TREA

between the MEMS die and the substrate

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Industry

  • CPC
  • B81B7/0048
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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0048between the MEMS die and the substrate
Industries