connecting the wire to a pin of the item

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H01L2224/4823

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4823connecting the wire to a pin of the item

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,009,310
- Issue date Jun 11, 2024
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,854,925
- Issue date Dec 26, 2023
- Kioxia Corporation
- Satoshi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,749,612
- Issue date Sep 5, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of making a semiconductor device
- Patent number 11,664,447
- Issue date May 30, 2023
- Nexperia B.V.
- Jeroen Croon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package manufacturing process
- Patent number 11,587,923
- Issue date Feb 21, 2023
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with reduced calibration time and ZQ calibration...
- Patent number 11,475,955
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Junha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charger
- Patent number 11,444,000
- Issue date Sep 13, 2022
- Alpha and Omega Semiconductor (Cayman) LTD
- Yu-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board and packaged chip
- Patent number 11,296,006
- Issue date Apr 5, 2022
- Mediatek Inc.
- You-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rod-based substrate with ringed interconnect layers
- Patent number 11,239,126
- Issue date Feb 1, 2022
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,227,983
- Issue date Jan 18, 2022
- Nichia Corporation
- Tsuzuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with terminal pattern for increased channel d...
- Patent number 11,211,315
- Issue date Dec 28, 2021
- Texas Instruments Incorporated
- Casey Thomas Morrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,174,157
- Issue date Nov 16, 2021
- Advanced Semiconductor Engineering Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-chip package with reduced calibration time and ZQ calibration...
- Patent number 11,127,462
- Issue date Sep 21, 2021
- Samsung Electronics Co., Ltd.
- Junha Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device assemblies including multiple shingled stacks...
- Patent number 11,094,670
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Hong Wan Ng
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor outline housing with high return loss
- Patent number 11,088,096
- Issue date Aug 10, 2021
- Schott AG
- Artit Aowudomsuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having optical interface
- Patent number 11,061,193
- Issue date Jul 13, 2021
- Lipac Co., Ltd.
- Sang Don Lee
- G02 - OPTICS
Information Patent Grant
Composite board, light-emitting device, and manufacturing method of...
- Patent number 11,011,682
- Issue date May 18, 2021
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad and bond wire or clip
- Patent number 10,971,435
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power cavity package for light emitters
- Patent number 10,971,892
- Issue date Apr 6, 2021
- II-VI DELAWARE, INC.
- Brent Stapleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,950,563
- Issue date Mar 16, 2021
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure including at least one connecting module and manu...
- Patent number 10,950,593
- Issue date Mar 16, 2021
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,930,524
- Issue date Feb 23, 2021
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss substrate for high data rate applications
- Patent number 10,903,152
- Issue date Jan 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Yuan-Hsi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhancing signaling bandwidth in an integ...
- Patent number 10,880,991
- Issue date Dec 29, 2020
- Marvell Asia Pte, Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip packages and methods for forming the same
- Patent number 10,867,942
- Issue date Dec 15, 2020
- Shunsin Technology (Zhong Shan) Limited
- Wang-Lai Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...
- Publication number 20240260281
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Wen Wei LUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
- Publication number 20240105538
- Publication date Mar 28, 2024
- JCET STATS ChipPAC Korea Limited
- SangHo SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088067
- Publication date Mar 14, 2024
- Mitsubishi Heavy Industries, Ltd.
- Syusaku Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...
- Publication number 20240071980
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...
- Publication number 20240057350
- Publication date Feb 15, 2024
- Changxin Memory Technologies, Inc.
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...
- Publication number 20240055399
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030298
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20230378025
- Publication date Nov 23, 2023
- Hitachi, Ltd
- Kyota ASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
- Publication number 20230317554
- Publication date Oct 5, 2023
- Qorvo US, Inc.
- Christine Blair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE LOSS DETECTION AND REDUNDANCY
- Publication number 20230298950
- Publication date Sep 21, 2023
- Semiconductor Components Industries, LLC
- Dieter Jozef JOOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT MODULE
- Publication number 20230268278
- Publication date Aug 24, 2023
- ROBERT BOSCH GmbH
- Jan Homoth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20230023328
- Publication date Jan 26, 2023
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220270945
- Publication date Aug 25, 2022
- KIOXIA Corporation
- SATOSHI KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...
- Publication number 20220223560
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE MANUFACTURING PROCESS
- Publication number 20220028851
- Publication date Jan 27, 2022
- EGALAX_EMPIA TECHNOLOGY INC.
- Po-Chuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
- Publication number 20210074598
- Publication date Mar 11, 2021
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20200399117
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200388585
- Publication date Dec 10, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20200335462
- Publication date Oct 22, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- WANG-LAI YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE TRACE DESIGN FOR SMART CARD
- Publication number 20200258831
- Publication date Aug 13, 2020
- NXP B.V.
- Amornthep Saiyajitara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE
- Publication number 20200233157
- Publication date Jul 23, 2020
- Lipac Co., Ltd.
- Sang Don LEE
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200176344
- Publication date Jun 4, 2020
- Samsung Electronics Co. Ltd.
- Soo-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20200020667
- Publication date Jan 16, 2020
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200002162
- Publication date Jan 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...
- Publication number 20190334068
- Publication date Oct 31, 2019
- Nichia Corporation.
- Tsuzuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGER
- Publication number 20190318979
- Publication date Oct 17, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yu-Ming Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...
- Publication number 20190313523
- Publication date Oct 10, 2019
- Marvell World Trade Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...
- Publication number 20190244930
- Publication date Aug 8, 2019
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS

connecting the wire to a pin of the item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Stacked microfeature devices and associated methods

Semiconductor device and method of manufacturing semiconductor device

Method of manufacturing a semiconductor device having a bond wire o...

Semiconductor package device

Semiconductor device and a method of making a semiconductor device

Multichip package manufacturing process

Multi-chip package with reduced calibration time and ZQ calibration...

Charger

Stacked microfeature devices and associated methods

Semiconductor device and method of forming microelectromechanical s...

Circuit board and packaged chip

Rod-based substrate with ringed interconnect layers

Light emitting device and method of manufacturing the light emittin...

Semiconductor package with terminal pattern for increased channel d...

Semiconductor device packages and methods of manufacturing the same

Multi-chip package with reduced calibration time and ZQ calibration...

Semiconductor device assemblies including multiple shingled stacks...

Transistor outline housing with high return loss

Semiconductor chip package having optical interface

Composite board, light-emitting device, and manufacturing method of...

Semiconductor device including bonding pad and bond wire or clip

High power cavity package for light emitters

Chip packages and methods for forming the same

Package structure including at least one connecting module and manu...

Printed circuit board and semiconductor package

Semiconductor component and method of manufacture

Low loss substrate for high data rate applications

Apparatus and methods for enhancing signaling bandwidth in an integ...

Chip packages and methods for forming the same

Patents Applicationslast 30 patents

MOLDED MEMORY ASSEMBLIES FOR A SYSTEM IN PACKAGE SEMICONDUCTOR DEVI...

METHOD FOR MAKING AN ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE

WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUC...

SEMICONDUCTOR STRUCTURE, METHOD FOR MANUFACTURING SEMICONDUCTOR STR...

SEMICONDUCTOR DEVICE

POWER CONVERSION DEVICE

EMBEDDED HEAT SLUG IN A SUBSTRATE

BOND WIRE LOSS DETECTION AND REDUNDANCY

ELECTRONIC CIRCUIT MODULE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

Semiconductor Device and Method of Forming Microelectromechanical S...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHI...

MULTICHIP PACKAGE MANUFACTURING PROCESS

ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS

Semiconductor Device and Method of Forming Microelectromechanical S...

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CHIP PACKAGES AND METHODS FOR FORMING THE SAME

CONDUCTIVE TRACE DESIGN FOR SMART CARD

SEMICONDUCTOR CHIP PACKAGE HAVING OPTICAL INTERFACE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE LIGHT EMITTIN...

CHARGER

APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS...