Bonding of solid lids or wafers to the substrate

Industry

CPC
B81C1/00269

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00269Bonding of solid lids or wafers to the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method for a MEMS device
- Patent number 12,017,909
- Issue date Jun 25, 2024
- Imec VZW
- Deniz Sabuncuoglu Tezcan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,981,559
- Issue date May 14, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,897,760
- Issue date Feb 13, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,884,537
- Issue date Jan 30, 2024
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Enclosed cavity structures
- Patent number 11,834,330
- Issue date Dec 5, 2023
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,784,296
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for bonding of substrates
- Patent number 11,742,205
- Issue date Aug 29, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for manufacturing flexible electronics
- Patent number 11,688,640
- Issue date Jun 27, 2023
- Next Biometrics Group ASA
- Tian Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 11,664,781
- Issue date May 30, 2023
- STATHERA IP HOLDINGS INC.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS vibrator and MEMS oscillator
- Patent number 11,655,145
- Issue date May 23, 2023
- Kaneka Corporation
- Junji Sone
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs using outgassing material to adjust the pressure level in a ca...
- Patent number 11,634,318
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device manufacturing method and mems device
- Patent number 11,597,648
- Issue date Mar 7, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Power electronics assemblies with CIO bonding layers and double sid...
- Patent number 11,527,458
- Issue date Dec 13, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for manufacturing the same
- Patent number 11,518,673
- Issue date Dec 6, 2022
- MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Yu-Hao Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus having a bondline structure and a diffusion barrier with...
- Patent number 11,505,451
- Issue date Nov 22, 2022
- Texas Instruments Incorporated
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical device having a damper struc...
- Patent number 11,505,455
- Issue date Nov 22, 2022
- Robert Bosch GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 11,479,460
- Issue date Oct 25, 2022
- STATHERA IP HOLDINGS INC.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,430,728
- Issue date Aug 30, 2022
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMI...
- Publication number 20240199414
- Publication date Jun 20, 2024
- TOKYO KEIKI INC.
- Takayoshi Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE
- Publication number 20240166499
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- Mikko PARTANEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulated MEMS Switching Element, Device and Production Method
- Publication number 20240150166
- Publication date May 9, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Oliver Raab
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...
- Publication number 20240124299
- Publication date Apr 18, 2024
- STMicroelectronics S.r.l.
- Paolo FERRARI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240051818
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
- Publication number 20240043265
- Publication date Feb 8, 2024
- STMicroelectronics S.r.l.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE
- Publication number 20230339741
- Publication date Oct 26, 2023
- Rosemount Aerospace Inc.
- John C. Christenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS
- Publication number 20230308076
- Publication date Sep 28, 2023
- Stathera IP Holdings Inc.
- Vamsy P. Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20230249961
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YUAN-CHIH HSIEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...
- Publication number 20230174373
- Publication date Jun 8, 2023
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20230128755
- Publication date Apr 27, 2023
- SCHOTT AG
- Antti Määttänen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE BONDLINE CONTROL STRUCTURE
- Publication number 20230064645
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ganapathy Subramaniam Sivakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230050181
- Publication date Feb 16, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS
- Publication number 20230051438
- Publication date Feb 16, 2023
- Stathera IP Holdings Inc.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP
- Publication number 20230045563
- Publication date Feb 9, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES
- Publication number 20220367339
- Publication date Nov 17, 2022
- GENERAL ELECTRIC COMPANY
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20220325396
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTENNA APPARATUS
- Publication number 20220271416
- Publication date Aug 25, 2022
- SOFANT TECHNOLOGIES LTD.
- Nakul Raghavanand HARIDAS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20220123192
- Publication date Apr 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Mei-Yi WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220112075
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bonding of solid lids or wafers to the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabrication method for a MEMS device

Enclosed cavity structures

Enclosed cavity structures

Sensing module and manufacturing method thereof

Enclosed cavity structures

Wafer level stacked structures having integrated passive features

Enclosed cavity structures

Semiconductor device package and a method of manufacturing the same

Bonding process for forming semiconductor device structure

Method and device for bonding of substrates

Eutectic bonding with AlGe

Packaging method and associated packaging structure

Systems and methods for manufacturing flexible electronics

MEMS packages and methods of manufacture thereof

Capping plate for panel scale packaging of MEMS products

Microelectromechanical structure with bonded cover

Optical electronics device

Bonded structures

Methods and devices for microelectromechanical resonators

MEMS vibrator and MEMS oscillator

MEMs using outgassing material to adjust the pressure level in a ca...

Packaged die and assembling method

MEMS device manufacturing method and mems device

Power electronics assemblies with CIO bonding layers and double sid...

MEMS device and method for manufacturing the same

Apparatus having a bondline structure and a diffusion barrier with...

Method for producing a micromechanical device having a damper struc...

Methods and devices for microelectromechanical resonators

Wafer level stacked structures having integrated passive features

Seal for microelectronic assembly

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING CURVED SURFACE SUPPORT STRUCTURE, AND HEMI...

METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE

Encapsulated MEMS Switching Element, Device and Production Method

PROCESS FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE INCLUDI...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

BONDED STRUCTURES

THREE-DIMENSIONAL STRESS-SENSITIVE DEVICE

METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS

MEMS Packages and Methods of Manufacture Thereof

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...

HERMETICALLY SEALED PACKAGE AND METHOD FOR PRODUCING SAME

SENSING MODULE AND MANUFACTURING METHOD THEREOF

PROTECTIVE BONDLINE CONTROL STRUCTURE

Wafer level package for device

METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

SEAL FOR MICROELECTRONIC ASSEMBLY

WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

ANTENNA APPARATUS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

MEMS PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE