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CPC
B24B7/22
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PERFORMING OPERATIONS TRANSPORTING
B24
Grinding technology
B24B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
B24B7/00
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces Accessories therefor
Current Industry
B24B7/22
for grinding inorganic material
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Electrochemical discharge-assisted micro-grinding device for micro-...
Patent number
11,992,890
Issue date
May 28, 2024
Changsha University of Science & Technology
Cong Mao
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Leak test device
Patent number
11,988,576
Issue date
May 21, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jiaping He
G01 - MEASURING TESTING
Information
Patent Grant
Method of grinding workpiece
Patent number
11,980,993
Issue date
May 14, 2024
Disco Corporation
Yoshikazu Suzuki
B24 - GRINDING POLISHING
Information
Patent Grant
Motor torque endpoint during polishing with spatial resolution
Patent number
11,980,995
Issue date
May 14, 2024
Applied Materials, Inc.
Thomas Li
B24 - GRINDING POLISHING
Information
Patent Grant
Cleaning apparatus and polishing apparatus
Patent number
11,948,811
Issue date
Apr 2, 2024
Ebara Corporation
Mitsuru Miyazaki
B08 - CLEANING
Information
Patent Grant
Wafer production method
Patent number
11,948,789
Issue date
Apr 2, 2024
Sumco Corporation
Toshiyuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Processing apparatus
Patent number
11,945,074
Issue date
Apr 2, 2024
Disco Corporation
Nobuyuki Fukushi
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer processing method and grinding apparatus
Patent number
11,929,256
Issue date
Mar 12, 2024
Disco Corporation
Yuya Matsuoka
B24 - GRINDING POLISHING
Information
Patent Grant
Grinding apparatus
Patent number
11,904,432
Issue date
Feb 20, 2024
Disco Corporation
Satoru Fujimura
B24 - GRINDING POLISHING
Information
Patent Grant
Use of hardeners/densifiers in cutting or otherwise removing materi...
Patent number
11,904,353
Issue date
Feb 20, 2024
Adhesives Technology Corporation
Dal N. Hills
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing composition, polishing method, and method of producing se...
Patent number
11,884,843
Issue date
Jan 30, 2024
FUJIMI INCORPORATED
Ryota Mae
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Polishing pad, polishing apparatus and method of manufacturing semi...
Patent number
11,878,388
Issue date
Jan 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Cheng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Polishing apparatus
Patent number
11,865,665
Issue date
Jan 9, 2024
Ebara Corporation
Kenichi Kobayashi
B24 - GRINDING POLISHING
Information
Patent Grant
Substrate processing system, substrate processing method and comput...
Patent number
11,858,092
Issue date
Jan 2, 2024
Tokyo Electron Limited
Munehisa Kodama
B24 - GRINDING POLISHING
Information
Patent Grant
Hydrophilic and zeta potential tunable chemical mechanical polishin...
Patent number
11,826,876
Issue date
Nov 28, 2023
Applied Materials, Inc.
Sivapackia Ganapathiappan
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Seed crystal for single crystal 4H—SiC growth and method for proces...
Patent number
11,781,244
Issue date
Oct 10, 2023
Resonac Corporation
Takanori Kido
B24 - GRINDING POLISHING
Information
Patent Grant
Grinding method of composite substrate including resin and grinding...
Patent number
11,745,299
Issue date
Sep 5, 2023
OKAMOTO MACHINE TOOL WORKS, LTD.
Eiichi Yamamoto
B24 - GRINDING POLISHING
Information
Patent Grant
Stone slab manufacturing methods and systems
Patent number
11,741,590
Issue date
Aug 29, 2023
Cambria Company LLC
Eric Scott Olson
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Management method of machining system
Patent number
11,738,422
Issue date
Aug 29, 2023
Disco Corporation
Kazuma Sekiya
B24 - GRINDING POLISHING
Information
Patent Grant
Method and apparatus for manufacturing semiconductor device
Patent number
11,735,411
Issue date
Aug 22, 2023
OKAMOTO MACHINE TOOL WORKS, LTD.
Eiichi Yamamoto
B24 - GRINDING POLISHING
Information
Patent Grant
Processing apparatus
Patent number
11,731,239
Issue date
Aug 22, 2023
Disco Corporation
Nobuyuki Fukushi
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer processing method
Patent number
11,724,352
Issue date
Aug 15, 2023
Disco Corporation
Toshiyuki Sakai
B24 - GRINDING POLISHING
Information
Patent Grant
Workpiece grinding method
Patent number
11,717,927
Issue date
Aug 8, 2023
Disco Corporation
Yoshikazu Suzuki
B24 - GRINDING POLISHING
Information
Patent Grant
Annular frame cleaning accessory for grinding apparatus
Patent number
11,717,934
Issue date
Aug 8, 2023
Disco Corporation
Hirotoshi Hoshikawa
B24 - GRINDING POLISHING
Information
Patent Grant
Method for preparing SiC ingot, method for preparing SiC wafer and...
Patent number
11,708,644
Issue date
Jul 25, 2023
SENIC INC.
Jong Hwi Park
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Substrate processing apparatus and substrate processing method
Patent number
11,697,184
Issue date
Jul 11, 2023
Ebara Corporation
Makoto Kashiwagi
B24 - GRINDING POLISHING
Information
Patent Grant
Processing apparatus
Patent number
11,673,229
Issue date
Jun 13, 2023
Disco Corporation
Toshiyuki Sakai
B24 - GRINDING POLISHING
Information
Patent Grant
Processing apparatus
Patent number
11,667,003
Issue date
Jun 6, 2023
Disco Corporation
Nobuyuki Fukushi
B24 - GRINDING POLISHING
Information
Patent Grant
Grinding apparatus
Patent number
11,654,525
Issue date
May 23, 2023
Disco Corporation
Jiro Genozono
B24 - GRINDING POLISHING
Information
Patent Grant
Substrate-cleaning apparatus having tiltable roll brush
Patent number
11,654,458
Issue date
May 23, 2023
Samsung Electronics Co., Ltd.
Yonghee Lee
B08 - CLEANING
Patents Applications
last 30 patents
Information
Patent Application
METHODS FOR THINNING SUBSTRATES FOR SEMICONDUCTOR DEVICES
Publication number
20240173813
Publication date
May 30, 2024
Qorvo US, Inc.
Krishna Chetry
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER GRINDING PARAMETER OPTIMIZATION METHOD AND ELECTRONIC DEVICE
Publication number
20240173819
Publication date
May 30, 2024
GLOBALWAFERS CO., LTD.
Chih-Chun Cheng
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
Publication number
20240165765
Publication date
May 23, 2024
Shin-Etsu Handotai Co., Ltd.
Ryo HASEGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING APPARATUS
Publication number
20240149393
Publication date
May 9, 2024
Disco Corporation
Makoto MAEJIMA
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR PRODUCING DISCS FROM A CYLINDRICAL ROD MADE OF A SEMICON...
Publication number
20240136173
Publication date
Apr 25, 2024
Siltronic AG
Georg Pietsch
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING APPARATUS
Publication number
20240091899
Publication date
Mar 21, 2024
EBARA CORPORATION
Kenichi KOBAYASHI
B24 - GRINDING POLISHING
Information
Patent Application
METHODS FOR POLISHING BULK SILICON DEVICES
Publication number
20240096636
Publication date
Mar 21, 2024
Qorvo US, Inc.
Krishna Chetry
B24 - GRINDING POLISHING
Information
Patent Application
APPARATUS FOR MANUFACTURING ANALYTICAL SEMICONDUCTOR SAMPLES AND ME...
Publication number
20240085282
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Min Chul JO
B24 - GRINDING POLISHING
Information
Patent Application
METHODS AND SYSTEMS FOR FINISHING PLASTER LAYERS APPLIED TO BLOCK P...
Publication number
20240082978
Publication date
Mar 14, 2024
Tuscan StoneWorx USA, LLC
David L. Nicolson
B24 - GRINDING POLISHING
Information
Patent Application
CHUCK TABLE MANUFACTURING METHOD
Publication number
20240058918
Publication date
Feb 22, 2024
Disco Corporation
Junsoo WOO
B24 - GRINDING POLISHING
Information
Patent Application
ONSITE CLEANING SYSTEM AND METHOD
Publication number
20240050993
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Hao LIU
B08 - CLEANING
Information
Patent Application
POLYCRYSTALLINE SiC COMPACT AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240055236
Publication date
Feb 15, 2024
Tokai Carbon Co., Ltd.
Yohei Harada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STONE SLAB MANUFACTURING METHODS AND SYSTEMS
Publication number
20240046442
Publication date
Feb 8, 2024
Cambria Company LLC
Eric Scott Olson
B24 - GRINDING POLISHING
Information
Patent Application
CHIP TREATING METHOD
Publication number
20240047262
Publication date
Feb 8, 2024
Disco Corporation
Masaru Nakamura
B24 - GRINDING POLISHING
Information
Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
Publication number
20240030021
Publication date
Jan 25, 2024
TOKYO ELECTRON LIMITED
Yohei YAMASHITA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF AND APPARATUS FOR GRINDING WAFER
Publication number
20240017368
Publication date
Jan 18, 2024
Disco Corporation
Yohei GOKITA
B24 - GRINDING POLISHING
Information
Patent Application
DECORATIVE CONCRETE WITH UNIFORM SURFACE AND METHOD OF FORMING THE...
Publication number
20240011291
Publication date
Jan 11, 2024
SHAW & SONS, INC.
Ronald D. Shaw
B24 - GRINDING POLISHING
Information
Patent Application
GRINDING METHOD FOR SLICE WAFER
Publication number
20240009792
Publication date
Jan 11, 2024
Disco Corporation
Hidekazu NAKAYAMA
B24 - GRINDING POLISHING
Information
Patent Application
Polishing Pad for Chemical Mechanical Polishing and Method
Publication number
20230398659
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Te-Chien Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE AND METHOD FOR PRODUCING THE SAME
Publication number
20230398655
Publication date
Dec 14, 2023
Shin-Etsu Chemical Co., Ltd.
Naoki Yarita
B24 - GRINDING POLISHING
Information
Patent Application
WORKPIECE GRINDING METHOD
Publication number
20230398654
Publication date
Dec 14, 2023
Disco Corporation
Aki TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD AND WAFER PROCESSING SYSTEM
Publication number
20230395401
Publication date
Dec 7, 2023
Disco Corporation
Yuki INOUE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A FLUORESCENT SUBSTANCE
Publication number
20230381993
Publication date
Nov 30, 2023
ROOTS Co., Ltd.
Sung Yoon LEE
B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information
Patent Application
SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTR...
Publication number
20230373058
Publication date
Nov 23, 2023
Samsung Electronics Co., Ltd.
Donghoon KWON
B08 - CLEANING
Information
Patent Application
TOOL-HOLDER CYLINDER AND ABRASIVE UNIT FOR SURFACE MACHINING OF STO...
Publication number
20230347466
Publication date
Nov 2, 2023
PREMIER S.R.L.
Piergiorgio TREVISAN
B24 - GRINDING POLISHING
Information
Patent Application
Electrochemical Discharge-assisted Micro-grinding Device for Micro-...
Publication number
20230321740
Publication date
Oct 12, 2023
Changsha University of Science & Technology
Cong MAO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING MECHANICAL ELEMENT AND MECHANICAL ELEMENT
Publication number
20230321784
Publication date
Oct 12, 2023
KAWABATA MFG CO., LTD.
Kodo Kawabata
B24 - GRINDING POLISHING
Information
Patent Application
ORIGIN DETERMINATION METHOD AND GRINDING MACHINE
Publication number
20230321790
Publication date
Oct 12, 2023
Disco Corporation
Yasuyuki TAKEISHI
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR PRODUCING S...
Publication number
20230312982
Publication date
Oct 5, 2023
FUJIMI INCORPORATED
Tsutomu YOSHINO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
GRINDING METHOD OF WAFER
Publication number
20230302599
Publication date
Sep 28, 2023
Disco Corporation
Tatsuya SUZUKI
B24 - GRINDING POLISHING