for grinding inorganic material

Industry

CPC
B24B7/22

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces Accessories therefor

Current Industry

B24B7/22for grinding inorganic material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Grinding wheel and wafer grinding method
- Patent number 12,151,339
- Issue date Nov 26, 2024
- Disco Corporation
- Yoshinobu Saito
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress treatments for cover wafers
- Patent number 12,142,468
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Vinayak Vishwanath Hassan
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,142,483
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Yoshihiro Kawaguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,122,947
- Issue date Oct 22, 2024
- Nitto Denko Corporation
- Shusaku Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor smoothing apparatus and method
- Patent number 12,119,435
- Issue date Oct 15, 2024
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad with improved crosslinking density and process for pr...
- Patent number 12,076,832
- Issue date Sep 3, 2024
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method of workpiece
- Patent number 12,064,847
- Issue date Aug 20, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical discharge-assisted micro-grinding device for micro-...
- Patent number 11,992,890
- Issue date May 28, 2024
- Changsha University of Science & Technology
- Cong Mao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leak test device
- Patent number 11,988,576
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiaping He
- G01 - MEASURING TESTING
Information Patent Grant
Method of grinding workpiece
- Patent number 11,980,993
- Issue date May 14, 2024
- Disco Corporation
- Yoshikazu Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Motor torque endpoint during polishing with spatial resolution
- Patent number 11,980,995
- Issue date May 14, 2024
- Applied Materials, Inc.
- Thomas Li
- B24 - GRINDING POLISHING
Information Patent Grant
Cleaning apparatus and polishing apparatus
- Patent number 11,948,811
- Issue date Apr 2, 2024
- Ebara Corporation
- Mitsuru Miyazaki
- B08 - CLEANING
Information Patent Grant
Processing apparatus
- Patent number 11,945,074
- Issue date Apr 2, 2024
- Disco Corporation
- Nobuyuki Fukushi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer production method
- Patent number 11,948,789
- Issue date Apr 2, 2024
- Sumco Corporation
- Toshiyuki Tanaka
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing method and grinding apparatus
- Patent number 11,929,256
- Issue date Mar 12, 2024
- Disco Corporation
- Yuya Matsuoka
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding apparatus
- Patent number 11,904,432
- Issue date Feb 20, 2024
- Disco Corporation
- Satoru Fujimura
- B24 - GRINDING POLISHING
Information Patent Grant
Use of hardeners/densifiers in cutting or otherwise removing materi...
- Patent number 11,904,353
- Issue date Feb 20, 2024
- Adhesives Technology Corporation
- Dal N. Hills
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition, polishing method, and method of producing se...
- Patent number 11,884,843
- Issue date Jan 30, 2024
- FUJIMI INCORPORATED
- Ryota Mae
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing pad, polishing apparatus and method of manufacturing semi...
- Patent number 11,878,388
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,858,092
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Hydrophilic and zeta potential tunable chemical mechanical polishin...
- Patent number 11,826,876
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Sivapackia Ganapathiappan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Seed crystal for single crystal 4H—SiC growth and method for proces...
- Patent number 11,781,244
- Issue date Oct 10, 2023
- Resonac Corporation
- Takanori Kido
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method of composite substrate including resin and grinding...
- Patent number 11,745,299
- Issue date Sep 5, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Stone slab manufacturing methods and systems
- Patent number 11,741,590
- Issue date Aug 29, 2023
- Cambria Company LLC
- Eric Scott Olson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Management method of machining system
- Patent number 11,738,422
- Issue date Aug 29, 2023
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Chemical Mechanical Planarization Polishing Composition For Silicon...
- Publication number 20240417594
- Publication date Dec 19, 2024
- VERSUM MATERIALS US, LLC
- Maitland Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing For Shallow Trench Isol...
- Publication number 20240395558
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ONSITE CLEANING SYSTEM AND METHOD
- Publication number 20240383013
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Hao LIU
- B08 - CLEANING
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20240383090
- Publication date Nov 21, 2024
- Disco Corporation
- Kazuma Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20240387162
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240387201
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Hirofumi OKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR GRINDING SEMICONDUCTOR WAFERS
- Publication number 20240379342
- Publication date Nov 14, 2024
- Siltronic AG
- Stephan OBERHANS
- B24 - GRINDING POLISHING
Information Patent Application
SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES
- Publication number 20240375236
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240379370
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- Yoshihiro KAWAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
Tile Grinding Machine
- Publication number 20240351156
- Publication date Oct 24, 2024
- Daniel Stan
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM FOR IMAGING SUBSTRATE SURFACE AND RELATED METHOD
- Publication number 20240351162
- Publication date Oct 24, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Vivekanand Kalaparthi
- B24 - GRINDING POLISHING
Information Patent Application
WAFER GRINDING METHOD
- Publication number 20240335918
- Publication date Oct 10, 2024
- Disco Corporation
- Kenji TAKENOUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240331998
- Publication date Oct 3, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
Process for Polishing and Grinding Copper Foil Surface for Reducing...
- Publication number 20240316718
- Publication date Sep 26, 2024
- Taichi Metal Material Technology Co., Ltd.
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL
- Publication number 20240316724
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hau-Yi HSIAO
- B24 - GRINDING POLISHING
Information Patent Application
WAFER GRINDING APPARATUS AND WAFER GRINDING METHOD
- Publication number 20240308016
- Publication date Sep 19, 2024
- Disco Corporation
- Atsushi INOUE
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING GALLIUM NITRIDE SINGLE-CRYSTAL SUBSTRATE AN...
- Publication number 20240300064
- Publication date Sep 12, 2024
- KYOCERA CORPORATION
- Yuri OSUMI
- B24 - GRINDING POLISHING
Information Patent Application
High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanic...
- Publication number 20240297049
- Publication date Sep 5, 2024
- VERSUM MATERIALS US, LLC
- Joseph D. Rose
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...
- Publication number 20240253173
- Publication date Aug 1, 2024
- GLOBALWAFERS CO., LTD.
- Tsunehiro Muronoi
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING RESIN MEMBER USED IN PRODUCTION PROCESS OF ELE...
- Publication number 20240246195
- Publication date Jul 25, 2024
- Fujimi Incorporated
- Yasuhiro Moroe
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MECHANICAL TREATMENT OF A CONCRETE FLOOR
- Publication number 20240238933
- Publication date Jul 18, 2024
- CONCRIA OY
- Mika AHONEN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240234125
- Publication date Jul 11, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIV...
- Publication number 20240217053
- Publication date Jul 4, 2024
- GLOBALWAFERS CO., LTD.
- Minkyu Lee
- B24 - GRINDING POLISHING
Information Patent Application
CLEANING APPARATUS AND POLISHING APPARATUS
- Publication number 20240194498
- Publication date Jun 13, 2024
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- B08 - CLEANING
Information Patent Application
METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES
- Publication number 20240173813
- Publication date May 30, 2024
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER GRINDING PARAMETER OPTIMIZATION METHOD AND ELECTRONIC DEVICE
- Publication number 20240173819
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chih-Chun Cheng
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20240165765
- Publication date May 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Ryo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20240149393
- Publication date May 9, 2024
- Disco Corporation
- Makoto MAEJIMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
- Publication number 20240136173
- Publication date Apr 25, 2024
- Siltronic AG
- Georg Pietsch
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING

for grinding inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Grinding wheel and wafer grinding method

Semiconductor wafer and method of wafer thinning

Stress treatments for cover wafers

Substrate processing apparatus and substrate processing method

Method for wafer backside polishing

Machine for finishing a work piece, and having a highly controllabl...

Adhesive sheet

Semiconductor smoothing apparatus and method

Polishing pad with improved crosslinking density and process for pr...

Processing method of workpiece

Electrochemical discharge-assisted micro-grinding device for micro-...

Leak test device

Method of grinding workpiece

Motor torque endpoint during polishing with spatial resolution

Cleaning apparatus and polishing apparatus

Processing apparatus

Wafer production method

Wafer processing method and grinding apparatus

Grinding apparatus

Use of hardeners/densifiers in cutting or otherwise removing materi...

Polishing composition, polishing method, and method of producing se...

Polishing pad, polishing apparatus and method of manufacturing semi...

Polishing apparatus

Substrate processing system, substrate processing method and comput...

Hydrophilic and zeta potential tunable chemical mechanical polishin...

Seed crystal for single crystal 4H—SiC growth and method for proces...

Grinding method of composite substrate including resin and grinding...

Stone slab manufacturing methods and systems

Management method of machining system

Method and apparatus for manufacturing semiconductor device

Patents Applicationslast 30 patents

Chemical Mechanical Planarization Polishing Composition For Silicon...

Chemical Mechanical Planarization Polishing For Shallow Trench Isol...

ONSITE CLEANING SYSTEM AND METHOD

METHOD OF GRINDING WAFER

METHOD FOR WAFER BACKSIDE POLISHING

SEMICONDUCTOR MANUFACTURING APPARATUS

METHOD FOR GRINDING SEMICONDUCTOR WAFERS

SIMPLIFIED CARRIER REMOVABLE BY REDUCED NUMBER OF CMP PROCESSES

SUBSTRATE PROCESSING METHOD

Tile Grinding Machine

SYSTEM FOR IMAGING SUBSTRATE SURFACE AND RELATED METHOD

WAFER GRINDING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

Process for Polishing and Grinding Copper Foil Surface for Reducing...

MULTI-PATTERN IN-PAD SURFACE FOR POLISH RATE CONTROL

WAFER GRINDING APPARATUS AND WAFER GRINDING METHOD

METHOD OF MANUFACTURING GALLIUM NITRIDE SINGLE-CRYSTAL SUBSTRATE AN...

High Oxide Removal Rates Shallow Trench Isolation Chemical Mechanic...

METHODS OF PROCESSING SEMICONDUCTOR WAFERS USING DOUBLE SIDE GRINDI...

METHOD FOR PRODUCING RESIN MEMBER USED IN PRODUCTION PROCESS OF ELE...

METHOD FOR MECHANICAL TREATMENT OF A CONCRETE FLOOR

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

DOUBLE SIDE GRINDING APPARATUS HAVING CONVEX POLYGON-SHAPED ABRASIV...

CLEANING APPARATUS AND POLISHING APPARATUS

METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES

WAFER GRINDING PARAMETER OPTIMIZATION METHOD AND ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

PROCESSING APPARATUS

METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...

POLISHING APPARATUS