at the bonding interface of the bump connector

Industry

CPC
H01L2224/13019

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13019at the bonding interface of the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,057,435
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an upper conductive structure having multilayer...
- Patent number 11,973,050
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising pillar interconnect with cavity
- Patent number 11,721,656
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 11,715,716
- Issue date Aug 1, 2023
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of bipolar transistors with...
- Patent number 11,658,180
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package assembly
- Patent number 11,637,083
- Issue date Apr 25, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and manufacturing method of bonded body
- Patent number 11,631,649
- Issue date Apr 18, 2023
- Olympus Corporation
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferrable pillar structure for fanout package or interconnect b...
- Patent number 11,587,896
- Issue date Feb 21, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,444,047
- Issue date Sep 13, 2022
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,342,308
- Issue date May 24, 2022
- SHARP KABUSHIKI KAISHA
- Keiichi Sawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer having multi-layered pad
- Patent number 11,063,011
- Issue date Jul 13, 2021
- NANYA TECHNOLOGY CORPORATION
- Chia-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device having a plurality of bipolar transistors with...
- Patent number 10,964,693
- Issue date Mar 30, 2021
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355779
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321789
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuyuki HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
- Publication number 20240038707
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...
- Publication number 20240038704
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...
- Publication number 20240021561
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006364
- Publication date Jan 4, 2024
- Rohm Co., Ltd.
- Kengo OHMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...
- Publication number 20230299026
- Publication date Sep 21, 2023
- Magnachip Semiconductor, Ltd.
- Myungho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20230260958
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20230197632
- Publication date Jun 22, 2023
- Murata Manufacturing Co., Ltd.
- Ryohei OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...
- Publication number 20230137996
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230089483
- Publication date Mar 23, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOKAZU ITOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20230090449
- Publication date Mar 23, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069490
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY
- Publication number 20230057439
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...
- Publication number 20230041521
- Publication date Feb 9, 2023
- DIC CORPORATION
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNEC...
- Publication number 20230034877
- Publication date Feb 2, 2023
- SK HYNIX INC.
- Jun Yong SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE
- Publication number 20230030589
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- BOIN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, PACKAGE STRUCTURE AND ELECTRONIC MANUFACTURING M...
- Publication number 20230018031
- Publication date Jan 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Package Assembly
- Publication number 20220320038
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS

at the bonding interface of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with solder on pillar

Conductive terminal for side facing packages

Semiconductor package

Structures for low temperature bonding using nanoparticles

Structure and method of forming a joint assembly

Methods of manufacturing semiconductor device with bump interconnec...

Method for forming an upper conductive structure having multilayer...

Methods for low temperature bonding using nanoparticles

Semiconductor device and method for manufacturing the same

Integrated device comprising pillar interconnect with cavity

Electronic device, package structure and electronic manufacturing m...

Structures and methods for low temperature bonding using nanoparticles

Semiconductor device having a plurality of bipolar transistors with...

Connection arrangement, component carrier and method of forming a c...

Flip-chip package assembly

Bonded body and manufacturing method of bonded body

Transferrable pillar structure for fanout package or interconnect b...

Semiconductor device

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Structure and method of forming a joint assembly

Semiconductor device and manufacturing method for semiconductor device

Packages for semiconductor devices, packaged semiconductor devices,...

Chip and wafer having multi-layered pad

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor device having a plurality of bipolar transistors with...

Bump-forming film, semiconductor device and manufacturing method th...

Porous Cu on Cu surface for semiconductor packages

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

BONDING-TYPE INTERCONNECTION MEMBER

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...

HYBRID SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND AS...

UPPER CONDUCTIVE STRUCTURE HAVING MULTILAYER STACK TO DECREASE FABR...

SEMICONDUCTOR DEVICE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

WAFER LEVEL CHIP SCALE PACKAGE OF POWER SEMICONDUCTOR AND MANUFACUT...

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

Flip-Chip Package Assembly

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONI...

CONDUCTIVE MEMBERS WITH UNOBSTRUCTED INTERFACIAL AREA FOR DIE ATTAC...

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SEMICONDUCTOR PACKAGE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY

CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNEC...

SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE

ELECTRONIC DEVICE, PACKAGE STRUCTURE AND ELECTRONIC MANUFACTURING M...

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

Flip-Chip Package Assembly

Structure and Method of Forming a Joint Assembly