
- 2. The apparatus of claim 1, wherein said heating apparatus includes a heating apparatus for heating said bearing surface.
- 3. The apparatus of claim 1, wherein said at least one support includes a portion for supporting more than at least one lead finger.
- 4. The apparatus of claim 3, wherein said portion comprises a portion for positioning adjacent a semiconductor device.
- 5. The apparatus of claim 3, wherein said portion comprises a portion for positioning adjacent a semiconductor device for exerting a force of a bonding apparatus to substantially apply the force against said portion.
- 6. The apparatus of claim 3, wherein said portion comprises a portion for substantially preventing an application of force on a die by a bonding apparatus.
- 7. The apparatus of claim 3, wherein said portion comprises a portion for resisting a force of substantially 50 to 100 grams.
- 8. The apparatus of claim 3, wherein said portion comprises a portion for positioning between said at least one lead finger and said semiconductor device.
- 9. The apparatus of claim 1, wherein said at least one support includes a plurality of portions for supporting more than an individual lead finger of said lead frame.
- 10. The apparatus of claim 1, further comprising an apparatus for moving said at least one support on said bearing surface.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 09/840,289, filed Apr. 23, 2001, pending; which is a continuation of application Ser. No. 09/358,248, filed Jul. 21, 1999, now U.S. Pat. No. 6,227,431, issued May 8, 2001; which is a divisional of application Ser. No. 09/244,702, filed Feb. 4, 1999, now U.S. Pat. No. 6,299,057, issued Oct. 9, 2001; which is a continuation of application Ser. No. 08/709,639, filed Sep. 9, 1996, now U.S. Pat. No. 5,890,644, issued Apr. 6, 1999; which is a continuation-in-part of application Ser. No. 08/631,143, filed Jun. 17, 1996, now U.S. Pat. No. 5,673,845, issued Oct. 7, 1997; application Ser. No. 08/597,616, filed Feb. 6, 1996, now U.S. Pat. No. 5,647,528, issued Jul. 15, 1997; and application Ser. No. 08/592,058, filed Jan. 26, 1996, now U.S. Pat. No. 5,954,842, issued Sep. 21, 1999.
Divisions (1)
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Number |
Date |
Country |
Parent |
09244702 |
Feb 1999 |
US |
Child |
09358248 |
Jul 1999 |
US |
Continuations (3)
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Number |
Date |
Country |
Parent |
09840289 |
Apr 2001 |
US |
Child |
10639121 |
Aug 2003 |
US |
Parent |
09358248 |
Jul 1999 |
US |
Child |
09840289 |
Apr 2001 |
US |
Parent |
08709639 |
Sep 1996 |
US |
Child |
09244702 |
Feb 1999 |
US |
Continuation in Parts (3)
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Number |
Date |
Country |
Parent |
08631143 |
Jun 1996 |
US |
Child |
08709639 |
Sep 1996 |
US |
Parent |
08597616 |
Feb 1996 |
US |
Child |
08709639 |
Sep 1996 |
US |
Parent |
08592058 |
Jan 1996 |
US |
Child |
08709639 |
Sep 1996 |
US |