Bonding interfaces of the semiconductor or solid state body

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CPC
H01L2224/8236

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8236Bonding interfaces of the semiconductor or solid state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including solder bracing material with a rough...
- Patent number 11,018,106
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,629,537
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 10,541,232
- Issue date Jan 21, 2020
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,290,584
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 10,163,863
- Issue date Dec 25, 2018
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductive packaging device and manufacturing method thereof
- Patent number 10,020,275
- Issue date Jul 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 9,553,075
- Issue date Jan 24, 2017
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die on a...
- Patent number 9,478,485
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- XuSheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
- Patent number 9,299,670
- Issue date Mar 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,230,884
- Issue date Jan 5, 2016
- Olympus Corporation
- Yoshiaki Takemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 9,147,669
- Issue date Sep 29, 2015
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacked semiconductor chips
- Patent number 9,087,883
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacked semiconductor chips
- Patent number 8,890,333
- Issue date Nov 18, 2014
- Samsung Electronics Co., Ltd.
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 8,742,561
- Issue date Jun 3, 2014
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using an anisotropically electroconductive adhesive havin...
- Patent number 5,120,665
- Issue date Jun 9, 1992
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for circuit connection, method for connection using the...
- Patent number 5,001,542
- Issue date Mar 19, 1991
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180301431
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED AND EMBEDDED DIE CORELESS PACKAGE
- Publication number 20180012871
- Publication date Jan 11, 2018
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED AND EMBEDDED DIE CORELESS PACKAGE
- Publication number 20140357024
- Publication date Dec 4, 2014
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
- Publication number 20140264945
- Publication date Sep 18, 2014
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS
- Publication number 20140008818
- Publication date Jan 9, 2014
- SeokHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20130256897
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layered Integrated Circuit Apparatus
- Publication number 20120091595
- Publication date Apr 19, 2012
- MAO BANG ELECTRONIC CO., LTD.
- Sung Chuan MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed and embedded die coreless package
- Publication number 20110156231
- Publication date Jun 30, 2011
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the semiconductor or solid state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device including solder bracing material with a rough...

Electronic module and method for producing same

Conductive vias in semiconductor packages and methods of forming same

Recessed and embedded die coreless package

Conductive vias in semiconductor packages and methods of forming same

Recessed and embedded die coreless package

Semiconductive packaging device and manufacturing method thereof

Recessed and embedded die coreless package

Semiconductor device and method of stacking semiconductor die on a...

Stacked microelectronic packages having sidewall conductors and met...

Semiconductor device

Recessed and embedded die coreless package

Method and apparatus for stacked semiconductor chips

Apparatus for stacked semiconductor chips

Recessed and embedded die coreless package

Method of using an anisotropically electroconductive adhesive havin...

Composition for circuit connection, method for connection using the...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...

METHOD AND APPARATUS FOR STACKED SEMICONDUCTOR CHIPS

SUBSTRATE AND SEMICONDUCTOR DEVICE

Layered Integrated Circuit Apparatus

Recessed and embedded die coreless package