Disposition

Industry

CPC
H01L2924/182

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/182Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with bond wire loop exposed from a molded body...
- Patent number 12,283,563
- Issue date Apr 22, 2025
- Infineon Technologies Austria AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure
- Patent number 12,224,221
- Issue date Feb 11, 2025
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a curved part in the printed circuit board
- Patent number 12,191,245
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,191,289
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Yuji Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,269
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier IC package including processor and high bandwidth memory
- Patent number 12,154,890
- Issue date Nov 26, 2024
- Huawei Technologies Co., Ltd.
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 12,142,633
- Issue date Nov 12, 2024
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,131,983
- Issue date Oct 29, 2024
- Rohm Co., Ltd.
- Katsutoki Shirai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140746
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE
- Publication number 20250140665
- Publication date May 1, 2025
- Infineon Technologies Canada Inc.
- Mihalis MICHAEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...
- Publication number 20250140654
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Jing GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140668
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunwoong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20250140666
- Publication date May 1, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...
- Publication number 20250132235
- Publication date Apr 24, 2025
- NXP USA, Inc.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250132213
- Publication date Apr 24, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS
- Publication number 20250132223
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shiou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Publication number 20250125234
- Publication date Apr 17, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
- Publication number 20250126909
- Publication date Apr 17, 2025
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20250125297
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...
- Publication number 20250125305
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...
- Publication number 20250118636
- Publication date Apr 10, 2025
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250118707
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250112131
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Konosuke KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...
- Publication number 20250105207
- Publication date Mar 27, 2025
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...
- Publication number 20250105175
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SIDE INTERCONNECTION
- Publication number 20250105211
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250096187
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...
- Publication number 20250096092
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION
- Publication number 20250096090
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20250087621
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...
- Publication number 20250087565
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
- Publication number 20250081476
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Hidetoshi Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079254
- Publication date Mar 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Po-Yuan SU
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out semiconductor package

Semiconductor module with bond wire loop exposed from a molded body...

Semiconductor packages having wiring patterns

Modular construction of hybrid-bonded semiconductor die assemblies...

Integrated circuit package structure

Semiconductor device and method for manufacturing the same

Method and device for producing a housing

Semiconductor package having wettable lead flanks and tie bars and...

Semiconductor package having an encapulant comprising conductive fi...

Electronic device

Semiconductor device having package on package structure and method...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor device having plural stacked first chips sealed in a...

Semiconductor module and power conversion apparatus

Packaging method and package structure

Reliable semiconductor packages

Submodule semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device and method for producing the same

Stacked via structure disposed on a conductive pillar of a semicond...

Semiconductor device having a curved part in the printed circuit board

Electrical bridge package with integrated off-bridge photonic chann...

Semiconductor device

Semiconductor package and manufacturing method thereof

Semiconductor device

Semiconductor package using cavity substrate and manufacturing methods

Flip chip package unit comprising thermal protection film and assoc...

Multi-tier IC package including processor and high bandwidth memory

Semiconductor package with TSV inductor

Semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE

PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH SURROUNDING BUMP METALLIZATION AND METHOD...

SEMICONDUCTOR PACKAGING STRUCTURE

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS

INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING

RELIABLE SEMICONDUCTORS PACKAGES

SUBMODULE SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

HEAT DISSIPATION SUBSTRATE FOR A POWER SEMICONDUCTOR MODULE, A POWE...

INTEGRATED CIRCUIT PACKAGES AND METHODS

LEAD FRAME AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

INTEGRATED CIRCUIT PACKAGES WITH DOUBLE HYBRID BONDED DIES AND METH...

SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD L...

SEMICONDUCTOR DEVICE INCLUDING SIDE INTERCONNECTION

SELECTIVE LAYER TRANSFER

SEMICONDUCTOR MODULE

STACKED VIA STRUCTURE DISPOSED ON A CONDUCTIVE PILLAR OF A SEMICOND...

INTEGRATED DEVICE COMPRISING SILICON SUBSTRATE WITH POROUS PORTION

INTERPOSER STRUCTURE AND PACKAGE STRUCTURE

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF