Bonding of solid lids or wafers to the substrate

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B81C1/00269

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00269Bonding of solid lids or wafers to the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bond force concentrator
- Patent number 12,304,809
- Issue date May 20, 2025
- KYOCERA Technologies Oy
- Elmeri Österlund
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional stress-sensitive device
- Patent number 12,264,063
- Issue date Apr 1, 2025
- Rosemount Aerospace Inc.
- John C. Christenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 12,258,265
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,258,266
- Issue date Mar 25, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Resonance device and resonance device manufacturing method
- Patent number 12,252,393
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package for device
- Patent number 12,209,012
- Issue date Jan 28, 2025
- Teknologian tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for fabricating a MEMS device
- Patent number 12,180,069
- Issue date Dec 31, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,168,605
- Issue date Dec 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 12,162,747
- Issue date Dec 10, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS mirror arrays with reduced crosstalk
- Patent number 12,103,843
- Issue date Oct 1, 2024
- CALIENT.AI INC.
- Scott A. Miller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 12,081,192
- Issue date Sep 3, 2024
- Stathera IP Holdings, Inc.
- Vamsy P. Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 12,071,342
- Issue date Aug 27, 2024
- Stathera IP Holding, Inc.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure including a cap with a via
- Patent number 12,043,542
- Issue date Jul 23, 2024
- Murata Manufacturing Co., Ltd.
- Altti Torkkeli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for a MEMS device
- Patent number 12,017,909
- Issue date Jun 25, 2024
- Imec VZW
- Deniz Sabuncuoglu Tezcan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,784,296
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for bonding of substrates
- Patent number 11,742,205
- Issue date Aug 29, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BOND FORCE CONCENTRATOR
- Publication number 20250236512
- Publication date Jul 24, 2025
- KYOCERA Technologies Oy
- Elmeri ÖSTERLUND
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inertial Sensor And Electronic Component
- Publication number 20250236511
- Publication date Jul 24, 2025
- SEIKO EPSON CORPORATION
- Tomonaga KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250230038
- Publication date Jul 17, 2025
- Vanguard International Semiconductor Corporation
- ROHIT PULIKKAL KIZHAKKEYIL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE
- Publication number 20250197194
- Publication date Jun 19, 2025
- Rosemount Aerospace Inc.
- John C. Christenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250197195
- Publication date Jun 19, 2025
- AAC TECHNOLOGIES PTE. LTD
- Veronica Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20250187907
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250145456
- Publication date May 8, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND FORCE CONCENTRATOR
- Publication number 20250136438
- Publication date May 1, 2025
- KYOCERA Technologies Oy
- Elmeri ÖSTERLUND
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250115473
- Publication date Apr 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang HSIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...
- Publication number 20250109015
- Publication date Apr 3, 2025
- Murata Manufacturing Co., Ltd.
- Jeanette LINDROOS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE
- Publication number 20250074766
- Publication date Mar 6, 2025
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250011165
- Publication date Jan 9, 2025
- Vanguard International Semiconductor Corporation
- JIA JIE XIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF MANUFACTURE OF MEMS MIRROR ARRAYS WITH REDUCED CROSSTALK
- Publication number 20240417242
- Publication date Dec 19, 2024
- Calient.AI Inc.
- Scott A. MILLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...
- Publication number 20240409398
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Konsta HANNULA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR
- Publication number 20240317579
- Publication date Sep 26, 2024
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...
- Publication number 20240253978
- Publication date Aug 1, 2024
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMI...
- Publication number 20240199414
- Publication date Jun 20, 2024
- TOKYO KEIKI INC.
- Takayoshi Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE
- Publication number 20240166499
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- Mikko PARTANEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulated MEMS Switching Element, Device and Production Method
- Publication number 20240150166
- Publication date May 9, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Oliver Raab
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240051818
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding of solid lids or wafers to the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Seal for microelectronic assembly

Bond force concentrator

Three-dimensional stress-sensitive device

Bonding process for forming semiconductor device structure

Method and system for fabricating a MEMS device

Resonance device and resonance device manufacturing method

MEMS packages and methods of manufacture thereof

Wafer level package for device

Method and system for fabricating a MEMS device

Semiconductor device package and a method of manufacturing the same

Enclosed cavity structures

Undercut-free patterned aluminum nitride structure and methods for...

MEMS mirror arrays with reduced crosstalk

Bonded structures

Methods and devices for microelectromechanical resonators

Micro-acoustic wafer-level package and method of manufacture

Methods and devices for microelectromechanical resonators

MEMS structure including a cap with a via

Fabrication method for a MEMS device

Enclosed cavity structures

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

Wafer level stacked structures having integrated passive features

Enclosed cavity structures

Semiconductor device package and a method of manufacturing the same

Bonding process for forming semiconductor device structure

Method and device for bonding of substrates

Eutectic bonding with AlGe

Packaging method and associated packaging structure

Patents Applicationslast 30 patents

BOND FORCE CONCENTRATOR

Inertial Sensor And Electronic Component

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

BOND FORCE CONCENTRATOR

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MICROELECTROMECHANICAL COMPONENT WITH GAP-CONTROL STRUCTURE AND A M...

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

BONDED STRUCTURES

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

METHODS OF MANUFACTURE OF MEMS MIRROR ARRAYS WITH REDUCED CROSSTALK

ENCLOSURE

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURIN...

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

MEMS SENSOR, AND METHOD FOR MANUFACTURING MEMS SENSOR

WIRING BOARD ASSEMBLY, LID ASSEMBLY, PACKAGE SET, AND METHOD FOR MA...

METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMI...

METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE

Encapsulated MEMS Switching Element, Device and Production Method

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE