characterised by the material of the container or its electrical properties

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/06characterised by the material of the container or its electrical properties

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound metal lid for semiconductor chip package
- Patent number 11,935,800
- Issue date Mar 19, 2024
- HOJET TECHNOLOGY CO., LTD.
- Ying-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,901,270
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Shih-Wen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a strained semiconductor device and corre...
- Patent number 11,837,558
- Issue date Dec 5, 2023
- STMicroelectronics S.r.l.
- Santo Alessandro Smerzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and data transferring method for semiconductor...
- Patent number 11,824,009
- Issue date Nov 21, 2023
- PREFERRED NETWORKS, INC.
- Nobuyoshi Tanaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,800,636
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor device based on mo...
- Patent number 11,728,368
- Issue date Aug 15, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming hermetic package for a power semiconductor
- Patent number 11,721,600
- Issue date Aug 8, 2023
- Microsemi Corporation
- Saeed Shafiyan-Rad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and a method for producing a power semic...
- Patent number 11,581,230
- Issue date Feb 14, 2023
- Infineon Technologies AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 11,482,461
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board and semiconductor apparatus
- Patent number 11,417,575
- Issue date Aug 16, 2022
- Kyocera Corporation
- Takayuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens cap for a transistor outline package
- Patent number 11,367,692
- Issue date Jun 21, 2022
- Schott AG
- Robert Hettler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for manufacturing same
- Patent number 11,348,849
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Takeshi Hosomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale filter packaging using semiconductor wafers...
- Patent number 11,335,669
- Issue date May 17, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to metallization of ceramic substrates for shieldin...
- Patent number 11,277,901
- Issue date Mar 15, 2022
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customized module lid
- Patent number 11,270,919
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing hermetic sealing lid member
- Patent number 11,178,786
- Issue date Nov 16, 2021
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,160,163
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an encapsulation cover for an electronic p...
- Patent number 11,114,312
- Issue date Sep 7, 2021
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,107,776
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Seiichi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor device based on mo...
- Patent number 11,081,518
- Issue date Aug 3, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a strained semiconductor device and corre...
- Patent number 11,075,172
- Issue date Jul 27, 2021
- STMicroelectronics S.r.l.
- Santo Alessandro Smerzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package of using insulating frame
- Patent number 11,062,990
- Issue date Jul 13, 2021
- NEPES LAWEH CORPORATION
- Yongtae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material and a semiconductor container made of the same
- Patent number 11,056,409
- Issue date Jul 6, 2021
- Gudeng Precision Industrial Co., Ltd.
- Jyun-Yan Jiang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...
- Publication number 20240047366
- Publication date Feb 8, 2024
- Preferred Networks, Inc.
- Nobuyoshi TANAKA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE
- Publication number 20240030075
- Publication date Jan 25, 2024
- Wuhan Choice Technology Co,Ltd
- De WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20230377880
- Publication date Nov 23, 2023
- SPHERA TECHNOLOGY GMBH
- Janine-Melanie POTRECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE
- Publication number 20230360982
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Martin Goldammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230360981
- Publication date Nov 9, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20230363083
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230352388
- Publication date Nov 2, 2023
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES
- Publication number 20230298953
- Publication date Sep 21, 2023
- Intel Corporation
- Pouya Talebbeydokhti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS
- Publication number 20230197539
- Publication date Jun 22, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230187323
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Shinji TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...
- Publication number 20230163034
- Publication date May 25, 2023
- Industrial Technology Research Institute
- Lung-Tai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY
- Publication number 20230145639
- Publication date May 11, 2023
- Qorvo US, Inc.
- MD Hasnine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL
- Publication number 20230102688
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMEABLE ELEMENT
- Publication number 20230085480
- Publication date Mar 16, 2023
- Universitat Linz
- Thomas STOCKINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230080548
- Publication date Mar 16, 2023
- Rohm Co., Ltd.
- Shinya Hikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND CLOSED-TYPE METAL LID FOR SEMICONDUCTOR CHIP PACKAGE
- Publication number 20230062721
- Publication date Mar 2, 2023
- HOJET TECHNOLOGY CO., LTD.
- YING-LIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND METAL LID FOR SEMICONDUCTOR CHIP PACKAGE
- Publication number 20230068670
- Publication date Mar 2, 2023
- HOJET TECHNOLOGY CO., LTD.
- YING-LIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION PROTECTION FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTE...
- Publication number 20230062160
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Chong Leong Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20230060065
- Publication date Feb 23, 2023
- MEDIATEK INC.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20220384281
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONI...
- Publication number 20220344226
- Publication date Oct 27, 2022
- KYOCERA CORPORATION
- Takayuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20220338342
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure for Semiconductor Device and Preparation Method T...
- Publication number 20220319940
- Publication date Oct 6, 2022
- Xidian University
- Chen Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWER DEVICE ASSEMBLIES AND COOLING DEVICES FOR COOLING HEAT- GENER...
- Publication number 20220319956
- Publication date Oct 6, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...
- Publication number 20220285288
- Publication date Sep 8, 2022
- Intel Corporation
- Valery Ouvarov-Bancalero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...
- Publication number 20220189922
- Publication date Jun 16, 2022
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220084899
- Publication date Mar 17, 2022
- Mitsubishi Electric Corporation
- Hiroki SHIOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220068774
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Shih-Wen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220044978
- Publication date Feb 10, 2022
- Mitsubishi Electric Corporation
- Koichiro NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material of the container or its electrical properties

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Integrated circuit package lids with polymer features

Compound metal lid for semiconductor chip package

Interposer chips and enclosures for quantum circuits

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device package

Process for manufacturing a strained semiconductor device and corre...

Semiconductor device and data transferring method for semiconductor...

Electronic substrate having differential coaxial vias

Semiconductor packaging method and semiconductor device based on mo...

Method for forming hermetic package for a power semiconductor

Integrated circuit packages to minimize stress on a semiconductor die

Power semiconductor module and a method for producing a power semic...

Device package with reduced radio frequency losses

Semiconductor package and method for making the same

Board and semiconductor apparatus

Lens cap for a transistor outline package

Semiconductor apparatus and method for manufacturing same

Wafer level chip scale filter packaging using semiconductor wafers...

Methods related to metallization of ceramic substrates for shieldin...

Customized module lid

Photo-sensitive silicon package embedding self-powered electronic s...

Method for manufacturing hermetic sealing lid member

Electronic substrate having differential coaxial vias

Method for manufacturing an encapsulation cover for an electronic p...

Semiconductor device

Semiconductor packaging method and semiconductor device based on mo...

Process for manufacturing a strained semiconductor device and corre...

Semiconductor package of using insulating frame

Composite material and a semiconductor container made of the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

DIE SEALANT FOR CHIP PACKAGING AND PACKAGING STRUCTURE

ELECTRONICS UNIT AND METHOD FOR THE PRODUCTION THEREOF

METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

MODULE

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

COMPOSITE COMPONENT AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

INTERPOSER CHIPS AND ENCLOSURES FOR QUANTUM CIRCUITS

SEMICONDUCTOR DEVICE

GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURI...

SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY

FLIP CHIP SEMICONDUCTOR DEVICE PACKAGE WITH MOLD COMPOUND SEAL

PERMEABLE ELEMENT

ELECTRONIC APPARATUS

COMPOUND CLOSED-TYPE METAL LID FOR SEMICONDUCTOR CHIP PACKAGE

COMPOUND METAL LID FOR SEMICONDUCTOR CHIP PACKAGE

RADIATION PROTECTION FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTE...

LIDDED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONI...

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

Package Structure for Semiconductor Device and Preparation Method T...

POWER DEVICE ASSEMBLIES AND COOLING DEVICES FOR COOLING HEAT- GENER...

INTEGRATED CIRCUIT DIE PACKAGE STIFFENERS OF METAL ALLOYS HAVING EX...

CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME