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H01L2224/13551

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13551being non uniform

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Patents Grantslast 30 patents

Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,551,973
- Issue date Jan 10, 2023
- Kioxia Corporation
- Takanobu Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,163,836
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,972,556
- Issue date May 15, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by so...
- Patent number 9,806,045
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 9,536,849
- Issue date Jan 3, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,508,668
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method of forming same
- Patent number 9,496,233
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a conductive pillar bump with non-metal sidewall p...
- Patent number 9,287,171
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 9,082,754
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper pillar bump with non-metal sidewall protection structure and...
- Patent number 8,823,167
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 8,618,658
- Issue date Dec 31, 2013
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,476,159
- Issue date Jul 2, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu pillar bump with non-metal sidewall protection structure
- Patent number 8,441,124
- Issue date May 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with compliant bump and manufacturing method th...
- Patent number 8,426,984
- Issue date Apr 23, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 8,367,539
- Issue date Feb 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 8,278,143
- Issue date Oct 2, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,977,158
- Issue date Jul 12, 2011
- Renesas Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for electronic devices
- Patent number 7,772,032
- Issue date Aug 10, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240371739
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Pin-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING EXPOSED LEADS
- Publication number 20240203919
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20220059407
- Publication date Feb 24, 2022
- KIOXIA Corporation
- Takanobu ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220005779
- Publication date Jan 6, 2022
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190148325
- Publication date May 16, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20180166409
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20160322321
- Publication date Nov 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20150325542
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...
- Publication number 20140335687
- Publication date Nov 13, 2014
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ladder Bump Structures and Methods of Making Same
- Publication number 20140077359
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure and Method of Forming Same
- Publication number 20140077360
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure and Method of Forming Same
- Publication number 20140077358
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bump and Method of Manufacturing Same
- Publication number 20140077365
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20140035150
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
- Publication number 20130062756
- Publication date Mar 14, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...
- Publication number 20130065388
- Publication date Mar 14, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...
- Publication number 20120280388
- Publication date Nov 8, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110266667
- Publication date Nov 3, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20110253767
- Publication date Oct 20, 2011
- RENESAS ELECTRONICS CORPORATION
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20110233767
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20100291732
- Publication date Nov 18, 2010
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for electronic devices
- Publication number 20090137082
- Publication date May 28, 2009
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated device and electronic system
- Publication number 20060208357
- Publication date Sep 21, 2006
- Thorsten Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated structure
- Publication number 20040244906
- Publication date Dec 9, 2004
- AU Optoelectronic Corporation
- Ling-Yi Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being non uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solderless interconnection structure and method of forming same

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing method and semiconductor device

Conductive external connector structure and method of forming

Solderless interconnection structure and method of forming same

Interconnection structure including a metal post encapsulated by a...

Conductive external connector structure and method of forming

Metal cored solder decal structure and process

Solderless interconnection structure and method of forming same

Conductive external connector structure and method of forming

Structures having a tapering curved profile and methods of making same

Metal cored solder decal structure and process

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Interconnection structure including a metal post encapsulated by so...

Semiconductor device and manufacturing method of the same

Conductive contacts having varying widths and method of manufacturi...

Interconnection structure and method of forming same

Method of making a conductive pillar bump with non-metal sidewall p...

Metal cored solder decal structure and process

Copper pillar bump with non-metal sidewall protection structure and...

Semiconductor device and fabricating method thereof

Substrate structure with compliant bump and manufacturing method th...

Cu pillar bump with non-metal sidewall protection structure

Substrate structure with compliant bump and manufacturing method th...

Semiconductor device and semiconductor device manufacturing method

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

INTEGRATED CIRCUIT HAVING EXPOSED LEADS

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Solderless Interconnection Structure and Method of Forming Same

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

Conductive External Connector Structure and Method of Forming

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

METHOD OF MAKING A CONDUCTIVE PILLAR BUMP WITH NON-METAL SIDEWALL P...

Ladder Bump Structures and Methods of Making Same

Interconnection Structure and Method of Forming Same

Bump Structure and Method of Forming Same

Metal Bump and Method of Manufacturing Same

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

SUBSTRATE STRUCTURE WITH COMPLIANT BUMP AND MANUFACTURING METHOD TH...

COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND...

CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE

Manufacturing method for electronic devices

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Manufacturing method for electronic devices

Manufacturing method for electronic devices

Integrated device and electronic system

Laminated structure