between the MEMS die and the substrate

Industry

CPC
B81B7/0048

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0048between the MEMS die and the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 12,187,601
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatuses for packaging an ultrasound-on-a-chip
- Patent number 12,178,648
- Issue date Dec 31, 2024
- BFLY OPERATIONS, INC.
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming monocrystalline nickel-titanium films on single c...
- Patent number 12,116,271
- Issue date Oct 15, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Jagannathan Rajagopalan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolation using three-dimensional trenches
- Patent number 12,054,385
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Ting-Ta Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrator device, oscillator, gyro sensor, electronic apparatus, and...
- Patent number 12,034,433
- Issue date Jul 9, 2024
- Seiko Epson Corporation
- Tetsuya Otsuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress-isolated MEMS device comprising substrate having cavity and...
- Patent number 11,981,560
- Issue date May 14, 2024
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Application specific integrated circuit (ASIC) chip, and sensor and...
- Patent number 11,973,503
- Issue date Apr 30, 2024
- NANJING PRIME SEMICONDUCTOR CO., LTD.
- Sunfeng Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device
- Patent number 11,885,621
- Issue date Jan 30, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koichiro Nakashima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS strain gauge pressure sensor with mechanical symmetries
- Patent number 11,879,800
- Issue date Jan 23, 2024
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Constraint for a sensor assembly
- Patent number 11,795,052
- Issue date Oct 24, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Jose Fernando Alfaro Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly substrates including a bond layer
- Patent number 11,787,690
- Issue date Oct 17, 2023
- Knowles Electronics, LLC
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-stress packaging structure for MEMS acceleration sensor chip
- Patent number 11,780,727
- Issue date Oct 10, 2023
- Zhejiang University
- Lufeng Che
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS stress reduction structure embedded into package
- Patent number 11,760,627
- Issue date Sep 19, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device package
- Patent number 11,702,335
- Issue date Jul 18, 2023
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface micromechanical element and method for manufacturing the same
- Patent number 11,697,586
- Issue date Jul 11, 2023
- Teknologian tutkimuskeskus VTT Oy
- Aarne Oja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for a transducer assembly with a standoff
- Patent number 11,591,210
- Issue date Feb 28, 2023
- Knowles Electronics, LLC
- Timothy Pachla
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing delamination in sensor package
- Patent number 11,584,638
- Issue date Feb 21, 2023
- Invensense, Inc.
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,565,934
- Issue date Jan 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package
- Patent number 11,565,933
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Michael Kandler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment of stress sensitive integrated circuit dies
- Patent number 11,548,781
- Issue date Jan 10, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing micromechanical diaphragm sensors
- Patent number 11,519,803
- Issue date Dec 6, 2022
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrator device, oscillator, gyro sensor, electronic apparatus, and...
- Patent number 11,509,288
- Issue date Nov 22, 2022
- Seiko Epson Corporation
- Tetsuya Otsuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical pressure sensor device and corresponding manufactur...
- Patent number 11,441,964
- Issue date Sep 13, 2022
- Robert Bosch GmbH
- Volkmar Senz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatuses for packaging an ultrasound-on-a-chip
- Patent number 11,389,137
- Issue date Jul 19, 2022
- BFLY OPERATIONS, INC.
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor, electronic instrument, vehicle, and method for man...
- Patent number 11,282,808
- Issue date Mar 22, 2022
- Seiko Epson Corporation
- Teruo Takizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Use of an uncoupling structure for assembling a component having a...
- Patent number 11,267,697
- Issue date Mar 8, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Philippe Robert
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUB...
- Publication number 20250019230
- Publication date Jan 16, 2025
- Jagannathan Rajagopalan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES
- Publication number 20240391758
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ting-Ta YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LENS AND EYEWEAR
- Publication number 20240286891
- Publication date Aug 29, 2024
- HS Vision Ltd.
- Alexander MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION PROCESS
- Publication number 20240253979
- Publication date Aug 1, 2024
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE
- Publication number 20240116750
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Takashi NAIKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) CHIP, AND SENSOR AND...
- Publication number 20240080021
- Publication date Mar 7, 2024
- Nanjing Prime Semiconductor Co., Ltd.
- Sunfeng HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE
- Publication number 20240059554
- Publication date Feb 22, 2024
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD
- Publication number 20230365400
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Guoqiang WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE AND PROCESS FOR MANUFACTURING A MICRO...
- Publication number 20230356999
- Publication date Nov 9, 2023
- STMicroelectronics S.r.l.
- Filippo DANIELE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION
- Publication number 20230234835
- Publication date Jul 27, 2023
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20230174371
- Publication date Jun 8, 2023
- Huawei Technologies Co., Ltd
- Qin SHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...
- Publication number 20230146158
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Kaoru KISHIGUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE-AXIS INERTIAL SENSOR MODULE WITH INTERPOSER
- Publication number 20230133753
- Publication date May 4, 2023
- TELEDYNE SCIENTIFIC & IMAGING, LLC
- Jeffrey F. DeNatale
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH...
- Publication number 20230139299
- Publication date May 4, 2023
- Beijing Voyager Technology Co., Ltd.
- Sae Won LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20230126598
- Publication date Apr 27, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUB...
- Publication number 20230052052
- Publication date Feb 16, 2023
- Jagannathan Rajagopalan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...
- Publication number 20230046645
- Publication date Feb 16, 2023
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...
- Publication number 20230040197
- Publication date Feb 9, 2023
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR ASSEMBLY
- Publication number 20230038134
- Publication date Feb 9, 2023
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE
- Publication number 20220396472
- Publication date Dec 15, 2022
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP
- Publication number 20220395254
- Publication date Dec 15, 2022
- BFLY Operations, Inc
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE AND SENSOR
- Publication number 20220364864
- Publication date Nov 17, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Hideki UEDA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW-STRESS PACKAGING STRUCTURE FOR MEMS ACCELERATION SENSOR CHIP
- Publication number 20220306458
- Publication date Sep 29, 2022
- ZHEJIANG UNIVERSITY
- Lufeng CHE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Arrangement and Method for Fabricating A Sensor Arrangement
- Publication number 20220260446
- Publication date Aug 18, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES
- Publication number 20220242722
- Publication date Aug 4, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Ting-Ta YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHYSICAL QUANTITY SENSOR AND SEMICONDUCTOR DEVICE
- Publication number 20220242723
- Publication date Aug 4, 2022
- DENSO CORPORATION
- Kazuaki MAWATARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGE
- Publication number 20220177298
- Publication date Jun 9, 2022
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220106186
- Publication date Apr 7, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Constraint For A Sensor Assembly
- Publication number 20220098029
- Publication date Mar 31, 2022
- MEASUREMENT SPECIALTIES, INC.
- Jose Fernando Alfaro Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

between the MEMS die and the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic sensors with sensor die in package structure cavity

Sensor package and method of producing the sensor package

Methods and apparatuses for packaging an ultrasound-on-a-chip

Sensor device and sensor

Method of forming monocrystalline nickel-titanium films on single c...

Stress isolation using three-dimensional trenches

Vibrator device, oscillator, gyro sensor, electronic apparatus, and...

Stress-isolated MEMS device comprising substrate having cavity and...

Application specific integrated circuit (ASIC) chip, and sensor and...

Micromechanical sensor device having an ASIC chip integrated into a...

Sensor device

MEMS strain gauge pressure sensor with mechanical symmetries

Constraint for a sensor assembly

MEMS assembly substrates including a bond layer

Low-stress packaging structure for MEMS acceleration sensor chip

MEMS stress reduction structure embedded into package

Low stress integrated device package

Surface micromechanical element and method for manufacturing the same

Method and apparatus for a transducer assembly with a standoff

Reducing delamination in sensor package

Semiconductor package structures and methods of manufacturing the same

Sensor package

Attachment of stress sensitive integrated circuit dies

Method for manufacturing micromechanical diaphragm sensors

Vibrator device, oscillator, gyro sensor, electronic apparatus, and...

Structures for packaging stress-sensitive micro-electro-mechanical...

Micromechanical pressure sensor device and corresponding manufactur...

Methods and apparatuses for packaging an ultrasound-on-a-chip

Inertial sensor, electronic instrument, vehicle, and method for man...

Use of an uncoupling structure for assembling a component having a...

Patents Applicationslast 30 patents

MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUB...

STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES

MEMS DIES EMBEDDED IN GLASS CORES

LENS AND EYEWEAR

STRESS ISOLATION PROCESS

MEMS MODULE

APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) CHIP, AND SENSOR AND...

MEMS MODULE

ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD

MICROELECTROMECHANICAL DEVICE AND PROCESS FOR MANUFACTURING A MICRO...

STRESS ISOLATION FOR INTEGRATED CIRCUIT PACKAGE INTEGRATION

MEMS DEVICE

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...

SINGLE-AXIS INERTIAL SENSOR MODULE WITH INTERPOSER

MICRO-MIRROR DIE ATTACHED TO A PACKAGE SUBSTRATE THROUGH DIE ATTACH...

Attachment of Stress Sensitive Integrated Circuit Dies

MONOCRYSTALLINE NICKEL-TITANIUM FILMS ON SINGLE CRYSTAL SILICON SUB...

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED...

Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...

PRESSURE SENSOR ASSEMBLY

MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE

METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP

SENSOR DEVICE AND SENSOR

LOW-STRESS PACKAGING STRUCTURE FOR MEMS ACCELERATION SENSOR CHIP

Sensor Arrangement and Method for Fabricating A Sensor Arrangement

STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES

PHYSICAL QUANTITY SENSOR AND SEMICONDUCTOR DEVICE

LOW STRESS INTEGRATED DEVICE PACKAGE

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

Constraint For A Sensor Assembly