comprising an electrically conductive core

Industry

CPC
H05K3/4608

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4608comprising an electrically conductive core

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board assembly sheet
- Patent number 12,120,829
- Issue date Oct 15, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-printed ceramics with conductor infusion for ultra-high-speed el...
- Patent number 11,770,906
- Issue date Sep 26, 2023
- Schlumberger Technology Corporation
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated metal substrate
- Patent number 11,388,823
- Issue date Jul 12, 2022
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing graphene circuit pattern
- Patent number 11,372,300
- Issue date Jun 28, 2022
- BOE Technology Group Co., Ltd.
- Bo Hu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 11,343,907
- Issue date May 24, 2022
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board and method for manufacturing the same
- Patent number 11,234,331
- Issue date Jan 25, 2022
- HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with wall-side capacitors
- Patent number 11,158,568
- Issue date Oct 26, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite conductive substrate and manufacturing method thereof
- Patent number 11,089,678
- Issue date Aug 10, 2021
- Korea Electronics Technology Institute
- Chuljong Han
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing circuit board with embedded conductive circ...
- Patent number 11,058,014
- Issue date Jul 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Xiao-Yan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method of the same
- Patent number 10,939,562
- Issue date Mar 2, 2021
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,887,977
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,856,376
- Issue date Dec 1, 2020
- Lumileds LLC
- Zhihua Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for integrated LED driver
- Patent number 10,813,182
- Issue date Oct 20, 2020
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate printed board for making multiple printed circuit boar...
- Patent number 10,785,876
- Issue date Sep 22, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling component carrier material by carbon structure within diele...
- Patent number 10,736,222
- Issue date Aug 4, 2020
- AT&S Austria Technologies & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,645,819
- Issue date May 5, 2020
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,524,355
- Issue date Dec 31, 2019
- Nitto Denko Corporation
- Daisuke Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package having a parallel plate waveguide
- Patent number 10,453,742
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip card module and method for producing a chip card module
- Patent number 10,440,825
- Issue date Oct 8, 2019
- Infineon Technologies Austria AG
- Frank Pueschner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate, imaging unit and imaging device
- Patent number 10,412,824
- Issue date Sep 10, 2019
- Nikon Corporation
- Ryoichi Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,383,208
- Issue date Aug 13, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 10,362,667
- Issue date Jul 23, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae-Hong Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel plate waveguide for power semiconductor package
- Patent number 10,319,631
- Issue date Jun 11, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 10,278,282
- Issue date Apr 30, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in substrate and electronic component de...
- Patent number 10,264,681
- Issue date Apr 16, 2019
- Shinko Electric Industries Co., Ltd.
- Kenji Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser diode chip on printed circuit board
- Patent number 10,257,932
- Issue date Apr 9, 2019
- Microsoft Technology Licensing, LLC
- David Mandelboum
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electrical Devices
- Publication number 20240282517
- Publication date Aug 22, 2024
- Hutchinson Technology Incorporated
- Collin M. Grove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107684
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20230345640
- Publication date Oct 26, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Loading Pads for Impedance Management in Printed Circuit Board
- Publication number 20230319985
- Publication date Oct 5, 2023
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...
- Publication number 20230292431
- Publication date Sep 14, 2023
- TTM TECHNOLOGIES, INC.
- Niels Husted Kirkeby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230284394
- Publication date Sep 7, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...
- Publication number 20230069147
- Publication date Mar 2, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Well-Defined Outline Sidewall Cut by Short L...
- Publication number 20220061162
- Publication date Feb 24, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210337665
- Publication date Oct 28, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200315032
- Publication date Oct 1, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20200253046
- Publication date Aug 6, 2020
- Korea Electronics Technology Institute
- Chuljong HAN
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD FOR FORMING MULTILAYERED CIRCUIT PATTERN ON SURFACE OF THREE...
- Publication number 20200178399
- Publication date Jun 4, 2020
- MDM INC.
- Ku Yong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE
- Publication number 20190350076
- Publication date Nov 14, 2019
- Nikon Corporation
- Ryoichi SUGANUMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Hybrid Component Carrier and Method for Manufacturing the Same
- Publication number 20190297719
- Publication date Sep 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20190208630
- Publication date Jul 4, 2019
- Microsoft Technology Licensing, LLC
- David MANDELBOUM
- F21 - LIGHTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190200462
- Publication date Jun 27, 2019
- IBIDEN CO., LTD.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190200465
- Publication date Jun 27, 2019
- IBIDEN CO., LTD.
- Yoji Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling Component Carrier Material by Carbon Structure Within Diele...
- Publication number 20190174638
- Publication date Jun 6, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano de Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER
- Publication number 20190166669
- Publication date May 30, 2019
- Lumileds LLC
- Zhihua Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAMINATION BLIND AND METHOD FOR FORMING THE SAME
- Publication number 20190141840
- Publication date May 9, 2019
- R&D Circuits, Inc.
- Donald Eric Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Graphene-Graphane Printed Wiring Board
- Publication number 20190116663
- Publication date Apr 18, 2019
- Lockheed Martin Corporation
- David G. Findley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Component Carrier and Method for Manufacturing the Same
- Publication number 20180263105
- Publication date Sep 13, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE
- Publication number 20170374735
- Publication date Dec 28, 2017
- Nikon Corporation
- Ryoichi SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC TAPE COMPOSITIONS
- Publication number 20170303387
- Publication date Oct 19, 2017
- Heraeus Precious Metals North America Conshohocken LLC
- Samson SHAHBAZI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170303390
- Publication date Oct 19, 2017
- Nitto Denko Corporation
- Daisuke YAMAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Warpage Control With Intermediate Material
- Publication number 20170231086
- Publication date Aug 10, 2017
- AT & S Austria Technologie & Systemtechink Aktiengesellschaft
- Elisabeth Kreutzwiesner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

comprising an electrically conductive core

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board assembly sheet

Manufacturing method of insulated metal substrate

Component carrier with well-defined outline sidewall cut by short l...

Method for manufacturing multilayer printed circuit board

3D-printed ceramics with conductor infusion for ultra-high-speed el...

Insulated metal substrate

Method of preparing graphene circuit pattern

Substrate, imaging unit and imaging device

Multilayer laminate and method for producing multilayer printed wir...

Multilayer printed circuit board and method for manufacturing the same

Package with wall-side capacitors

Composite conductive substrate and manufacturing method thereof

Method of manufacturing circuit board with embedded conductive circ...

Multilayer board and manufacturing method of the same

Hybrid component carrier and method for manufacturing the same

Printed circuit board for integrated LED driver

Printed circuit board for integrated LED driver

Intermediate printed board for making multiple printed circuit boar...

Cooling component carrier material by carbon structure within diele...

Printed wiring board

Printed circuit board and method of manufacturing the same

Power semiconductor package having a parallel plate waveguide

Chip card module and method for producing a chip card module

Substrate, imaging unit and imaging device

Hybrid component carrier and method for manufacturing the same

Circuit board and manufacturing method thereof

Parallel plate waveguide for power semiconductor package

Substrate structure and manufacturing method thereof

Electronic component built-in substrate and electronic component de...

Laser diode chip on printed circuit board

Patents Applicationslast 30 patents

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

Method For Manufacturing Electrical Devices

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING CIRCUIT BOARD ASSEMBLY SHEET

Loading Pads for Impedance Management in Printed Circuit Board

SHIELDED SIGNAL VIAS IN PRINTED CIRCUIT BOARDS FOR HIGH-FREQUENCY A...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

3D-PRINTED CERAMICS WITH CONDUCTOR INFUSION FOR ULTRA-HIGH-SPEED EL...

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

Component Carrier With Well-Defined Outline Sidewall Cut by Short L...

MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER BOARD AND MANUFACTURING METHOD OF THE SAME

COMPOSITE CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING MULTILAYERED CIRCUIT PATTERN ON SURFACE OF THREE...

SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE

Hybrid Component Carrier and Method for Manufacturing the Same

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING BOARD

Cooling Component Carrier Material by Carbon Structure Within Diele...

PRINTED CIRCUIT BOARD FOR INTEGRATED LED DRIVER

SINGLE LAMINATION BLIND AND METHOD FOR FORMING THE SAME

Graphene-Graphane Printed Wiring Board

Hybrid Component Carrier and Method for Manufacturing the Same

SUBSTRATE, IMAGING UNIT AND IMAGING DEVICE

DIELECTRIC TAPE COMPOSITIONS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Warpage Control With Intermediate Material