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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10156at the periphery

Industries

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including non-conductive film and method for...
- Patent number 12,015,005
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSD wafer device and method of manufacturing same
- Patent number 12,009,354
- Issue date Jun 11, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring micro-light emitting diode for LED display
- Patent number 11,869,880
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,798,860
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,626,352
- Issue date Apr 11, 2023
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, imaging device, electronic device, and method of m...
- Patent number 11,605,662
- Issue date Mar 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hitoshi Shibue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,581,257
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Hyuek Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,508,701
- Issue date Nov 22, 2022
- Nichia Corporation
- Masaki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and device
- Patent number 11,348,888
- Issue date May 31, 2022
- Canon Kabushiki Kaisha
- Hidemasa Oshige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof and manufacturin...
- Patent number 11,342,300
- Issue date May 24, 2022
- Japan Display Inc.
- Youhei Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of micro-LED display panel
- Patent number 11,302,679
- Issue date Apr 12, 2022
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure having chamfers
- Patent number 11,227,842
- Issue date Jan 18, 2022
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,201,097
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,139,285
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of a semiconductor device
- Patent number 11,121,050
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die singulation and stacked device structures
- Patent number 11,075,117
- Issue date Jul 27, 2021
- Xilinx, Inc.
- Ganesh Hariharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative fillet for mounting an integrated device die to a carrier
- Patent number 11,056,455
- Issue date Jul 6, 2021
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,037,849
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 11,011,446
- Issue date May 18, 2021
- Nexperia B.V.
- Tonny Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hetero-integrated structure
- Patent number 11,004,816
- Issue date May 11, 2021
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332276
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20240297141
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...
- Publication number 20240274660
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Edward Robert Van Brunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...
- Publication number 20240258372
- Publication date Aug 1, 2024
- INFINEON TECHNOLOGIES AG
- Sebastian POLSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...
- Publication number 20240153821
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
- Publication number 20240072002
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Raj K. Bansal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE
- Publication number 20240006374
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY
- Publication number 20230395575
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230317657
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Limiting Failures Caused by Dendrite Growth on Semiconductor Chips
- Publication number 20230215833
- Publication date Jul 6, 2023
- Wolfspeed, Inc.
- Dan Namishia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20230207392
- Publication date Jun 29, 2023
- Rohm Co., Ltd.
- Shingo OTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230207432
- Publication date Jun 29, 2023
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230187430
- Publication date Jun 15, 2023
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230075665
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20220415842
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305116
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210125964
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...
- Publication number 20210066238
- Publication date Mar 4, 2021
- Japan Display Inc.
- Youhei IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sawing Underfill in Packaging Processes
- Publication number 20210057383
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL
- Publication number 20200373282
- Publication date Nov 26, 2020
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20200373270
- Publication date Nov 26, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20200357763
- Publication date Nov 12, 2020
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20200350209
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS
- Publication number 20200350261
- Publication date Nov 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Po-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE
- Publication number 20200294892
- Publication date Sep 17, 2020
- Huawei Technologies Co., Ltd
- Kairong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS

at the periphery

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulated light emitting diodes for selective fluidic assembly

Semiconductor package including non-conductive film and method for...

SSD wafer device and method of manufacturing same

Method and system for packing optimization of semiconductor devices

Method of transferring micro-light emitting diode for LED display

Semiconductor structure and manufacturing method thereof

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Semiconductor device and method for manufacturing the same

Imaging element, imaging device, electronic device, and method of m...

Semiconductor package

Light emitting device

High reliability semiconductor devices and methods of fabricating t...

Multi-die package with bridge layer

Semiconductor die singulation and structures formed thereby

Electronic component and device

Electronic device and manufacturing method thereof and manufacturin...

Manufacturing method of micro-LED display panel

Method and system for packing optimization of semiconductor devices

Semiconductor device having a device fixed on a substrate with an a...

Electronic package and substrate structure having chamfers

Method of manufacture of a semiconductor device

Semiconductor package

Method of manufacture of a semiconductor device

Die singulation and stacked device structures

Negative fillet for mounting an integrated device die to a carrier

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of making a semiconductor device

Hetero-integrated structure

Method for transferring and placing a semiconductor device on a sub...

Patents Applicationslast 30 patents

Integrated Circuit Packages and Methods

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...

ELECTRONIC COMPONENT AND PACKAGE INCLUDING STRESS RELEASE STRUCTURE...

INTEGRATED CIRCUIT PACKAGES AND METHODS

PACKAGE STRUCTURE HAVING A STACKED SEMICONDUCTOR DIES WITH WAVY SID...

SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS

SEMICONDUCTOR DIE ASSEMBLY HAVING A POLYGONAL LINKING DIE

METHOD OF TRANSFERRING MICRO-LIGHT EMITTING DIODE FOR LED DISPLAY

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Limiting Failures Caused by Dendrite Growth on Semiconductor Chips

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Sawing Underfill in Packaging Processes

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...

Sawing Underfill in Packaging Processes

MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

Method and System for Packing Optimization of Semiconductor Devices

Semiconductor Die Singulation and Structures Formed Thereby

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE HAVING CHAMFERS

PACKAGE STRUCTURE AND COMMUNICATIONS DEVICE

Methods for Making Multi-Die Package With Bridge Layer