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PACKAGE STRUCTURE
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Publication number 20250239512
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Publication date Jul 24, 2025
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Advanced Semiconductor Engineering, Inc.
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Che-Neng LIU
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI-DIE SEMICONDUCTOR PACKAGE
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Publication number 20250226295
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Publication date Jul 10, 2025
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Infineon Technologies Austria AG
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Bhargav Pandya
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H01 - BASIC ELECTRIC ELEMENTS
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LEADFRAME WITH RETAINING FEATURES
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Publication number 20250218907
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Publication date Jul 3, 2025
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TEXAS INSTRUMENTS INCORPORATED
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Jefferson LUGUE
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H01 - BASIC ELECTRIC ELEMENTS
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MONITORING OF ELECTRONIC PACKAGES
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Publication number 20250210444
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Publication date Jun 26, 2025
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SK Hynix NAND Product Solutions Corp. (dba Solidigm)
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Jorge MARTINEZ ARAIZA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250210542
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Publication date Jun 26, 2025
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Samsung Electronics Co., Ltd.
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Wooyeol LEE
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H01 - BASIC ELECTRIC ELEMENTS
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INTELLIGENT POWER MODULE
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Publication number 20250201680
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Publication date Jun 19, 2025
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RICHTEK TECHNOLOGY CORPORATION
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Lung-Sheng Lin
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250192085
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Publication date Jun 12, 2025
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Samsung Electronics Co., Ltd.
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Hyunsoo Chung
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H01 - BASIC ELECTRIC ELEMENTS
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