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H01L2224/45012

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45012Cross-sectional shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,861,774
- Issue date Dec 8, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,629,518
- Issue date Apr 21, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire and method for manufacturing the same
- Patent number 10,483,130
- Issue date Nov 19, 2019
- KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD.
- Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device by laser-induced forming and transfer of shaped m...
- Patent number 10,297,565
- Issue date May 21, 2019
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced forming and transfer of shaped metallic interconnects
- Patent number 9,685,349
- Issue date Jun 20, 2017
- The United States of America, as represented by the Secretary of the Navy
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly for microelectronic packaging with bond el...
- Patent number 9,615,456
- Issue date Apr 4, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,543,266
- Issue date Jan 10, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Bonding wire for semiconductor device use and method of production...
- Patent number 9,536,854
- Issue date Jan 3, 2017
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Integrated circuit
- Patent number 8,829,659
- Issue date Sep 9, 2014
- Sony Corporation
- Xiaobing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for fabricating bonding wires on the basis of mic...
- Patent number 8,561,446
- Issue date Oct 22, 2013
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 8,362,594
- Issue date Jan 29, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,217,269
- Issue date Jul 10, 2012
- Raytheon Company
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 8,026,447
- Issue date Sep 27, 2011
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,915,711
- Issue date Mar 29, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,674,655
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical microfilament to circuit interface
- Patent number 7,626,123
- Issue date Dec 1, 2009
- Raytheon Sarcos, LLC
- Stephen C. Jacobsen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,560,809
- Issue date Jul 14, 2009
- Mitsubishi Electric Corporation
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,667,547
- Issue date Dec 23, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,476,481
- Issue date Nov 5, 2002
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bonding method using rectangular wire and capillary bore
- Patent number 6,109,508
- Issue date Aug 29, 2000
- Texas Instruments Incorporated
- John Orcutt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having bonding wires
- Patent number 5,177,590
- Issue date Jan 5, 1993
- Kabushiki Kaisha Toshiba
- Toshihiro Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low phosphorus containing band-shaped and/or filamentary material
- Patent number 5,045,410
- Issue date Sep 3, 1991
- Karl Neumayer, Erzeugung und Vertrieb von Kabeln, Drahten isolierten Leitunge...
- Heinz G. Hiesbock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for interconnecting electronic integrated circuit compone...
- Patent number 4,371,744
- Issue date Feb 1, 1983
- Compagnie Internationale pour l'Informatique Cii-Honeywell Bull (Societe Anon...
- Bernard Badet
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240304588
- Publication date Sep 12, 2024
- Fuji Electric Co., Ltd.
- Akio YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200211932
- Publication date Jul 2, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200075463
- Publication date Mar 5, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUPPORTED STACKED DIE
- Publication number 20190035705
- Publication date Jan 31, 2019
- Intel Corporation
- Guo MAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180366345
- Publication date Dec 20, 2018
- Kunshan New Flat Panel Display Technology Center Co., Ltd.
- Kun HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
- Publication number 20170103902
- Publication date Apr 13, 2017
- The Government of the United States of America, as represented by the Secreta...
- Scott A. Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160111389
- Publication date Apr 21, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
- Publication number 20160104687
- Publication date Apr 14, 2016
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...
- Publication number 20140264783
- Publication date Sep 18, 2014
- Altera Corporation
- Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20140175671
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE
- Publication number 20110310577
- Publication date Dec 22, 2011
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20110175206
- Publication date Jul 21, 2011
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110089575
- Publication date Apr 21, 2011
- Samsung Electronics Co., Ltd.
- In LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20110037178
- Publication date Feb 17, 2011
- SONY CORPORATION
- Xiaobing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20100133662
- Publication date Jun 3, 2010
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Microfilament to Circuit Interface
- Publication number 20100116869
- Publication date May 13, 2010
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...
- Publication number 20100107717
- Publication date May 6, 2010
- Matthias Lehr
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Center Conductor to Integrated Circuit for High Frequency Applications
- Publication number 20090079042
- Publication date Mar 26, 2009
- AGILENT TECHNOLOGIES, INC.
- Jim Clatterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES
- Publication number 20090057843
- Publication date Mar 5, 2009
- Micron Technology, Inc.
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for wire bonding and integrated circuit chip package
- Publication number 20080197461
- Publication date Aug 21, 2008
- Taiwan Semiconductor Manufacturing Co.,Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire and bond using a bonding wire
- Publication number 20080061450
- Publication date Mar 13, 2008
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20070187819
- Publication date Aug 16, 2007
- MITSUBISHI ELECTRIC CORPORATION
- Dai NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical microfilament to circuit interface
- Publication number 20070132109
- Publication date Jun 14, 2007
- Sarcos Investments LC.
- Stephen C. Jacobsen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
High current capacity semiconductor device package and lead frame w...
- Publication number 20030011051
- Publication date Jan 16, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...
- Publication number 20010054752
- Publication date Dec 27, 2001
- ARTHUR WOODWORTH
- H01 - BASIC ELECTRIC ELEMENTS

Cross-sectional shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Internally-shielded microelectronic packages and methods for the fa...

Semiconductor package with supported stacked die

Internally-shielded microelectronic packages and methods for the fa...

Wire and method for manufacturing the same

Electronic device by laser-induced forming and transfer of shaped m...

Laser-induced forming and transfer of shaped metallic interconnects

Microelectronic assembly for microelectronic packaging with bond el...

Bonding wire for semiconductor device use and method of production...

Bonding wire for semiconductor device use and method of production...

Core-jacket bonding wire

Integrated circuit

Method and device for fabricating bonding wires on the basis of mic...

Connecting wire and method for manufacturing same

Semiconductor assemblies and methods of manufacturing such assembli...

Electrical microfilament to circuit interface

Electrical microfilament to circuit interface

Semiconductor assemblies and methods of manufacturing such assembli...

Semiconductor assemblies and methods of manufacturing such assembli...

Electrical microfilament to circuit interface

Semiconductor device

High current capacity semiconductor device package and lead frame w...

High current capacity semiconductor device package and lead frame w...

Fine pitch bonding method using rectangular wire and capillary bore

Semiconductor device having bonding wires

Low phosphorus containing band-shaped and/or filamentary material

Substrate for interconnecting electronic integrated circuit compone...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

DOCUMENT STRUCTURE FORMATION

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

SEMICONDUCTOR PACKAGE WITH SUPPORTED STACKED DIE

WIRE AND METHOD FOR MANUFACTURING THE SAME

Laser-Induced Forming and Transfer of Shaped Metallic Interconnects

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...

APPARATUS FOR ELECTRONIC ASSEMBLY WITH IMPROVED INTERCONNECT AND AS...

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

CORE-JACKET BONDING WIRE

ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

Electrical Microfilament to Circuit Interface

METHOD AND DEVICE FOR FABRICATING BONDING WIRES ON THE BASIS OF MIC...

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

Center Conductor to Integrated Circuit for High Frequency Applications

SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES

Apparatus for wire bonding and integrated circuit chip package

Bonding wire and bond using a bonding wire

SEMICONDUCTOR DEVICE

Electrical microfilament to circuit interface

High current capacity semiconductor device package and lead frame w...

HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...