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Sean T. Crowley
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Phoenix, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Micro-optical device packaging system
Patent number
8,445,984
Issue date
May 21, 2013
Texas Instruments Incorporated
Bradley Morgan Haskett
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Near chip size semiconductor package
Patent number
8,154,111
Issue date
Apr 10, 2012
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-optical device packaging system
Patent number
7,936,033
Issue date
May 3, 2011
Texas Instruments Incorporated
Bradley Morgan Haskett
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Stackable semiconductor package and method for manufacturing same
Patent number
7,045,396
Issue date
May 16, 2006
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor package with strap
Patent number
6,873,041
Issue date
Mar 29, 2005
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Making two lead surface mounting high power microleadframe semicond...
Patent number
6,756,658
Issue date
Jun 29, 2004
Amkor Technology, Inc.
Blake A. Gillett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated semiconductor package including chip paddle and leads
Patent number
6,753,597
Issue date
Jun 22, 2004
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including metal strap electrically coupled bet...
Patent number
6,707,138
Issue date
Mar 16, 2004
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Near chip size semiconductor package
Patent number
6,639,308
Issue date
Oct 28, 2003
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor package with strap
Patent number
6,630,726
Issue date
Oct 7, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable semiconductor package and method for manufacturing same
Patent number
6,605,866
Issue date
Aug 12, 2003
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging high power integrated circuit devices
Patent number
6,521,982
Issue date
Feb 18, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Attaching semiconductor dies to substrates with conductive straps
Patent number
6,459,147
Issue date
Oct 1, 2002
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low profile package for plural semiconductor dies
Patent number
6,452,278
Issue date
Sep 17, 2002
Amkor Technology, Inc.
Vincent DiCaprio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having multiple dies with independently biase...
Patent number
6,396,130
Issue date
May 28, 2002
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device package and leadframe
Patent number
6,339,252
Issue date
Jan 15, 2002
Amkor Technology, Inc.
Eulogia A. Niones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of molding plastic semiconductor packages
Patent number
6,309,916
Issue date
Oct 30, 2001
Amkor Technology, Inc.
Sean T. Crowley
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Electronic device package and leadframe and method for making the p...
Patent number
6,258,629
Issue date
Jul 10, 2001
Amkor Technology, Inc.
Eulogia A. Niones
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin leadframe-type semiconductor package having heat sink with rec...
Patent number
6,198,163
Issue date
Mar 6, 2001
Amkor Technology, Inc.
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Micro-Optical Device Packaging System
Publication number
20110204464
Publication date
Aug 25, 2011
TEXAS INSTRUMENTS INCORPORATED
Bradley Morgan Haskett
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Micro-Optical Device Packaging System
Publication number
20100164081
Publication date
Jul 1, 2010
TEXAS INSTRUMENTS INCORPORATED
Bradley Morgan Haskett
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Thin integrated circuit device packages for improved radio frequenc...
Publication number
20070176287
Publication date
Aug 2, 2007
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Near chip size semiconductor package
Publication number
20040056338
Publication date
Mar 25, 2004
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stackable semiconductor package and method for manufacturing same
Publication number
20030197290
Publication date
Oct 23, 2003
Sean Timothy Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging high power integrated circuit devices
Publication number
20030075785
Publication date
Apr 24, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Attaching semiconductor dies to substrates with conductive straps
Publication number
20020125562
Publication date
Sep 12, 2002
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS