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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/06characterised by the material of the container or its electrical properties

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gas-permeable package lid of chip package structure and manufacturi...
- Patent number 12,191,219
- Issue date Jan 7, 2025
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die package stiffeners of metal alloys having ex...
- Patent number 12,183,688
- Issue date Dec 31, 2024
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 12,155,111
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Chung Ju Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound closed-type metal lid for semiconductor chip package
- Patent number 12,087,647
- Issue date Sep 10, 2024
- HOJET TECHNOLOGY CO., LTD.
- Ying-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies and cooling devices for cooling heat-genera...
- Patent number 12,062,593
- Issue date Aug 13, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 12,063,735
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device and preparation method t...
- Patent number 12,040,241
- Issue date Jul 16, 2024
- Xidian University
- Chen Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Create a protected layer for interconnects and devices in a package...
- Patent number 12,033,981
- Issue date Jul 9, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,033,905
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Koichiro Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 12,027,433
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing lid formed from translucent material
- Patent number 12,002,723
- Issue date Jun 4, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Hiroyuki Kusamori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound metal lid for semiconductor chip package
- Patent number 11,935,800
- Issue date Mar 19, 2024
- HOJET TECHNOLOGY CO., LTD.
- Ying-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,901,270
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Wen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a strained semiconductor device and corre...
- Patent number 11,837,558
- Issue date Dec 5, 2023
- STMicroelectronics S.r.l.
- Santo Alessandro Smerzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 11,824,009
- Issue date Nov 21, 2023
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,800,636
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor device based on mo...
- Patent number 11,728,368
- Issue date Aug 15, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hermetic package for a power semiconductor
- Patent number 11,721,600
- Issue date Aug 8, 2023
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and a method for producing a power semic...
- Patent number 11,581,230
- Issue date Feb 14, 2023
- Infineon Technologies AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 11,482,461
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board and semiconductor apparatus
- Patent number 11,417,575
- Issue date Aug 16, 2022
- Kyocera Corporation
- Takayuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
- Patent number 11,367,692
- Issue date Jun 21, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20240363456
- Publication date Oct 31, 2024
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240312851
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...
- Publication number 20240262738
- Publication date Aug 8, 2024
- Schott Japan Corporation
- Yutaka ONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240222206
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Takayuki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CURCUIT TO DIELECTRIC SUBSTRATE TRANSITION
- Publication number 20240222294
- Publication date Jul 4, 2024
- Analog Devices International Unlimited Company
- Fatih Kocer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POCKET FANOUT PACKAGE
- Publication number 20240194545
- Publication date Jun 13, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240194613
- Publication date Jun 13, 2024
- Mitsubishi Electric Corporation
- Hirotaku ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240186223
- Publication date Jun 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Wen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slot Bow-Tie Antenna On Package
- Publication number 20240178163
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20240047366
- Publication date Feb 8, 2024
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20230377880
- Publication date Nov 23, 2023
- SPHERA TECHNOLOGY GMBH
- Janine-Melanie POTRECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE
- Publication number 20230360982
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Martin Goldammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230360981
- Publication date Nov 9, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20230363083
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230352388
- Publication date Nov 2, 2023
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187323
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20230163034
- Publication date May 25, 2023
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY
- Publication number 20230145639
- Publication date May 11, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL
- Publication number 20230102688
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMEABLE ELEMENT
- Publication number 20230085480
- Publication date Mar 16, 2023
- Universitat Linz
- Thomas STOCKINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230080548
- Publication date Mar 16, 2023
- Rohm Co., Ltd.
- Shinya Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND CLOSED-TYPE METAL LID FOR SEMICONDUCTOR CHIP PACKAGE
- Publication number 20230062721
- Publication date Mar 2, 2023
- HOJET TECHNOLOGY CO., LTD.
- YING-LIN HSU
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material of the container or its electrical properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gas-permeable package lid of chip package structure and manufacturi...

Integrated circuit die package stiffeners of metal alloys having ex...

Electronic package

Compound closed-type metal lid for semiconductor chip package

Power device assemblies and cooling devices for cooling heat-genera...

Electronic substrate having differential coaxial vias

Devices and methods related to metallization of ceramic substrates...

Package structure for semiconductor device and preparation method t...

Create a protected layer for interconnects and devices in a package...

Semiconductor device and method for manufacturing the same

Integrated circuit packages to minimize stress on a semiconductor die

Semiconductor package and method for making the same

Sealing lid formed from translucent material

Semiconductor device

Integrated circuit package lids with polymer features

Compound metal lid for semiconductor chip package

Interposer chips and enclosures for quantum circuits

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device package

Process for manufacturing a strained semiconductor device and corre...

Semiconductor device and data transferring method for semiconductor...

Electronic substrate having differential coaxial vias

Semiconductor packaging method and semiconductor device based on mo...

Method for forming hermetic package for a power semiconductor

Integrated circuit packages to minimize stress on a semiconductor die

Power semiconductor module and a method for producing a power semic...

Device package with reduced radio frequency losses

Semiconductor package and method for making the same

Board and semiconductor apparatus

Lens cap for a transistor outline package

Patents Applicationslast 30 patents

ENCLOSURE

GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CURCUIT TO DIELECTRIC SUBSTRATE TRANSITION

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METAL POCKET FANOUT PACKAGE

POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE

Slot Bow-Tie Antenna On Package

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

MODULE

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

SEMICONDUCTOR DEVICE

GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...

SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY

FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL

PERMEABLE ELEMENT

ELECTRONIC APPARATUS

COMPOUND CLOSED-TYPE METAL LID FOR SEMICONDUCTOR CHIP PACKAGE