Agitating of electrolytes Moving of racks

Industry

CPC
C25D21/10

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Parent Industries

CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

Current Industry

C25D21/10Agitating of electrolytes Moving of racks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of adjusting plating module
- Patent number 12,163,244
- Issue date Dec 10, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and air bubble removing method of plating apparatus
- Patent number 12,152,312
- Issue date Nov 26, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and cleaning method of contact member of plating...
- Patent number 12,134,833
- Issue date Nov 5, 2024
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 12,104,269
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and rinse process method
- Patent number 12,084,783
- Issue date Sep 10, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Highly magnetically permeable alloy deposition method for magnetic...
- Patent number 12,006,587
- Issue date Jun 11, 2024
- Mark R. Schroeder
- G01 - MEASURING TESTING
Information Patent Grant
Plating apparatus and air bubble removing method
- Patent number 11,993,861
- Issue date May 28, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for shielding features of a workpiece during el...
- Patent number 11,987,897
- Issue date May 21, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating method and electroplating apparatus
- Patent number 11,959,186
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ting Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Portable and modular production electroplating system
- Patent number 11,939,690
- Issue date Mar 26, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming metal film
- Patent number 11,932,957
- Issue date Mar 19, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite plating material and method for producing the same
- Patent number 11,926,917
- Issue date Mar 12, 2024
- Dowa Metaltech Co., Ltd.
- Yukiya Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Turbulence-reducing device for stirring a surface treatment solution
- Patent number 11,891,698
- Issue date Feb 6, 2024
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Paddle, processing apparatus having the paddle, and method of produ...
- Patent number 11,891,715
- Issue date Feb 6, 2024
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,851,781
- Issue date Dec 26, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Paddle chamber with anti-splashing baffles
- Patent number 11,795,566
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device and apparatus for agitation of liquid
- Patent number 11,759,757
- Issue date Sep 19, 2023
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 11,739,434
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Paddle, plating apparatus equipped with the paddle, and plating method
- Patent number 11,717,796
- Issue date Aug 8, 2023
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,692,281
- Issue date Jul 4, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier liquid leakage preventing device and electrochemical deposi...
- Patent number 11,686,010
- Issue date Jun 27, 2023
- BOE Technology Group Co., Ltd.
- Chengfei Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite conductive polymers, preparation method and application t...
- Patent number 11,655,379
- Issue date May 23, 2023
- University of Electronic Science and Technology of China
- Guoyun Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems
- Patent number 11,608,563
- Issue date Mar 21, 2023
- ASMPT NEXX, INC.
- Arthur Keigler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 11,585,008
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 11,585,009
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,566,339
- Issue date Jan 31, 2023
- Ebara Corporation
- Yusuke Tamari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of preparing articles by electrodeposition and additive man...
- Patent number 11,560,629
- Issue date Jan 24, 2023
- Modumetal, Inc.
- John D. Whitaker
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of plating, apparatus for plating, and non-volatile storage...
- Patent number 11,542,629
- Issue date Jan 3, 2023
- Ebara Corporation
- Mizuki Nagai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods
- Patent number 11,542,617
- Issue date Jan 3, 2023
- Hamilton Sundstrand Corporation
- Lei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING APPARATUS
- Publication number 20240376627
- Publication date Nov 14, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Jian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENERGY STORAGE DEVICE HAVING CELL WITH COATING
- Publication number 20240313304
- Publication date Sep 19, 2024
- Deere & Company
- Aneil POKHAREL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240301582
- Publication date Sep 12, 2024
- EBARA CORPORATION
- Yohei WAKUDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION
- Publication number 20240301583
- Publication date Sep 12, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jinyang ZHAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESISTOR AND PLATING APPARATUS
- Publication number 20240279837
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES
- Publication number 20240271312
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Nolan L. Zimmerman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MAINTENANCE METHOD OF PLATING APPARATUS
- Publication number 20240263337
- Publication date Aug 8, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20240218553
- Publication date Jul 4, 2024
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...
- Publication number 20240218551
- Publication date Jul 4, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM
- Publication number 20240209541
- Publication date Jun 27, 2024
- Snap-on Incorporated
- Kraig A. Tabor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240209542
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING MODULE
- Publication number 20240183059
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Coating a Component in a Dipping Bath
- Publication number 20240183055
- Publication date Jun 6, 2024
- Bayerische Motoren Werke Aktiengesellschaft
- Elmar STEGMAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND RINSE PROCESS METHOD
- Publication number 20240183058
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240183056
- Publication date Jun 6, 2024
- EBARA CORPORATION
- Masaki TOMITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...
- Publication number 20240141534
- Publication date May 2, 2024
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...
- Publication number 20240141535
- Publication date May 2, 2024
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...
- Publication number 20240076795
- Publication date Mar 7, 2024
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240044038
- Publication date Feb 8, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UNIFORM FLOW CONTROL AGITATION DEVICE FOR ELECTROPLATING
- Publication number 20240044037
- Publication date Feb 8, 2024
- SINYANG SEMICONDUCTOR (SHANGHAI) TECHNOLOGY & INNOVATION CO., LTD.
- Steven He WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR...
- Publication number 20240011180
- Publication date Jan 11, 2024
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20230374691
- Publication date Nov 23, 2023
- ACM Research (Shanghai) Inc.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
- Publication number 20230349064
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...
- Publication number 20230340687
- Publication date Oct 26, 2023
- EBARA CORPORATION
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...
- Publication number 20230313407
- Publication date Oct 5, 2023
- Semsysco GmbH
- Herbert ÖTZLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AGITATION MONITORING SYSTEM FOR PLATING PROCESS
- Publication number 20230304795
- Publication date Sep 28, 2023
- Intel Corporation
- Adrian BAYRAKTAROGLU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS
- Publication number 20230295829
- Publication date Sep 21, 2023
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS
- Publication number 20230227992
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, CONTROL METHOD FOR PLATING APPARATUS AND NONVOLA...
- Publication number 20230203702
- Publication date Jun 29, 2023
- EBARA CORPORATION
- Yosuke NAGASAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Agitating of electrolytes Moving of racks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of adjusting plating module

Plating apparatus and air bubble removing method of plating apparatus

Plating apparatus and cleaning method of contact member of plating...

Mechanically-driven oscillating flow agitation

Plating apparatus and rinse process method

Highly magnetically permeable alloy deposition method for magnetic...

Plating apparatus and air bubble removing method

Systems and methods for shielding features of a workpiece during el...

Electroplating method and electroplating apparatus

Portable and modular production electroplating system

Method for forming metal film

Composite plating material and method for producing the same

Turbulence-reducing device for stirring a surface treatment solution

Paddle, processing apparatus having the paddle, and method of produ...

Method and apparatus for continuously applying nanolaminate metal c...

Paddle chamber with anti-splashing baffles

Device and apparatus for agitation of liquid

Plating systems having reduced air entrainment

Paddle, plating apparatus equipped with the paddle, and plating method

Method and apparatus for continuously applying nanolaminate metal c...

Carrier liquid leakage preventing device and electrochemical deposi...

Composite conductive polymers, preparation method and application t...

Electrochemical deposition systems

Plating apparatus for plating semiconductor wafer and plating method

Mechanically-driven oscillating flow agitation

Plating method and plating apparatus

Methods of preparing articles by electrodeposition and additive man...

Electroplating apparatus for tailored uniformity profile

Method of plating, apparatus for plating, and non-volatile storage...

Electroplating systems and methods

Patents Applicationslast 30 patents

ELECTROPLATING APPARATUS

ENERGY STORAGE DEVICE HAVING CELL WITH COATING

PLATING APPARATUS

ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION

RESISTOR AND PLATING APPARATUS

PADDLE CHAMBER WITH ANTI-SPLASHING BAFFLES

MAINTENANCE METHOD OF PLATING APPARATUS

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

PLATING APPARATUS

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD FOR NON-CIRCULAR...

PORTABLE AND MODULAR PRODUCTION ELECTROPLATING SYSTEM

PLATING METHOD AND PLATING APPARATUS

METHOD OF ADJUSTING PLATING MODULE

Method for Coating a Component in a Dipping Bath

PLATING APPARATUS AND RINSE PROCESS METHOD

PLATING APPARATUS

DISTRIBUTION SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTRO...

SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...

SPATIALLY AND DIMENSIONALLY NON-UNIFORM CHANNELLED PLATE FOR TAILOR...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

UNIFORM FLOW CONTROL AGITATION DEVICE FOR ELECTROPLATING

DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR...

PLATING APPARATUS AND PLATING METHOD

PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT

PLATING APPARATUS AND CLEANING METHOD OF CONTACT MEMBER OF PLATING...

SHIELD BODY SYSTEM FOR A PROCESS FLUID FOR CHEMICAL AND/OR ELECTROL...

AGITATION MONITORING SYSTEM FOR PLATING PROCESS

PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS

ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS

PLATING APPARATUS, CONTROL METHOD FOR PLATING APPARATUS AND NONVOLA...