Yoshiaki Wakashima

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for use in package of semiconductor device, semiconductor...
- Patent number 6,708,398
- Issue date Mar 23, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,693,346
- Issue date Feb 17, 2004
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, semiconductor device substrate, and methods o...
- Patent number 6,617,193
- Issue date Sep 9, 2003
- Hitachi Chemical Company, Ltd.
- Yamazaki Toshio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,521,993
- Issue date Feb 18, 2003
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of fabrication thereof
- Patent number 6,492,203
- Issue date Dec 10, 2002
- Hitachi Chemical Company, Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 6,424,030
- Issue date Jul 23, 2002
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Board for mounting semiconductor element, method for manufacturing...
- Patent number 6,268,648
- Issue date Jul 31, 2001
- Hitachi Chemical Co., Ltd.
- Naoki Fukutomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory module having double-sided memory chip layout
- Patent number 6,262,488
- Issue date Jul 17, 2001
- Hitachi Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 5,910,685
- Issue date Jun 8, 1999
- Hitachi Ltd.
- Masayuki Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory module having double-sided stacked memory chip...
- Patent number 5,708,298
- Issue date Jan 13, 1998
- Hitachi Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for manufacturing a stacked integrated circuit package
- Patent number 5,587,341
- Issue date Dec 24, 1996
- Hitachi, Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor memory device and semiconductor memory module...
- Patent number 5,334,875
- Issue date Aug 2, 1994
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor stacked device
- Patent number 5,198,888
- Issue date Mar 30, 1993
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Lead connections means for stacked tab packaged IC chips
- Patent number 5,138,438
- Issue date Aug 11, 1992
- Akita Electronics Co. Ltd.
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and semiconductor module with a plurality of s...
- Patent number 5,028,986
- Issue date Jul 2, 1991
- Hitachi, Ltd.
- Toshio Sugano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device and method of manufacturing...
- Patent number 4,982,265
- Issue date Jan 1, 1991
- Hitachi, Ltd.
- Masayuki Watanabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and tape carrier
- Patent number 4,977,441
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Hideya Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for producing the same, and tape c...
- Patent number 4,792,532
- Issue date Dec 20, 1988
- Hitachi, Ltd.
- Hideya Ohtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memories with .alpha. shield
- Patent number 4,494,217
- Issue date Jan 15, 1985
- Hitachi, Ltd.
- Hiroshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for pre-heating resin tablet
- Patent number 4,322,593
- Issue date Mar 30, 1982
- Hitachi, Ltd.
- Kunihiko Nishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20030098504
- Publication date May 29, 2003
- Watanabe Masayuki
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20020121690
- Publication date Sep 5, 2002
- Hitachi, Ltd. (JP)
- Watanabe Masayuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for use in package of semiconductor device, semiconductor...
- Publication number 20020020909
- Publication date Feb 21, 2002
- HITACHI CHEMICAL CO., Ltd.
- Yoshiaki Wakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor memory module having double-sided stacked memory chip...
- Publication number 20010020741
- Publication date Sep 13, 2001
- HITACHI LTD.
- Watanabe Masayuki
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiaki Wakashima

Person

Patents Grantslast 30 patents

Substrate for use in package of semiconductor device, semiconductor...

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor device, semiconductor device substrate, and methods o...

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor device and method of fabrication thereof

Semiconductor memory module having double-sided stacked memory chip...

Board for mounting semiconductor element, method for manufacturing...

Semiconductor memory module having double-sided memory chip layout

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor memory module having double-sided stacked memory chip...

Process for manufacturing a stacked integrated circuit package

Stacked semiconductor memory device and semiconductor memory module...

Semiconductor stacked device

Lead connections means for stacked tab packaged IC chips

Semiconductor device and semiconductor module with a plurality of s...

Semiconductor integrated circuit device and method of manufacturing...

Semiconductor device and tape carrier

Semiconductor device and process for producing the same, and tape c...

Semiconductor memories with .alpha. shield

Apparatus for pre-heating resin tablet

Patents Applicationslast 30 patents

Semiconductor memory module having double-sided stacked memory chip...

Semiconductor memory module having double-sided stacked memory chip...

Substrate for use in package of semiconductor device, semiconductor...

Semiconductor memory module having double-sided stacked memory chip...