Ross W. Keesler

Person

Owego, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photoresist composition with antibacterial agent
- Patent number 7,635,552
- Issue date Dec 22, 2009
- Endicott Interconnect Technologies, Inc.
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit card
- Patent number 7,353,590
- Issue date Apr 8, 2008
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vents with signal image for signal return path
- Patent number 7,351,917
- Issue date Apr 1, 2008
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a plated microvia interconnect
- Patent number 7,328,506
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 7,240,430
- Issue date Jul 10, 2007
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit card
- Patent number 6,986,198
- Issue date Jan 17, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vents with signal image for signal return path
- Patent number 6,977,345
- Issue date Dec 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,902,869
- Issue date Jun 7, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited photoresist and dry film photoresist photolithogra...
- Patent number 6,887,651
- Issue date May 3, 2005
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a through hole in a photoimageable dielectric structure
- Patent number 6,830,875
- Issue date Dec 14, 2004
- International Business Machines Corporation
- Stephen J. Fuerniss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,750,405
- Issue date Jun 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a circuitized structure
- Patent number 6,739,048
- Issue date May 25, 2004
- International Business Machines Corporation
- Gerald Walter Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing methods for printed circuit boards
- Patent number 6,684,497
- Issue date Feb 3, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density design for organic chip carriers
- Patent number 6,538,213
- Issue date Mar 25, 2003
- International Business Machines Corporation
- Timothy F. Carden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through hole in a photoimageable dielectric structure with wired an...
- Patent number 6,521,844
- Issue date Feb 18, 2003
- International Business Machines Corporation
- Stephen J. Fuerniss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate having plated microvia interconnects and method for formin...
- Patent number 6,492,600
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite laminate circuit structure and method of forming the same
- Patent number 6,451,509
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with continuous connective bumps
- Patent number 6,222,136
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two signal one power plane circuit board
- Patent number 6,204,453
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite laminate circuit structure and method of forming the same
- Patent number 6,175,087
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated manufacturing packaging process
- Patent number 6,131,279
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tenting PTH's with PID dry film
- Patent number 6,027,858
- Issue date Feb 22, 2000
- International Business Machines Corporation
- Gerald Walter Jones
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH
- Publication number 20080127485
- Publication date Jun 5, 2008
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoresist composition with antibacterial agent
- Publication number 20080026316
- Publication date Jan 31, 2008
- Endicott Interconnect Technologies, Inc.
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT
- Publication number 20080017410
- Publication date Jan 24, 2008
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vents with signal image for signal return path
- Publication number 20060108142
- Publication date May 25, 2006
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming printed circuit card
- Publication number 20060005383
- Publication date Jan 12, 2006
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20050124096
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two signal one power plane circuit board
- Publication number 20040134685
- Publication date Jul 15, 2004
- International Business Machines Corporation
- Kenneth Fallon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrodeposited photoresist and dry film photoresist photolithogra...
- Publication number 20040101783
- Publication date May 27, 2004
- International Business Machines Corporation
- Ashwinkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20040091821
- Publication date May 13, 2004
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vents with signal image for signal return path
- Publication number 20030127249
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminate having plated microvia interconnects and method for formin...
- Publication number 20030102158
- Publication date Jun 5, 2003
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming a through hole in a photoimageable dielectric structure
- Publication number 20030047357
- Publication date Mar 13, 2003
- Stephen J. Fuerniss
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PROCESS OF FABRICATING A CIRCUITZED STRUCTURE
- Publication number 20020078562
- Publication date Jun 27, 2002
- Gerald Walter Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing methods for printed circuit boards
- Publication number 20010032828
- Publication date Oct 25, 2001
- International Business Machines Corporation
- Bernd Karl-Heinz Appelt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Composite laminate circuit structure and method of forming the same
- Publication number 20010023044
- Publication date Sep 20, 2001
- Ross W. Keesler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ross W. Keesler

Person

Patents Grantslast 30 patents

Photoresist composition with antibacterial agent

Method of forming printed circuit card

Vents with signal image for signal return path

Method for forming a plated microvia interconnect

Manufacturing methods for printed circuit boards

Method of forming printed circuit card

Vents with signal image for signal return path

Manufacturing methods for printed circuit boards

Electrodeposited photoresist and dry film photoresist photolithogra...

Forming a through hole in a photoimageable dielectric structure

Two signal one power plane circuit board

Process of fabricating a circuitized structure

Manufacturing methods for printed circuit boards

High density design for organic chip carriers

Through hole in a photoimageable dielectric structure with wired an...

Laminate having plated microvia interconnects and method for formin...

Composite laminate circuit structure and method of forming the same

Printed circuit board with continuous connective bumps

Two signal one power plane circuit board

Composite laminate circuit structure and method of forming the same

Integrated manufacturing packaging process

Process for tenting PTH's with PID dry film

Patents Applicationslast 30 patents

VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH

Photoresist composition with antibacterial agent

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Vents with signal image for signal return path

Method of forming printed circuit card

Manufacturing methods for printed circuit boards

Two signal one power plane circuit board

Electrodeposited photoresist and dry film photoresist photolithogra...

Manufacturing methods for printed circuit boards

Vents with signal image for signal return path

Laminate having plated microvia interconnects and method for formin...

Forming a through hole in a photoimageable dielectric structure

PROCESS OF FABRICATING A CIRCUITZED STRUCTURE

Manufacturing methods for printed circuit boards

Composite laminate circuit structure and method of forming the same