Tao Li

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transistors with dual power and signal lines
- Patent number 12,362,278
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked vertical transport field-effect transistor logic gate struc...
- Patent number 12,310,102
- Issue date May 20, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside CMOS trench epi with close N2P space
- Patent number 12,154,945
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned via to metal line for interconnect
- Patent number 12,080,640
- Issue date Sep 3, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
AI accelerator with MRAM, PCM, and recessed PCM bottom electrode
- Patent number 12,075,627
- Issue date Aug 27, 2024
- International Business Machines Corporation
- Ruilong Xie
- G11 - INFORMATION STORAGE
Information Patent Grant
Bottom source/drain etch with fin-cut-last-VTFET
- Patent number 12,021,135
- Issue date Jun 25, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory using vertical transport field effect t...
- Patent number 11,956,939
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned bottom spacer epi last flow for VTFET
- Patent number 11,923,434
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonmetallic liner around a magnetic tunnel junction
- Patent number 11,849,647
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Tao Li
Information Patent Grant
Stacked vertical transport field-effect transistor logic gate struc...
- Patent number 11,810,918
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered stacked vertical crystalline semiconducting channels
- Patent number 11,756,961
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom source/drain etch with fin-cut-last-VTFET
- Patent number 11,695,059
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory using vertical transport field effect t...
- Patent number 11,678,475
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet transistor with asymmetric gate stack
- Patent number 11,652,156
- Issue date May 16, 2023
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric structure to prevent hard mask erosion
- Patent number 11,562,908
- Issue date Jan 24, 2023
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered stacked vertical crystalline semiconducting channels
- Patent number 11,251,182
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet transistor with asymmetric gate stack
- Patent number 11,251,288
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom source/drain etch with fin-cut-last-VTFET
- Patent number 11,245,027
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement bottom spacer for vertical transport field effect trans...
- Patent number 11,239,119
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped epitaxy buried contact
- Patent number 11,227,922
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned bottom spacer EPI last flow for VTFET
- Patent number 11,177,367
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked fin semiconductor devices
- Patent number 11,075,266
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Praveen Joseph
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHARED SOURCE/DRAIN CONTACT
- Publication number 20250234631
- Publication date Jul 17, 2025
- International Business Machines Corporation
- Lijuan Zou
Information Patent Application
BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE
- Publication number 20250227977
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH TOPVIA
- Publication number 20250226319
- Publication date Jul 10, 2025
- International Business Machines Corporation
- Gideon Oyibo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250218941
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC SOURCE/DRAIN SPACER WITH SHIFTED VBPR AND BSPDN
- Publication number 20250218946
- Publication date Jul 3, 2025
- International Business Machines Corporation
- GIDEON OYIBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL DEPOPULATION USING PLACEHOLDER DIELECTIRIC
- Publication number 20250220987
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Liqiao Qin
Information Patent Application
EMBEDDED ACTIVE CHIP WITHIN INTERPOSER
- Publication number 20250219022
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH INSULATOR VIA BETWEEN CHIPLETS
- Publication number 20250218977
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250218944
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL GATE CUT WITH BACKSIDE POWER DELIVERY
- Publication number 20250210520
- Publication date Jun 26, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BACKSIDE CONTACTS WITH LOCAL INTERCONNECTS
- Publication number 20250210518
- Publication date Jun 26, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN EXTENSION WITH SPACER LAYERS
- Publication number 20250204002
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Minhaz Abedin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK
- Publication number 20250201667
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOWER GATE CAP FOR BACKSIDE CONTACT INSULATION
- Publication number 20250203988
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Lijuan Zou
Information Patent Application
INNER SPACER AND SOURCE DRAIN EPI
- Publication number 20250203991
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Tao Li
Information Patent Application
SELF-ALIGNED BACKSIDE DIFFUSION BREAK AND S/D CONTACT
- Publication number 20250204001
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONTACTS HAVING SIDEWALL SPACERS
- Publication number 20250203989
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Sagarika Mukesh
Information Patent Application
WRAP AROUND CONTACT WITH IMPROVED METAL THICKNESS
- Publication number 20250203945
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
Information Patent Application
ENLARGED PLACEHOLDER AND BACKSIDE CONTACT
- Publication number 20250201711
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PLACEHOLDER DIELECTRIC FILL
- Publication number 20250194213
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...
- Publication number 20250194152
- Publication date Jun 12, 2025
- International Business Machines Corporation
- GIDEON OYIBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP SOURCE/DRAIN WITH SIDEWALL LINER PROTECTION AND DIRECT BACKSID...
- Publication number 20250194156
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP IN SINGLE DIFFUSION BREAK
- Publication number 20250194168
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WRAP-AROUND CONTACT HAVING NON-UNIFORM TH...
- Publication number 20250194212
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Minhaz Abedin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING PLASMA ETCHING DATA COLLECTION WINDOWS USING POSITIVELY C...
- Publication number 20250191890
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Viswas Purohit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BIPOLAR DEVICE AND BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250192049
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Xiaoming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanosheet FET with Controlled Overlay Mark
- Publication number 20250194180
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT EXTENSION FOR ADDITIONAL WIRING PATHS
- Publication number 20250194149
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Liqiao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AN ETCH STOP LAYER AT THE MIDDLE OF LINE
- Publication number 20250194198
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Liqiao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MEMORY WITH ANGLED ELECTRODE PROFILE
- Publication number 20250194442
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Min Gyu Sung

Person

Patents Grantslast 30 patents

Transistors with dual power and signal lines

Stacked vertical transport field-effect transistor logic gate struc...

Top via interconnects with line wiggling prevention

Backside CMOS trench epi with close N2P space

Self-aligned via to metal line for interconnect

AI accelerator with MRAM, PCM, and recessed PCM bottom electrode

Bottom source/drain etch with fin-cut-last-VTFET

Static random access memory using vertical transport field effect t...

Via patterning for integrated circuits

Self-aligned bottom spacer epi last flow for VTFET

Nonmetallic liner around a magnetic tunnel junction

Stacked vertical transport field-effect transistor logic gate struc...

Staggered stacked vertical crystalline semiconducting channels

Bottom source/drain etch with fin-cut-last-VTFET

Static random access memory using vertical transport field effect t...

Nanosheet transistor with asymmetric gate stack

Dielectric structure to prevent hard mask erosion

Staggered stacked vertical crystalline semiconducting channels

Nanosheet transistor with asymmetric gate stack

Bottom source/drain etch with fin-cut-last-VTFET

Replacement bottom spacer for vertical transport field effect trans...

Sloped epitaxy buried contact

Self-aligned bottom spacer EPI last flow for VTFET

Vertically stacked fin semiconductor devices

Patents Applicationslast 30 patents

SHARED SOURCE/DRAIN CONTACT

BACKSIDE ANGLED SOURCE/DRAIN CONTACT STRUCTURE

INTERCONNECT WITH TOPVIA

POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES

ASYMMETRIC SOURCE/DRAIN SPACER WITH SHIFTED VBPR AND BSPDN

CHANNEL DEPOPULATION USING PLACEHOLDER DIELECTIRIC

EMBEDDED ACTIVE CHIP WITHIN INTERPOSER

COAXIAL THROUGH INSULATOR VIA BETWEEN CHIPLETS

POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES

DUAL GATE CUT WITH BACKSIDE POWER DELIVERY

DIRECT BACKSIDE CONTACTS WITH LOCAL INTERCONNECTS

SOURCE/DRAIN EXTENSION WITH SPACER LAYERS

COOLING FOR BACK SIDE POWER DISTRIBUTION NETWORK

LOWER GATE CAP FOR BACKSIDE CONTACT INSULATION

INNER SPACER AND SOURCE DRAIN EPI

SELF-ALIGNED BACKSIDE DIFFUSION BREAK AND S/D CONTACT

SEMICONDUCTOR STRUCTURE WITH CONTACTS HAVING SIDEWALL SPACERS

WRAP AROUND CONTACT WITH IMPROVED METAL THICKNESS

ENLARGED PLACEHOLDER AND BACKSIDE CONTACT

BACKSIDE PLACEHOLDER DIELECTRIC FILL

LOCAL BACKSIDE CONTACT ISOLATION FOR MERGED BACKSIDE CONTACT PATTER...

DEEP SOURCE/DRAIN WITH SIDEWALL LINER PROTECTION AND DIRECT BACKSID...

AIRGAP IN SINGLE DIFFUSION BREAK

SEMICONDUCTOR DEVICE WITH WRAP-AROUND CONTACT HAVING NON-UNIFORM TH...

SHIELDING PLASMA ETCHING DATA COLLECTION WINDOWS USING POSITIVELY C...

INTEGRATION OF BIPOLAR DEVICE AND BACKSIDE POWER DELIVERY NETWORK

Nanosheet FET with Controlled Overlay Mark

CONTACT EXTENSION FOR ADDITIONAL WIRING PATHS

SEMICONDUCTOR DEVICE WITH AN ETCH STOP LAYER AT THE MIDDLE OF LINE

RESISTIVE MEMORY WITH ANGLED ELECTRODE PROFILE