Sitaram Arkalgud

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,113,056
- Issue date Oct 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,837,596
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 11,658,173
- Issue date May 23, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective elements for bonded structures including an obstructive...
- Patent number 11,610,846
- Issue date Mar 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 11,205,600
- Issue date Dec 21, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 11,056,390
- Issue date Jul 6, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,210
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 10,879,226
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HD color imaging using monochromatic CMOS image sensors integrated...
- Patent number 10,623,710
- Issue date Apr 14, 2020
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,546,832
- Issue date Jan 28, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 10,535,564
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,522,499
- Issue date Dec 31, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,522,457
- Issue date Dec 31, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 10,446,456
- Issue date Oct 15, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers with electrically conductive features having different...
- Patent number 10,440,822
- Issue date Oct 8, 2019
- Invensas Corporation
- Bong-Sub Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and method for integrated circuits packaging with increas...
- Patent number 10,381,326
- Issue date Aug 13, 2019
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost substrates
- Patent number 10,283,484
- Issue date May 7, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 10,256,177
- Issue date Apr 9, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 10,204,893
- Issue date Feb 12, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,177,086
- Issue date Jan 8, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HD color imaging using monochromatic CMOS image sensors integrated...
- Patent number 10,178,363
- Issue date Jan 8, 2019
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,032,751
- Issue date Jul 24, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,002,844
- Issue date Jun 19, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20240145458
- Publication date May 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20230317628
- Publication date Oct 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20230131849
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20230130580
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20210183847
- Publication date Jun 17, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20200395321
- Publication date Dec 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
- Publication number 20200328162
- Publication date Oct 15, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20200144217
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES AND METHODS FOR RELIABLE PACKAGES
- Publication number 20200126861
- Publication date Apr 23, 2020
- Invensas Corporation
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20200126945
- Publication date Apr 23, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20200043817
- Publication date Feb 6, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20190198435
- Publication date Jun 27, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20190189607
- Publication date Jun 20, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20190157199
- Publication date May 23, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20190115323
- Publication date Apr 18, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HD COLOR IMAGING USING MONOCHROMATIC CMOS IMAGE SENSORS INTEGRATED...
- Publication number 20190098271
- Publication date Mar 28, 2019
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ultrathin Layer for Forming a Capacitive Interface Between Joined I...
- Publication number 20180366446
- Publication date Dec 20, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20180337157
- Publication date Nov 22, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20180233447
- Publication date Aug 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20180226375
- Publication date Aug 9, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20180174995
- Publication date Jun 21, 2018
- INVENSAS BONDING TECHNOLOGIES INC.
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20180130717
- Publication date May 10, 2018
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposers And Fabrication Methods That Use Nanoparticle Inks And...
- Publication number 20170374738
- Publication date Dec 28, 2017
- Invensas Corporation
- Bong-Sub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20170338214
- Publication date Nov 23, 2017
- ZIPTRONIX, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20170317019
- Publication date Nov 2, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and Methods for Reliable Packages
- Publication number 20170309518
- Publication date Oct 26, 2017
- Invensas Corporation
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS

Sitaram Arkalgud

Person

Patents Grantslast 30 patents

Stacked dies and methods for forming bonded structures

Bonded structures

Stacked dies and methods for forming bonded structures

Bonded structures

Stacked dies and methods for forming bonded structures

Protective elements for bonded structures including an obstructive...

Capacitive coupling in a direct-bonded interface for microelectroni...

Integrated interposer solutions for 2D and 3D IC packaging

Integrated circuits protected by substrates with cavities, and meth...

Structures and methods for reliable packages

Bonded structures

Stacked dies and methods for forming bonded structures

Bonded structures

Capacitive coupling in a direct-bonded interface for microelectroni...

HD color imaging using monochromatic CMOS image sensors integrated...

Ultrathin layer for forming a capacitive interface between joined i...

Bonded structures

Structures and methods for reliable packages

Bonded structures

Microelectronic components with features wrapping around protrusion...

Integrated circuits protected by substrates with cavities, and meth...

Interposers with electrically conductive features having different...

Structure and method for integrated circuits packaging with increas...

Low cost substrates

Integrated interposer solutions for 2D and 3D IC packaging

Stacked dies and methods for forming bonded structures

Microelectronic components with features wrapping around protrusion...

HD color imaging using monochromatic CMOS image sensors integrated...

Ultrathin layer for forming a capacitive interface between joined i...

Bonded structures

Patents Applicationslast 30 patents

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

BONDED STRUCTURES

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

BONDED STRUCTURES

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

SEALED BONDED STRUCTURES AND METHODS FOR FORMING THE SAME

PROTECTIVE ELEMENTS FOR BONDED STRUCTURES

BONDED STRUCTURES

STRUCTURES AND METHODS FOR RELIABLE PACKAGES

BONDED STRUCTURES

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

HD COLOR IMAGING USING MONOCHROMATIC CMOS IMAGE SENSORS INTEGRATED...

Ultrathin Layer for Forming a Capacitive Interface Between Joined I...

BONDED STRUCTURES

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

BONDED STRUCTURES

BONDED STRUCTURES

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

Interposers And Fabrication Methods That Use Nanoparticle Inks And...

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

Structures and Methods for Reliable Packages