Chemical mechanical polishing [CMP]

Industry

CPC
H01L2224/03616

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03616Chemical mechanical polishing [CMP]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Process flow for fabrication of cap metal over top metal with sinte...
- Patent number 12,159,846
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 12,154,876
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element and electronic apparatus
- Patent number 12,051,713
- Issue date Jul 30, 2024
- Sony Group Corporation
- Keishi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for copper dishing control
- Patent number 12,033,964
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,444
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Manikandan Arumugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,923,326
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 11,776,923
- Issue date Oct 3, 2023
- Sony Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,462,503
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
- Patent number 11,456,266
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure and method
- Patent number 11,424,205
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer planarization and an image sensor made by the same
- Patent number 11,417,536
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Joo Hee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanted conductive layers and method for...
- Patent number 11,398,441
- Issue date Jul 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup element and electronic apparatus
- Patent number 11,398,518
- Issue date Jul 26, 2022
- Sony Corporation
- Keishi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pads including interfacial electromigration barrier layers...
- Patent number 11,270,963
- Issue date Mar 8, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure with hybrid bonding structure and method of fab...
- Patent number 11,251,157
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First wafer, fabricating method thereof and wafer stack
- Patent number 11,211,348
- Issue date Dec 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlayer connection of stacked microelectronic components
- Patent number 11,171,117
- Issue date Nov 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250022823
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME
- Publication number 20250006672
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Interconnect Structure and Method
- Publication number 20240395748
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240347510
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258257
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Manikandan ARUMUGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...
- Publication number 20240213191
- Publication date Jun 27, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL CONTACT STRUCTURE
- Publication number 20240203917
- Publication date Jun 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING
- Publication number 20240014153
- Publication date Jan 11, 2024
- TOKYO ELECTRON LIMITED
- Takashi FUJIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...
- Publication number 20230402411
- Publication date Dec 14, 2023
- SONY GROUP CORPORATION
- Masaki HANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...
- Publication number 20230361066
- Publication date Nov 9, 2023
- SANDISK TECHNOLOGIES LLC
- Linghan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
- Publication date Oct 26, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20230299004
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Shinya OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230141447
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Wonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR CHIP
- Publication number 20230114550
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Yongbum KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL
- Publication number 20230066610
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20220406741
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process flow for fabrication of cap metal over top metal with sinte...

Semiconductor interconnect structure and method

Method of fabricating a semiconductor device

Bond pad with micro-protrusions for direct metallic bonding

Stacked semiconductor structure and method

Solid-state image pickup element and electronic apparatus

Chemical mechanical polishing for copper dishing control

Semiconductor structure and manufacturing method thereof

Method for fabricating semiconductor device with slanted conductive...

Bump structure and method of manufacturing bump structure

Multi-metal contact structure

Semiconductor device and method of manufacturing the same

Conductive barrier direct hybrid bonding

Semiconductor device, manufacturing method, solid state image senso...

Interconnect structure and method of forming same

Structure and method for semiconductor packaging

Stacked semiconductor structure and method

Chemical mechanical polishing for hybrid bonding

Semiconductor device and method of manufacturing thereof

Hybrid bonding using dummy bonding contacts

Bump structure and method of manufacturing bump structure

Semiconductor interconnect structure and method

Method for wafer planarization and an image sensor made by the same

Semiconductor device with slanted conductive layers and method for...

Solid-state image pickup element and electronic apparatus

Bonding pads including interfacial electromigration barrier layers...

Conductive barrier direct hybrid bonding

Die stack structure with hybrid bonding structure and method of fab...

First wafer, fabricating method thereof and wafer stack

Interlayer connection of stacked microelectronic components

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

HYBRID BONDING METHODS AND DEVICE ASSEMBLIES FORMED USING THE SAME

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor Interconnect Structure and Method

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

CONTROLLED GRAIN GROWTH FOR BONDING AND BONDED STRUCTURE WITH CONTR...

MULTI-METAL CONTACT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

SUBSTRATE BONDING SYSTEM AND METHOD FOR SUBSTRATE BONDING

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSO...

SEMICONDUCTOR DEVICES CONTAINING COPPER BONDING PADS WITH DIFFERENT...

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

Stacked Semiconductor Structure and Method

SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE