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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80047by mechanical means

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding tool and bonding method thereof
- Patent number 12,009,337
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,978,719
- Issue date May 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure, electronic substrate and method of ma...
- Patent number 11,978,706
- Issue date May 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,798,913
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,784,123
- Issue date Oct 10, 2023
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal-dielectric bonding method and structure
- Patent number 11,495,569
- Issue date Nov 8, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for improved electrical contact between bond...
- Patent number 11,289,421
- Issue date Mar 29, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous 3D chip stack for a mobile processor
- Patent number 10,658,335
- Issue date May 19, 2020
- FutureWei Technologies, Inc.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing RF filters
- Patent number 10,636,776
- Issue date Apr 28, 2020
- GLOBALFOUNDRIES Inc.
- Md. Sayed Kaysar Bin Rahim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate structure
- Patent number 10,468,400
- Issue date Nov 5, 2019
- Samsung Electronics Co., Ltd.
- Pil Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode device and method for manufacturing same
- Patent number 9,318,666
- Issue date Apr 19, 2016
- Advanced Optoelectronics Technology, Inc.
- Hsing-Fen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and structure
- Patent number 9,099,526
- Issue date Aug 4, 2015
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 8,742,595
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 8,497,148
- Issue date Jul 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
BONDING TOOL AND BONDING METHOD THEREOF
- Publication number 20240297143
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YUAN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240105674
- Publication date Mar 28, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20230361072
- Publication date Nov 9, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...
- Publication number 20230061684
- Publication date Mar 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20230005876
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20220238479
- Publication date Jul 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...
- Publication number 20220181251
- Publication date Jun 9, 2022
- Intel Corporation
- Richard Vreeland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...
- Publication number 20210407883
- Publication date Dec 30, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masataka HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-DIELECTRIC BONDING METHOD AND STRUCTURE
- Publication number 20210210459
- Publication date Jul 8, 2021
- Yangtze Memory Technologies Co., Ltd.
- Siping HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20210202428
- Publication date Jul 1, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND A...
- Publication number 20200075533
- Publication date Mar 5, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20190237419
- Publication date Aug 1, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE STRUCTURE
- Publication number 20180226390
- Publication date Aug 9, 2018
- Samsung Electronics Co., Ltd.
- Pil Kyu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20150348935
- Publication date Dec 3, 2015
- Shawn O'Rourke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20140291720
- Publication date Oct 2, 2014
- ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
- HSING-FEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICES AND METHODS OF FORMING SAME
- Publication number 20140151823
- Publication date Jun 5, 2014
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming Same
- Publication number 20130020718
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20120091587
- Publication date Apr 19, 2012
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20100297829
- Publication date Nov 25, 2010
- The Arizona Board of Regents, a body corporate acting for and on behalf of Ar...
- Shawn O'Rourke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by mechanical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures

Bonding tool and bonding method thereof

Metal-dielectric bonding method and structure

Electronic package structure, electronic substrate and method of ma...

Bond enhancement structure in microelectronics for trapping contami...

Conductive barrier direct hybrid bonding

Metal-dielectric bonding method and structure

Methods and structures for improved electrical contact between bond...

Hybrid bonding structure and hybrid bonding method

Bonded structures

Metal-dielectric bonding method and structure

Bond enhancement structure in microelectronics for trapping contami...

Methods and structures for improved electrical contact between bond...

Conductive barrier direct hybrid bonding

Bonded structures

Heterogenous 3D chip stack for a mobile processor

Methods of manufacturing RF filters

Method for bonding substrates together, and substrate bonding device

Method of manufacturing substrate structure

Method for bonding substrates

Light emitting diode device and method for manufacturing same

Integrated circuit device and structure

MEMS devices and methods of forming same

MEMS devices and methods of forming same

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

BONDING TOOL AND BONDING METHOD THEREOF

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BONDED STRUCTURE AND METHOD OF FORMING SAME

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

BONDED STRUCTURES

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MA...

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED...

GRAPHITE THIN FILM/SILICON SUBSTRATE LAMINATED ASSEMBLY, PROCESS FO...

METAL-DIELECTRIC BONDING METHOD AND STRUCTURE

BONDED STRUCTURES

BOND ENHANCEMENT IN MICROELECTRONICS BY TRAPPING CONTAMINANTS AND A...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

Method of Temporarily Attaching a Rigid Carrier to a Substrate

LIGHT EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING SAME

MEMS DEVICES AND METHODS OF FORMING SAME

MEMS Devices and Methods of Forming Same

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

Method of Temporarily Attaching a Rigid Carrier to a Substrate