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Film covers for sensor packages
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Patent number 11,972,994
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Issue date Apr 30, 2024
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Texas Instruments Incorporated
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Sreenivasan Kalyani Koduri
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure
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Patent number 11,955,397
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Issue date Apr 9, 2024
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Vanguard International Semiconductor Corporation
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Shin-Cheng Lin
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H01 - BASIC ELECTRIC ELEMENTS
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Die and package structure
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Patent number 11,948,904
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Issue date Apr 2, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Wei-Chih Chen
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package structure
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Patent number 11,942,385
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Issue date Mar 26, 2024
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Advanced Semiconductor Engineering, Inc.
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Sheng-Yu Chen
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H01 - BASIC ELECTRIC ELEMENTS
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Polyimides
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Patent number 11,939,428
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Issue date Mar 26, 2024
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Fujifilm Electronic Materials U.S.A., Inc.
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Binod B. De
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H01 - BASIC ELECTRIC ELEMENTS
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