for grinding inorganic material

Industry

CPC
B24B7/22

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BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces Accessories therefor

Current Industry

B24B7/22for grinding inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Polycrystalline SiC compact and method for manufacturing the same
- Patent number 12,368,026
- Issue date Jul 22, 2025
- Tokai Carbon Co., Ltd.
- Yohei Harada
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate grinding device and substrate grinding method
- Patent number 12,358,095
- Issue date Jul 15, 2025
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Satoru Ide
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method of workpiece
- Patent number 12,325,104
- Issue date Jun 10, 2025
- Disco Corporation
- Daisuke Akita
- B24 - GRINDING POLISHING
Information Patent Grant
Laser processing method, semiconductor device manufacturing method,...
- Patent number 12,327,766
- Issue date Jun 10, 2025
- Hamamatsu Photonics K.K.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding wheel
- Patent number 12,304,029
- Issue date May 20, 2025
- Disco Corporation
- Masaru Nagami
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus and use method of grinding apparatus
- Patent number 12,304,027
- Issue date May 20, 2025
- Disco Corporation
- Tomotaka Tabuchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing gallium nitride single-crystal substrate an...
- Patent number 12,290,899
- Issue date May 6, 2025
- Kyocera Corporation
- Yuri Osumi
- C30 - CRYSTAL GROWTH
Information Patent Grant
Methods for thinning substrates for semiconductor devices
- Patent number 12,290,900
- Issue date May 6, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grinding method for workpiece and grinding apparatus
- Patent number 12,263,553
- Issue date Apr 1, 2025
- Disco Corporation
- Keisuke Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head management system and method
- Patent number 12,251,790
- Issue date Mar 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fan-Wei Liao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 12,255,071
- Issue date Mar 18, 2025
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 12,205,831
- Issue date Jan 21, 2025
- Ebara Corporation
- Mitsuru Miyazaki
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method
- Patent number 12,186,857
- Issue date Jan 7, 2025
- Disco Corporation
- Masaru Nakamura
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,191,149
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grinding wheel and wafer grinding method
- Patent number 12,151,339
- Issue date Nov 26, 2024
- Disco Corporation
- Yoshinobu Saito
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress treatments for cover wafers
- Patent number 12,142,468
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Vinayak Vishwanath Hassan
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,142,483
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor smoothing apparatus and method
- Patent number 12,119,435
- Issue date Oct 15, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad with improved crosslinking density and process for pr...
- Patent number 12,076,832
- Issue date Sep 3, 2024
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method of workpiece
- Patent number 12,064,847
- Issue date Aug 20, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical discharge-assisted micro-grinding device for micro-...
- Patent number 11,992,890
- Issue date May 28, 2024
- Changsha University of Science & Technology
- Cong Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak test device
- Patent number 11,988,576
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiaping He
- G01 - MEASURING TESTING
Information Patent Grant
Method of grinding workpiece
- Patent number 11,980,993
- Issue date May 14, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL TYPE SURFACE GRINDING MACHINE
- Publication number 20250235974
- Publication date Jul 24, 2025
- JTEKT MACHINE SYSTEMS CORPORATION
- Yoshinobu OGURA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER GRINDING WHEEL AND SEMICONDUCTOR WAFER POLISHIN...
- Publication number 20250226241
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Yeon Su SONG
- B24 - GRINDING POLISHING
Information Patent Application
HIGH FREQUENCY POLISHING OF CERAMICS
- Publication number 20250222558
- Publication date Jul 10, 2025
- HERAEUS COVANTICS NORTH AMERICA LLC
- Luke WALKER
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER PLATE POSITIONING DEVICE FOR MULTI-COLUMN HIGH-PRECISION PO...
- Publication number 20250222557
- Publication date Jul 10, 2025
- JINLING (CHINA) TECH GROUP CO., LTD
- Shengan GUO
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS
- Publication number 20250214192
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Jihee Yang
- B24 - GRINDING POLISHING
Information Patent Application
EQUIPMENT FOR SURFACE PROCESSING OF PLATE-SHAPED ELEMENTS
- Publication number 20250214194
- Publication date Jul 3, 2025
- Infinititech Srl
- Andrea Malvolti
- B24 - GRINDING POLISHING
Information Patent Application
ADHESIVE FILM FOR WAFER BACK GRINDING
- Publication number 20250215269
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Kyung-Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES
- Publication number 20250205845
- Publication date Jun 26, 2025
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE
- Publication number 20250205851
- Publication date Jun 26, 2025
- EBARA CORPORATION
- MAKOTO TAKAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD
- Publication number 20250178148
- Publication date Jun 5, 2025
- Disco Corporation
- Minoru MATSUZAWA
- B24 - GRINDING POLISHING
Information Patent Application
WHEEL REPLACING APPARATUS AND WHEEL REPLACING SYSTEM INCLUDING THE...
- Publication number 20250162102
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jwa Hyeon KIM
- B24 - GRINDING POLISHING
Information Patent Application
FINISHING TOOL
- Publication number 20250128381
- Publication date Apr 24, 2025
- SURFACES TECHNOLOGICAL ABRASIVES S.P.A.
- Luca LAZZARONI
- B24 - GRINDING POLISHING
Information Patent Application
EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS
- Publication number 20250114893
- Publication date Apr 10, 2025
- Disco Corporation
- Kensuke FURUTA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING WHEEL
- Publication number 20250114911
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Sangil CHOI
- B24 - GRINDING POLISHING
Information Patent Application
FLUID CONTROL DEVICE FOR DE-VACUUMING IN WAFER GRINDING APPARATUS
- Publication number 20250100104
- Publication date Mar 27, 2025
- JOEN LIH MACHINERY CO., LTD.
- Hsin-Tang LIN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20250100103
- Publication date Mar 27, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250095995
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER
- Publication number 20250091174
- Publication date Mar 20, 2025
- Disco Corporation
- Yujiro UMEZAWA
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD
- Publication number 20250087492
- Publication date Mar 13, 2025
- Disco Corporation
- Tomoaki SUGIYAMA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER BACKGRINDING
- Publication number 20250073845
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GAIL EDSELLE REYES
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MONITORING RUPTURE OF BONDING BUBBLE IN WAFER BONDING PR...
- Publication number 20250069957
- Publication date Feb 27, 2025
- Shanghal Hual Integrated Circuit Corporation
- Yurong Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20250058422
- Publication date Feb 20, 2025
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD OF BONDED WAFER
- Publication number 20250063950
- Publication date Feb 20, 2025
- Disco Corporation
- Tomoka MORI
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD OF WAFER
- Publication number 20250025986
- Publication date Jan 23, 2025
- Disco Corporation
- Yoshikazu SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20250018521
- Publication date Jan 16, 2025
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING SYSTEM AND WAFER TRANSFER METHOD
- Publication number 20250018527
- Publication date Jan 16, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Xiaoyu XU
- B24 - GRINDING POLISHING
Information Patent Application
WAFER GRINDING METHOD
- Publication number 20250018531
- Publication date Jan 16, 2025
- Disco Corporation
- Hironobu OZAWA
- B24 - GRINDING POLISHING
Information Patent Application
GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...
- Publication number 20250011971
- Publication date Jan 9, 2025
- Tokuyama Corporation
- Masayuki FUKUDA
- B24 - GRINDING POLISHING
Information Patent Application
GRINDER
- Publication number 20250001548
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Jwahyeon KIM
- B24 - GRINDING POLISHING

for grinding inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polycrystalline SiC compact and method for manufacturing the same

Substrate grinding device and substrate grinding method

Grinding method of workpiece

Laser processing method, semiconductor device manufacturing method,...

Grinding wheel

Grinding apparatus and use method of grinding apparatus

Method of manufacturing gallium nitride single-crystal substrate an...

Methods for thinning substrates for semiconductor devices

Grinding method for workpiece and grinding apparatus

Polishing head management system and method

Processing method of wafer

Grinding apparatus

Back grinding adhesive sheet, and method for manufacturing semicond...

Cleaning apparatus and polishing apparatus

Wafer processing method

Substrate processing method and substrate processing system

Grinding wheel and wafer grinding method

Semiconductor wafer and method of wafer thinning

Stress treatments for cover wafers

Substrate processing apparatus and substrate processing method

Method for wafer backside polishing

Machine for finishing a work piece, and having a highly controllabl...

Adhesive sheet

Semiconductor smoothing apparatus and method

Polishing pad with improved crosslinking density and process for pr...

Processing method of workpiece

Electrochemical discharge-assisted micro-grinding device for micro-...

Leak test device

Method of grinding workpiece

Motor torque endpoint during polishing with spatial resolution

Patents Applicationslast 30 patents

VERTICAL TYPE SURFACE GRINDING MACHINE

SEMICONDUCTOR WAFER GRINDING WHEEL AND SEMICONDUCTOR WAFER POLISHIN...

HIGH FREQUENCY POLISHING OF CERAMICS

CARRIER PLATE POSITIONING DEVICE FOR MULTI-COLUMN HIGH-PRECISION PO...

SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS

EQUIPMENT FOR SURFACE PROCESSING OF PLATE-SHAPED ELEMENTS

ADHESIVE FILM FOR WAFER BACK GRINDING

METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE

GRINDING METHOD

WHEEL REPLACING APPARATUS AND WHEEL REPLACING SYSTEM INCLUDING THE...

FINISHING TOOL

EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS

GRINDING WHEEL

FLUID CONTROL DEVICE FOR DE-VACUUMING IN WAFER GRINDING APPARATUS

POLISHING HEAD AND POLISHING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD OF MANUFACTURING WAFER

PROCESSING METHOD

WAFER BACKGRINDING

METHOD FOR MONITORING RUPTURE OF BONDING BUBBLE IN WAFER BONDING PR...

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

METHOD OF GRINDING WAFER

PROCESSING METHOD OF BONDED WAFER

GRINDING METHOD OF WAFER

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

WAFER POLISHING SYSTEM AND WAFER TRANSFER METHOD

WAFER GRINDING METHOD

GROUP III NITRIDE SINGLE CRYSTAL SUBSTRATE PRODUCING METHOD, AND AL...

GRINDER