Claims
- 1. A method of forming a composite laminate structure comprising the steps of:providing first and second circuit board elements, each having city on at least one face thereof and plated through holes, providing a voltage plane element having at least one voltage plane having opposite faces with a layer of partially cured photopatternable dielectric material on each face thereof, photopatterning and etching at least one hole through said voltage plane element and at least one through each layer of photopatternable dielectric material terminating at said voltage plane, thereafter aligning each through hole and each opening in said voltage plane element with a plated through hole in at least one of said circuit board elements to provide surface on said voltage plane element communicating with said plated through holes and with said at least one face of each of said circuit board elements being oriented away from said voltage plane element, thereafter laminating said voltage plane element between said circuit board elements and fully curing said photopatternable dielectric material of said voltage plane element, and thereafter plating the surfaces on said voltage plane element communicating with said plated trough holes in said circuit board elements and said plated through holes in said circuit hoard elements.
- 2. The invention as defined in claims 1 wherein said circuit board elements are formed at least a part from fully cured photoimageable material.
- 3. The invention as defined in claim 1 wherein there is circuitry on each face of said circuit board elements.
- 4. The invention as defined in claim 1 wherein said surfaces are plated using photolithographic technique.
- 5. The invention as defined in claim 1 wherein the plating is copper plating.
- 6. The invention as defined in claim 1 wherein said voltage plane element has a single voltage plane.
- 7. The invention as defined in claim 1 wherein each circuit board element has at least one voltage plane.
- 8. The invention as defined in claim 7 wherein each circuit board element has plated through holes extending through said at least one voltage plane.
- 9. The invention as defined in claim 1 wherein at least one circuit board element has a plurality of voltage planes.
- 10. The invention as defined in claim 1 wherein said photopatterned dielectric material is an epoxy.
Parent Case Info
This application is a divisional of application Ser. No. 09/204,458, filed Dec. 2, 1998 now U.S. Pat. No. 6,175,087.
US Referenced Citations (29)