comprising an eutectic alloy

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H01L2224/16502

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16502comprising an eutectic alloy

Industries

Patents Grantslast 30 patents

Information Patent Grant
Non-planar semiconductor device having conforming ohmic contacts
- Patent number 11,978,776
- Issue date May 7, 2024
- Intel Corporation
- Ashutosh Sagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive adhesive layer
- Patent number 11,805,685
- Issue date Oct 31, 2023
- Samsung Display Co., Ltd.
- Youngmin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method of fabricating same
- Patent number 11,569,195
- Issue date Jan 31, 2023
- Kore Semiconductor Co., Ltd.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,502,233
- Issue date Nov 15, 2022
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for packaging component
- Patent number 11,101,239
- Issue date Aug 24, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction structure
- Patent number 11,088,308
- Issue date Aug 10, 2021
- TDK Corporation
- Takasi Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,075,155
- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integration using Al—Ge eutectic bond interconnect
- Patent number 10,651,151
- Issue date May 12, 2020
- Invensense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,490,493
- Issue date Nov 26, 2019
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial alignment ring and self-soldering vias for wafer bonding
- Patent number 10,381,330
- Issue date Aug 13, 2019
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type semiconductor package
- Patent number 10,354,967
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction structure for an electronic device and electronic device
- Patent number 10,205,250
- Issue date Feb 12, 2019
- TDK Corporation
- Kenichi Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D integration using Al—Ge eutectic bond interconnect
- Patent number 9,754,922
- Issue date Sep 5, 2017
- Invensense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion solder bonding using solder preforms
- Patent number 9,683,278
- Issue date Jun 20, 2017
- Infineon Technologies AG
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,659,892
- Issue date May 23, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board, fabricating method thereof and package structure
- Patent number 8,674,503
- Issue date Mar 18, 2014
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220302095
- Publication date Sep 22, 2022
- Japan Display Inc.
- Kenichi TAKEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20220285596
- Publication date Sep 8, 2022
- XIAMEN SANAN OPTOELECTRONICS CO., LTD.
- Shiwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220037446
- Publication date Feb 3, 2022
- SAMSUNG DISPLAY CO., LTD.
- YOUNGMIN CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210202814
- Publication date Jul 1, 2021
- ULTRA DISPLAY TECHNOLOGY CORP.
- Hsien-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging Structure and Related Inner Lead Bonding Method
- Publication number 20200335474
- Publication date Oct 22, 2020
- SITRONIX TECHNOLOGY CORP.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION STRUCTURE
- Publication number 20200321499
- Publication date Oct 8, 2020
- TDK Corporation
- Takasi SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20200294959
- Publication date Sep 17, 2020
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHING-YU NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PACKAGING COMPONENT
- Publication number 20200258861
- Publication date Aug 13, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Zhibai ZHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200051902
- Publication date Feb 13, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190304941
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding
- Publication number 20180286836
- Publication date Oct 4, 2018
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180190579
- Publication date Jul 5, 2018
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180090459
- Publication date Mar 29, 2018
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
- Publication number 20170330863
- Publication date Nov 16, 2017
- InvenSense, Inc.
- Peter Smeys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY (BGA) APPARATUS AND METHODS
- Publication number 20170066088
- Publication date Mar 9, 2017
- Intel Corporation
- Mohit Sood
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFUSION SOLDER BONDING USING SOLDER PREFORMS
- Publication number 20160358890
- Publication date Dec 8, 2016
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160126204
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Takuya KADOGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20140291021
- Publication date Oct 2, 2014
- TDK Corporation
- Kenichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20130087906
- Publication date Apr 11, 2013
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package System Vertical Interconnect
- Publication number 20100084755
- Publication date Apr 8, 2010
- Mark Allen Gerber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Interconnect
- Publication number 20100015762
- Publication date Jan 21, 2010
- Mohammad Khan
- H01 - BASIC ELECTRIC ELEMENTS

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Non-planar semiconductor device having conforming ohmic contacts

Electronic device including conductive adhesive layer

Solder joints on nickel surface finishes without gold plating

Semiconductor packaging structure and method of fabricating same

Multilayered transient liquid phase bonding

Electronic device

Process for packaging component

Junction structure

Package structure and manufacturing method thereof

Metal pillar in a film-type seconductor package

3D integration using Al—Ge eutectic bond interconnect

Package structure and manufacturing method thereof

Sacrificial alignment ring and self-soldering vias for wafer bonding

Metal pillar in a film-type semiconductor package

Junction structure for an electronic device and electronic device

3D integration using Al—Ge eutectic bond interconnect

Diffusion solder bonding using solder preforms

Semiconductor device and method of manufacturing semiconductor device

Method for bonding wafers and structure of bonding part

Circuit board, fabricating method thereof and package structure

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

LIGHT-EMITTING DEVICE

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

ELECTRONIC DEVICE

ELECTRONIC DEVICE

Chip Packaging Structure and Related Inner Lead Bonding Method

JUNCTION STRUCTURE

SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD OF FABRICATING SAME

PROCESS FOR PACKAGING COMPONENT

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT

BALL GRID ARRAY (BGA) APPARATUS AND METHODS

DIFFUSION SOLDER BONDING USING SOLDER PREFORMS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

JUNCTION STRUCTURE FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE

CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE

Semiconductor Chip Package System Vertical Interconnect

Solder Interconnect