Bump connectors having different shapes

Industry

CPC
H01L2224/17051

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17051Bump connectors having different shapes

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,021,042
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,817,444
- Issue date Nov 14, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,705,415
- Issue date Jul 18, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
- Patent number 11,694,898
- Issue date Jul 4, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer method, display device, chip and target substrate
- Patent number 11,616,043
- Issue date Mar 28, 2023
- BOE Technology Group Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 11,502,051
- Issue date Nov 15, 2022
- SK hynix Inc.
- Ho Young Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,348,911
- Issue date May 31, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 11,264,342
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,049,826
- Issue date Jun 29, 2021
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,964,659
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 10,950,568
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 10,923,447
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D die stacking structure with fine pitches
- Patent number 10,854,577
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,576
- Issue date Dec 1, 2020
- TOSHIBA MEMORY CORPORATION
- Yuji Karakane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible transmitter circuitry for integrated circuits
- Patent number 10,848,155
- Issue date Nov 24, 2020
- Intel Corporation
- Chee Seng Leong
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure
- Publication number 20250219031
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20250096178
- Publication date Mar 20, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...
- Publication number 20250096091
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Chiao-Yi TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
- Publication number 20250079376
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS
- Publication number 20250006685
- Publication date Jan 2, 2025
- JCET Management Co., Ltd.
- Zhan YING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
- Publication number 20240429191
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421112
- Publication date Dec 19, 2024
- Rohm Co., Ltd.
- Yuta KASHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240312930
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240312940
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222330
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Youngjun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230935
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
- Publication number 20220392862
- Publication date Dec 8, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
- Publication number 20220293543
- Publication date Sep 15, 2022
- DIC CORPORATION
- Ryota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220231007
- Publication date Jul 21, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220157803
- Publication date May 19, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS

Bump connectors having different shapes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of forming same

Wire bond wires for interference shielding

Microelectronic package with solder array thermal interface materia...

Multi-chip packaging

Active bridge enabled co-packaged photonic transceiver

Semiconductor device assembly with die support structures

Semiconductor device assembly with surface-mount die support struct...

Semiconductor package and method of manufacturing the same

Pad structure design in fan-out package

Multi-chip packaging

Wire bond wires for interference shielding

Microelectronic package with solder array thermal interface materia...

Semiconductor device and semiconductor device manufacturing method

Hybrid fine line spacing architecture for bump pitch scaling

Chip transfer method, display device, chip and target substrate

Semiconductor chip including through electrode, and semiconductor p...

Wire bond wires for interference shielding

Pad structure design in fan-out package

Multi-chip packaging

Semiconductor packages and methods of forming same

Package on package structure and method for forming the same

Surface mounting semiconductor components

Semiconductor device and semiconductor device manufacturing method

Semiconductor device

Semiconductor device assembly with surface-mount die support struct...

Semiconductor device assembly with die support structures

Mechanisms for forming hybrid bonding structures with elongated bumps

3D die stacking structure with fine pitches

Semiconductor device and manufacturing method thereof

Flexible transmitter circuitry for integrated circuits

Patents Applicationslast 30 patents

Semiconductor Packages and Methods of Forming Same

Semiconductor structure

PRINTED CIRCUIT BOARD

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS

SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...

ELECTRONIC DEVICE

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

MULTI-CHIP PACKAGING

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...

Pad Structure Design in Fan-Out Package

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

Semiconductor Packages and Methods of Forming Same

Chip Package on Package Structure, Packaging Method Thereof, and El...

MULTI-CHIP PACKAGING

MULTI-CHIP PACKAGING