Ruey Kae ZANG

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) module comprising an integrated circuit (IC...
- Patent number 10,321,575
- Issue date Jun 11, 2019
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered power structure in a power distribution network (PDN)
- Patent number 10,231,324
- Issue date Mar 12, 2019
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor module structure
- Patent number 9,041,176
- Issue date May 26, 2015
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly systems and methods using DAM and tr...
- Patent number 8,952,552
- Issue date Feb 10, 2015
- QUALCOMM Incorporated
- Ruey Kae Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to optimize and reduce integrated circuit, package design, a...
- Patent number 8,890,143
- Issue date Nov 18, 2014
- QUALCOMM Incorporated
- Ryan D. Lane
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20190043817
- Publication date Feb 7, 2019
- QUALCOMM Incorporated
- Manoj KADADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID BASED MULTI SIZE PAD PACKAGE
- Publication number 20180053740
- Publication date Feb 22, 2018
- QUALCOMM Incorporated
- Manoj KAKADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...
- Publication number 20170373032
- Publication date Dec 28, 2017
- QUALCOMM Incorporated
- Jihoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING DIE TECHNOLOGY
- Publication number 20170084594
- Publication date Mar 23, 2017
- QUALCOMM Incorporated
- Jongchil NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...
- Publication number 20170064837
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED CURRENT DISTRIBUTION STRUCTURE FOR LARGE CURRENT DELIVERY
- Publication number 20150364438
- Publication date Dec 17, 2015
- QUALCOMM Incorporated
- Haiyong XU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)
- Publication number 20150313006
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Ryan David Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20150228594
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR MODULE STRUCTURE
- Publication number 20140097512
- Publication date Apr 10, 2014
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Optimize and Reduce Integrated Circuit, Package Design, a...
- Publication number 20120068175
- Publication date Mar 22, 2012
- QUALCOMM Incorporated
- Ryan D. Lane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package Assembly Systems and Methods using DAM and Tr...
- Publication number 20110115083
- Publication date May 19, 2011
- QUALCOMM Incorporated
- Ruey Kae Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Floating Metal Elements in a Package Substrate
- Publication number 20100270061
- Publication date Oct 28, 2010
- QUALCOMM Incorporated
- Jack M. Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Floating Metal Elements in a Package Substrate
- Publication number 20100263914
- Publication date Oct 21, 2010
- QUALCOMM Incorporated
- Jack M. Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ruey Kae ZANG

Person

Patents Grantslast 30 patents

Integrated circuit (IC) module comprising an integrated circuit (IC...

Staggered power structure in a power distribution network (PDN)

Hybrid semiconductor module structure

Semiconductor package assembly systems and methods using DAM and tr...

Method to optimize and reduce integrated circuit, package design, a...

Patents Applicationslast 30 patents

LAND GRID BASED MULTI SIZE PAD PACKAGE

LAND GRID BASED MULTI SIZE PAD PACKAGE

REDISTRIBUTION LAYER (RDL) FAN-OUT WAFER LEVEL PACKAGING (FOWLP) ST...

EMBEDDING DIE TECHNOLOGY

INTEGRATED CIRCUIT (IC) MODULE COMPRISING AN INTEGRATED CIRCUIT (IC...

BALANCED CURRENT DISTRIBUTION STRUCTURE FOR LARGE CURRENT DELIVERY

STAGGERED POWER STRUCTURE IN A POWER DISTRIBUTION NETWORK (PDN)

VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

HYBRID SEMICONDUCTOR MODULE STRUCTURE

Method to Optimize and Reduce Integrated Circuit, Package Design, a...

Semiconductor Package Assembly Systems and Methods using DAM and Tr...

Floating Metal Elements in a Package Substrate

Floating Metal Elements in a Package Substrate