Electrical connections provided on a side surface of one or more of the containers

Industry

CPC
H01L2225/1064

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1064Electrical connections provided on a side surface of one or more of the containers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic module for high power applications
- Patent number 11,410,977
- Issue date Aug 9, 2022
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect self-assembly substrate
- Patent number 11,398,463
- Issue date Jul 26, 2022
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,322,480
- Issue date May 3, 2022
- Kioxia Corporation
- Toshihiro Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect self-assembly substrate
- Patent number 10,896,898
- Issue date Jan 19, 2021
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,892,226
- Issue date Jan 12, 2021
- LSIS Co., Ltd.
- Teagsun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,734,367
- Issue date Aug 4, 2020
- Sansumg Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated interposers and packages with embedded trace interconnects
- Patent number 10,636,780
- Issue date Apr 28, 2020
- Invensas Corporation
- Nader Gamini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical structural member and production method for producing su...
- Patent number 10,571,529
- Issue date Feb 25, 2020
- TE Connectivity Sensors Germany GmbH
- Georg Stute
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor memory device
- Patent number 10,418,345
- Issue date Sep 17, 2019
- TOSHIBA MEMORY CORPORATION
- Toshihiro Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Laminated interposers and packages with embedded trace interconnects
- Patent number 10,283,492
- Issue date May 7, 2019
- Invensas Corporation
- Nader Gamini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 10,211,114
- Issue date Feb 19, 2019
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and stacked microelectronic packages with package surface c...
- Patent number 9,960,149
- Issue date May 1, 2018
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module stacking mechanism with integrated ground
- Patent number 9,899,358
- Issue date Feb 20, 2018
- Intel Corporation
- Alan W. Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices, stacked microelectronic devices, and metho...
- Patent number 9,768,121
- Issue date Sep 19, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based system-in-packages having sidewall-mounted surface...
- Patent number 9,761,569
- Issue date Sep 12, 2017
- NSP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic package and stacked assembly thereof
- Patent number 9,698,104
- Issue date Jul 4, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stub minimization for assemblies without wirebonds to package subst...
- Patent number 9,679,838
- Issue date Jun 13, 2017
- Invensas Corporation
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional one-time-programmable memory comprising off-die a...
- Patent number 9,666,300
- Issue date May 30, 2017
- XiaMen HaiCun IP Technology LLC
- Guobiao Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Process for manufacturing a 3D electronic module comprising externa...
- Patent number 9,659,846
- Issue date May 23, 2017
- 3D Plus
- Alexandre Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,653,444
- Issue date May 16, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Interconnect Self-Assembly Substrate
- Publication number 20210050335
- Publication date Feb 18, 2021
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE ASSEMBLY
- Publication number 20200203326
- Publication date Jun 25, 2020
- Intel Corporation
- Hyoung IL Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE FOR HIGH POWER APPLICATIONS
- Publication number 20200152614
- Publication date May 14, 2020
- Analog Devices International Unlimited Company
- John D. Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS
- Publication number 20200066692
- Publication date Feb 27, 2020
- Intel IP Corporation
- Andreas WOLTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE
- Publication number 20190333886
- Publication date Oct 31, 2019
- Intel IP Corporation
- Klaus Reingruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED INTERPOSERS AND PACKAGES WITH EMBEDDED TRACE INTERCONNECTS
- Publication number 20190088636
- Publication date Mar 21, 2019
- Invensas Corporation
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20190088622
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Toshihiro SUZUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Structural Member and Production Method for Producing Su...
- Publication number 20180128883
- Publication date May 10, 2018
- TE Connectivity Sensors Germany GmbH
- Georg Stute
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface edge pads for vertical mount packages and methods of...
- Publication number 20180040544
- Publication date Feb 8, 2018
- Invensas Corporation
- Rajesh Emeka Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS
- Publication number 20180040589
- Publication date Feb 8, 2018
- Invensas Corporation
- Shaowu Huang
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE STACKING MECHANISM WITH INTEGRATED GROUND
- Publication number 20170345803
- Publication date Nov 30, 2017
- Intel Corporation
- Alan W. Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20170207206
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Interconnect Self-Assembly Substrate
- Publication number 20170125389
- Publication date May 4, 2017
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE ASSEMBLIES AND METHODS FOR THE PRODUCTION...
- Publication number 20160013076
- Publication date Jan 14, 2016
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Packaging Semiconduct...
- Publication number 20150162316
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20150091166
- Publication date Apr 2, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...
- Publication number 20140353840
- Publication date Dec 4, 2014
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STOPPER, SEMICONDUCTOR DEVICE...
- Publication number 20140183752
- Publication date Jul 3, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY
- Publication number 20140151881
- Publication date Jun 5, 2014
- Tessera, Inc.
- Andrey Grinman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBST...
- Publication number 20140103535
- Publication date Apr 17, 2014
- Invensas Corporation
- Richard Dewitt Crisp
- G11 - INFORMATION STORAGE

Electrical connections provided on a side surface of one or more of the containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module for high power applications

Edge interconnect self-assembly substrate

Semiconductor memory device

Stacked modules

Edge interconnect self-assembly substrate

Power semiconductor module

Electronic system having increased coupling by using horizontal and...

Semiconductor package and method of fabricating the same

Laminated interposers and packages with embedded trace interconnects

Packaged semiconductor assemblies and methods for manufacturing suc...

Electrical structural member and production method for producing su...

Electronic system having increased coupling by using horizontal and...

Semiconductor memory device

Microelectronic die packages with metal leads, including metal lead...

Multi-surface edge pads for vertical mount packages and methods of...

Electronic system having increased coupling by using horizontal and...

Laminated interposers and packages with embedded trace interconnects

Microelectronic devices, stacked microelectronic devices, and metho...

Microelectronic die packages with metal leads, including metal lead...

Devices and stacked microelectronic packages with package surface c...

Packaged semiconductor assemblies and methods for manufacturing suc...

Module stacking mechanism with integrated ground

Electronic system having increased coupling by using horizontal and...

Microelectronic devices, stacked microelectronic devices, and metho...

Leadframe-based system-in-packages having sidewall-mounted surface...

Integrated electronic package and stacked assembly thereof

Stub minimization for assemblies without wirebonds to package subst...

Three-dimensional one-time-programmable memory comprising off-die a...

Process for manufacturing a 3D electronic module comprising externa...

Microelectronic die packages with metal leads, including metal lead...

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Edge Interconnect Self-Assembly Substrate

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGE ON PACKAGE ASSEMBLY

ELECTRONIC MODULE FOR HIGH POWER APPLICATIONS

PACKAGE DEVICES HAVING A BALL GRID ARRAY WITH SIDE WALL CONTACT PADS

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

LAMINATED INTERPOSERS AND PACKAGES WITH EMBEDDED TRACE INTERCONNECTS

SEMICONDUCTOR MEMORY DEVICE

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Electrical Structural Member and Production Method for Producing Su...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Multi-surface edge pads for vertical mount packages and methods of...

MICROELECTRONIC PACKAGES AND ASSEMBLIES WITH REPEATERS

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

MODULE STACKING MECHANISM WITH INTEGRATED GROUND

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

Edge Interconnect Self-Assembly Substrate

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

THREE DIMENSIONAL PACKAGE ASSEMBLIES AND METHODS FOR THE PRODUCTION...

Packaged Semiconductor Devices and Methods of Packaging Semiconduct...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND MET...

SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STOPPER, SEMICONDUCTOR DEVICE...

PACKAGED SEMICONDUCTOR CHIPS WITH ARRAY

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

STUB MINIMIZATION FOR ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBST...