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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/29characterised by the material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,249,548
- Issue date Mar 11, 2025
- SK Hynix Inc.
- Sang Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sheet
- Patent number 12,247,124
- Issue date Mar 11, 2025
- Lintec Corporation
- Yasutaka Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,243,792
- Issue date Mar 4, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) semiconductor device having thin substrate
- Patent number 12,243,808
- Issue date Mar 4, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cured product and production method of same, and resin sheet and re...
- Patent number 12,227,631
- Issue date Feb 18, 2025
- Ajinomoto Co., Inc.
- Hiroyuki Sakauchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of manufacturing a package having an adhesion promoter
- Patent number 12,230,547
- Issue date Feb 18, 2025
- Infineon Technologies AG
- Edmund Riedl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Type III-V semiconductor device with structured passivation
- Patent number 12,230,700
- Issue date Feb 18, 2025
- Infineon Technologies Austria AG
- Simone Lavanga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulant strength enhancer
- Patent number 12,218,018
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free semiconductor device assemblies with multiple semico...
- Patent number 12,211,798
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal dissipation in flip-chip semiconductor devices usi...
- Patent number 12,211,763
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zone-controlled rare-earth oxide ALD and CVD coatings
- Patent number 12,209,307
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electron mobility transistor and method of manufacturing the same
- Patent number 12,199,174
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Junhyuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a supporting member and bonded metal layers
- Patent number 12,191,223
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Xiaopeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid compression molding or encapsulant compositions
- Patent number 12,187,843
- Issue date Jan 7, 2025
- Henkel AG & Co. KGaA
- Jay Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including protective layer
- Patent number 12,183,645
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Kazunori Inoue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250079287
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK
- Publication number 20250079345
- Publication date Mar 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ian McCallum-Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE
- Publication number 20250079348
- Publication date Mar 6, 2025
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250079249
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...
- Publication number 20250079334
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...
- Publication number 20250079340
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...
- Publication number 20250079252
- Publication date Mar 6, 2025
- AMOGREENTECH CO., LTD.
- In Yong SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...
- Publication number 20250079271
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Naoki YOSHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079291
- Publication date Mar 6, 2025
- Mitsubishi Electric Corporation
- Shinji SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS
- Publication number 20250069969
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD,...
- Publication number 20250068070
- Publication date Feb 27, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki URANO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070082
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Sojeong HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE
- Publication number 20250069970
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Isabelle Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...
- Publication number 20250069982
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...
- Publication number 20250068074
- Publication date Feb 27, 2025
- Asahi Kasei Kabushiki Kaisha
- Takeki SHIMIZU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...
- Publication number 20250062169
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Frederik Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE
- Publication number 20250062175
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250062138
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250063745
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20250062170
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Markus Wiesemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20250062137
- Publication date Feb 20, 2025
- INFINEON TECHNOLOGIES AG
- Markus Wiesemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062302
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION
- Publication number 20250054827
- Publication date Feb 13, 2025
- VISHAY GENERAL SEMICONDUCTOR, LLC
- Wan-Lan CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250054926
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Manufacturing method of a system in package having several layers a...
- Publication number 20250038121
- Publication date Jan 30, 2025
- THALES
- Damien CHALAVOUX
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor package and method manufacturing the same

Semiconductor device and methods of manufacture

Resin sheet

Microelectronic structures including bridges

Chip scale package (CSP) semiconductor device having thin substrate

Semiconductor package

Cured product and production method of same, and resin sheet and re...

Method of manufacturing a package having an adhesion promoter

Package structure with warpage-control element

Type III-V semiconductor device with structured passivation

Methods for registration of circuit dies and electrical interconnects

Semiconductor module and power conversion apparatus

Semiconductor encapsulant strength enhancer

Chip package structure having molding layer

Electronic device

Glass carrier having protection structure and manufacturing method...

Semiconductor device and method of manufacturing the same

Substrate-free semiconductor device assemblies with multiple semico...

Enhanced thermal dissipation in flip-chip semiconductor devices usi...

Highly protective wafer edge sidewall protection layer

Zone-controlled rare-earth oxide ALD and CVD coatings

Electronic package including a protection layer

High electron mobility transistor and method of manufacturing the same

Semiconductor module

Semiconductor device with a supporting member and bonded metal layers

Liquid compression molding or encapsulant compositions

Semiconductor device with a dielectric between portions

Thermal conductive film

Electronic component including protective layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED PASSIVE DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

REINFORCEMENT STRUCTURES FOR MULTI-DIE SEMICONDUCTOR PACKAGES AND M...

THROUGH WAFER TRENCH ISOLATION BETWEEN TRANSISTORS IN AN INTEGRATED...

INSULATION SHEET FOR CHIP ON FILM, INSULATION CHIP ON FILM PACKAGE...

SEMICONDUCTOR DEVICE, POWER CONVERTER, AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD,...

SEMICONDUCTOR PACKAGE

ANTI-CORROSION PARTICLES IN SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PO...

APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...

SUBSTRATE AND METHOD OF PRODUCING A SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

SEMICONDUCTOR PACKAGE

STACKED MULTI-CHIP STRUCTURE WITH ENHANCED PROTECTION

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD

DISPLAY MODULE AND SYSTEM APPLICATIONS

Manufacturing method of a system in package having several layers a...