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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L23/3731
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package device with dedicated heat-dissipation featur...
Patent number
11,972,998
Issue date
Apr 30, 2024
Shunsin Technology (Zhong Shan) Limited
Shun-Hsing Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip device and method of formation
Patent number
11,967,582
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
RE49912
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Akihiro Kimura
Information
Patent Grant
Thermal management for package on package assembly
Patent number
11,935,877
Issue date
Mar 19, 2024
Applied Materials, Inc.
Itai Leshniak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and electronic device
Patent number
11,929,301
Issue date
Mar 12, 2024
NGK Electronics Devices, Inc.
Naoya Shirai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
Patent number
11,810,845
Issue date
Nov 7, 2023
OSRAM OLED GmbH
Jörg Erich Sorg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Compressible foamed thermal interface materials and methods of maki...
Patent number
11,776,928
Issue date
Oct 3, 2023
Laird Technologies, Inc.
Vijayaraghavan Rajagopal
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Chip package
Patent number
11,776,867
Issue date
Oct 3, 2023
Industrial Technology Research Institute
Kuo-Shu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vapor chamber structure
Patent number
11,765,861
Issue date
Sep 19, 2023
Asia Vital Components Co., Ltd.
Hsiu-Wei Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of manufacturing a power semiconductor component arrangement...
Patent number
11,749,533
Issue date
Sep 5, 2023
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Steffen Ziesche
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out interconnect integration processes and structures
Patent number
11,699,651
Issue date
Jul 11, 2023
Applied Materials, Inc.
Richard W. Plavidal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High thermal conductivity vias by additive processing
Patent number
11,676,880
Issue date
Jun 13, 2023
Texas Instruments Incorporated
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip device and method of formation
Patent number
11,637,087
Issue date
Apr 25, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Continuous boron nitride nanotube fibers
Patent number
11,623,865
Issue date
Apr 11, 2023
BNNT, LLC
Michael W. Smith
D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information
Patent Grant
Aluminum nitride film, method of manufacturing aluminum nitride fil...
Patent number
11,572,275
Issue date
Feb 7, 2023
Shibaura Institute of Technology
Atsushi Yumoto
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Carrier substrate with a thick metal interlayer and a cooling struc...
Patent number
11,564,307
Issue date
Jan 24, 2023
Rogers Germany GmbH
Andreas Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power overlay module and method of assembling
Patent number
11,551,993
Issue date
Jan 10, 2023
GE Aviation Systems LLC
David Richard Esler
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Semiconductor device
Patent number
11,551,992
Issue date
Jan 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jhih-Yang Yan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging structure having antenna module
Patent number
11,515,269
Issue date
Nov 29, 2022
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure having antenna module
Patent number
11,508,675
Issue date
Nov 22, 2022
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor device package
Patent number
11,508,710
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Basic structural body for constructing heat dissipation device and...
Patent number
11,466,937
Issue date
Oct 11, 2022
Asia Vital Components Co., Ltd.
Kuei-Feng Chiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for mounting an electrical component in which a hood is used...
Patent number
11,424,170
Issue date
Aug 23, 2022
Siemens Aktiengesellschaft
Nora Busche
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LED module
Patent number
11,417,583
Issue date
Aug 16, 2022
TDK ELECTRONICS AG
Thomas Feichtinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
11,387,159
Issue date
Jul 12, 2022
Industrial Technology Research Institute
Kuo-Shu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alkali-free glass substrate, laminated substrate, and method for ma...
Patent number
11,370,694
Issue date
Jun 28, 2022
AGC Inc.
Shuhei Nomura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device and manufacturing method thereof
Patent number
11,335,666
Issue date
May 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IGBT module with heat dissipation structure and method for manufact...
Patent number
11,302,601
Issue date
Apr 12, 2022
AMULAIRE THERMAL TECHNOLOGY, INC.
Tzu-Hsuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carbon nanotube-based thermal interface materials and methods of ma...
Patent number
11,302,603
Issue date
Apr 12, 2022
Carbice Corporation
Baratunde Cola
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Compressible foamed thermal interface materials and methods of maki...
Patent number
11,276,662
Issue date
Mar 15, 2022
Vijayaraghavan Rajagopal
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
HEAT CONDUCTOR AND THERMAL MANAGEMENT PART
Publication number
20240145335
Publication date
May 2, 2024
Shinko Electric Industries Co., Ltd.
Takamasa NAGASAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE
Publication number
20240145331
Publication date
May 2, 2024
HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Hitoshi NISHIMORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
Publication number
20240128154
Publication date
Apr 18, 2024
FURUKAWA ELECTRIC CO., LTD.
Minoru MORITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
Publication number
20240105663
Publication date
Mar 28, 2024
Laird Technologies, Inc.
Vijayaraghavan RAJAGOPAL
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
CIRCUIT PACKAGE WITH IMPROVED THERMAL MANAGEMENT
Publication number
20240055319
Publication date
Feb 15, 2024
Qorvo US, Inc.
Matthew Irvine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240047294
Publication date
Feb 8, 2024
Mitsubishi Electric Corporation
Katsuhiko KONDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
Publication number
20240021494
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Sheh HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A TRANSISTOR WITH A HIGH DEGREE OF ELECTRON MO...
Publication number
20230420542
Publication date
Dec 28, 2023
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Elke MEISSNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT INTERCONNECT INTEGRATION PROCESSES AND STRUCTURES
Publication number
20230352402
Publication date
Nov 2, 2023
Applied Materials, Inc.
Richard W. Plavidal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
Publication number
20230307312
Publication date
Sep 28, 2023
TEXAS INSTRUMENTS INCORPORATED
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE SHEET AND DEVICE PROVIDED WITH THERMALLY CONDU...
Publication number
20230295398
Publication date
Sep 21, 2023
Showa Denko Materials Co., Ltd.
Mika KOBUNE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES FOR POWER STAGE ASSEMBLIES COMPRISING BOTTOM-COOLED SEMI...
Publication number
20230282540
Publication date
Sep 7, 2023
GaN Systems Inc.
Ruoyu HOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP DEVICE AND METHOD OF FORMATION
Publication number
20230260963
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE COOLING USING THERMORESPONSIVE MATERIALS
Publication number
20230253287
Publication date
Aug 10, 2023
Intel Corporation
Tsung-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL INTERFACE MATERIALS FOR THE INTERIOR, CENTER, AND EXTERIOR...
Publication number
20230223313
Publication date
Jul 13, 2023
G2F Tech Co., Ltd.
Jie-Qi LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HA...
Publication number
20230207420
Publication date
Jun 29, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PLACEMENT TABLE
Publication number
20230197500
Publication date
Jun 22, 2023
NGK Insulators, Ltd.
Seiya INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH DEDICATED HEAT-DISSIPATION FEATUR...
Publication number
20230130484
Publication date
Apr 27, 2023
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
SHUN-HSING LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230119240
Publication date
Apr 20, 2023
Fuji Electric Co., Ltd.
Katsumi TANIGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP DEVICE AND METHOD OF FORMATION
Publication number
20230063550
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
heat dissipation and electrical robustness in a three-dimensional p...
Publication number
20230035100
Publication date
Feb 2, 2023
Marvell Asia Pte Ltd.
Janak G. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermal Transfer, Management and Integrated Control Structure
Publication number
20230025988
Publication date
Jan 26, 2023
3D GLASS SOLUTIONS, INC
Jeb H. Flemming
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASIC STRUCTURAL BODY FOR CONSTRUCTING HEAT DISSIPATION DEVICE AND...
Publication number
20220412666
Publication date
Dec 29, 2022
Asia Vital Components Co., Ltd.
Kuei-Feng Chiang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THERMAL MANAGEMENT FOR PACKAGE ON PACKAGE ASSEMBLY
Publication number
20220406761
Publication date
Dec 22, 2022
Applied Materials, Inc.
Itai Leshniak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE STRUCTURE AND PACKAGE ARCHITECTURE
Publication number
20220384359
Publication date
Dec 1, 2022
Deep Thermal Technology Corporation
Lung-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
Publication number
20220342164
Publication date
Oct 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hao CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND ELECTRONIC DEVICE
Publication number
20220344236
Publication date
Oct 27, 2022
NGK Electronics Devices, Inc.
Naoya SHIRAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20220310473
Publication date
Sep 29, 2022
Industrial Technology Research Institute
Kuo-Shu Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH HIGH HEAT DISSIPATION PROPERTY USING HEXA...
Publication number
20220285244
Publication date
Sep 8, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Il Gyu CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
Publication number
20220246572
Publication date
Aug 4, 2022
Laird Technologies, Inc.
Vijayaraghavan RAJAGOPAL
F28 - HEAT EXCHANGE IN GENERAL