Connecting electric signal lines from the MEMS device with external electrical signal lines

Industry

CPC
B81C1/00301

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00301Connecting electric signal lines from the MEMS device with external electrical signal lines

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,897,761
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical contacting and method for producing an electrical contac...
- Patent number 11,897,758
- Issue date Feb 13, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical interconnection structure, electronic apparatus and manu...
- Patent number 11,884,536
- Issue date Jan 30, 2024
- AAC Technologies Pte. Ltd.
- Bharadwaja S.N. Shrowthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 11,664,781
- Issue date May 30, 2023
- STATHERA IP HOLDINGS INC.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 11,579,033
- Issue date Feb 14, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized vacuum package and methods of making same
- Patent number 11,551,921
- Issue date Jan 10, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Hayden James Evans McGuinness
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with flexible interconnect
- Patent number 11,542,152
- Issue date Jan 3, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for manufacturing an electronic device
- Patent number 11,492,250
- Issue date Nov 8, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic conductive feedthroughs for a semiconductor wafer
- Patent number 11,485,670
- Issue date Nov 1, 2022
- Medtronic, Inc.
- David A. Ruben
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure and packaging method for retinal prosthesis imp...
- Patent number 11,478,654
- Issue date Oct 25, 2022
- HANGZHOU NANOCHAP ELECTRONICS CO., LTD.
- Jiawei Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for microelectromechanical resonators
- Patent number 11,479,460
- Issue date Oct 25, 2022
- STATHERA IP HOLDINGS INC.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS transducing apparatus and method of fabricating the same
- Patent number 11,401,159
- Issue date Aug 2, 2022
- FORMOSA MATERIAL INDUSTRIAL CORP.
- Chun-Lung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor packages
- Patent number 11,401,158
- Issue date Aug 2, 2022
- ATLANTIC INERTIAL SYSTEMS, LIMITED
- Henry Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sound producing package structure and method for packaging sound pr...
- Patent number 11,395,073
- Issue date Jul 19, 2022
- xMEMS Labs, Inc.
- Hai-Hung Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS sensor
- Patent number 11,390,519
- Issue date Jul 19, 2022
- Robert Bosch GmbH
- Sebastian Schuler-Watkins
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,383,970
- Issue date Jul 12, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,352,252
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116752
- Publication date Apr 11, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE
- Publication number 20240116753
- Publication date Apr 11, 2024
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structure with Reduced Peeling and Methods Forming the Same
- Publication number 20240034619
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS
- Publication number 20230308076
- Publication date Sep 28, 2023
- Stathera IP Holdings Inc.
- Vamsy P. Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE
- Publication number 20230207412
- Publication date Jun 29, 2023
- Intel Corporation
- Ronald SPREITZER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOC PMUT SUITABLE FOR HIGH-DENSITY SYSTEM INTEGRATION, ARRAY CHIP,...
- Publication number 20230060728
- Publication date Mar 2, 2023
- NANJING SHENGXI XINYING TECHNOLOGY CO., LTD
- Hui LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level package for device
- Publication number 20230050181
- Publication date Feb 16, 2023
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS
- Publication number 20230051438
- Publication date Feb 16, 2023
- Stathera IP Holdings Inc.
- Vamsy Chodavarapu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20230034707
- Publication date Feb 2, 2023
- BFLY Operations, Inc
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230002217
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE
- Publication number 20220315413
- Publication date Oct 6, 2022
- MITSUMI ELECTRIC CO., LTD.
- Etsuji HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220298008
- Publication date Sep 22, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device for Supporting MEMS and/or ASIC Components
- Publication number 20220250902
- Publication date Aug 11, 2022
- TE Connectivity Solutions GmbH
- Ismael Brunner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220219970
- Publication date Jul 14, 2022
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR AND PACKAGING METHOD THEREOF
- Publication number 20220178773
- Publication date Jun 9, 2022
- FATRI UNITED TESTING & CONTROL (QUANZHOU) TECHNOLOGIES CO., LTD.
- Yongzhong NIE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...
- Publication number 20220172506
- Publication date Jun 2, 2022
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL INTERCONNECTION STRUCTURE, ELECTRONIC APPARATUS AND MANU...
- Publication number 20220127138
- Publication date Apr 28, 2022
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- Bharadwaja S.N. SHROWTHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220112076
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112077
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Connecting electric signal lines from the MEMS device with external electrical signal lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaging of microfluidic devices and microfluidic integrated syste...

Semiconductor device and method of manufacturing semiconductor device

Electrical contacting and method for producing an electrical contac...

Semiconductor device and method for forming the same

Electrical interconnection structure, electronic apparatus and manu...

Microelectromechanical system (MEMS) sensor packages and methods fo...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Microfabricated ultrasonic transducers and related apparatus and me...

Chip package

Stacked-die MEMS resonator

Microelectromechanical structure with bonded cover

Methods and devices for microelectromechanical resonators

Semiconductor component and method for producing same

MEMS pressure sensor

Miniaturized vacuum package and methods of making same

Semiconductor package with flexible interconnect

Electronic device and method for manufacturing an electronic device

Hermetic conductive feedthroughs for a semiconductor wafer

Packaging structure and packaging method for retinal prosthesis imp...

Methods and devices for microelectromechanical resonators

Inter-poly connection for parasitic capacitor and die size improvement

MEMS transducing apparatus and method of fabricating the same

Sensor packages

Sound producing package structure and method for packaging sound pr...

Method for manufacturing a MEMS sensor

Semiconductor devices and related methods

Stacked-die MEMS resonator

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

MEMS Structure with Reduced Peeling and Methods Forming the Same

MICROMECHANICAL STRUCTURE WITH BONDED COVER

MEMS PRESSURE SENSOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

STACKED-DIE MEMS RESONATOR

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS

TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

SOC PMUT SUITABLE FOR HIGH-DENSITY SYSTEM INTEGRATION, ARRAY CHIP,...

Wafer level package for device

METHODS AND DEVICES FOR MICROELECTROMECHANICAL RESONATORS

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

SEMICONDUCTOR DEVICES AND RELATED METHODS

STACKED-DIE MEMS RESONATOR

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

SENSING DEVICE AND METHOD FOR MANUFACTURING SENSING DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Microelectromechanical S...

Device for Supporting MEMS and/or ASIC Components

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

PRESSURE SENSOR AND PACKAGING METHOD THEREOF

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...

ELECTRICAL INTERCONNECTION STRUCTURE, ELECTRONIC APPARATUS AND MANU...

MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF