for reducing stress inside of the package structure

Industry

CPC
B81C1/00325

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00325for reducing stress inside of the package structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device having a rugged package and fabrication process thereof
- Patent number 11,873,215
- Issue date Jan 16, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 11,795,053
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly substrates including a bond layer
- Patent number 11,787,690
- Issue date Oct 17, 2023
- Knowles Electronics, LLC
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-stress packaging structure for MEMS acceleration sensor chip
- Patent number 11,780,727
- Issue date Oct 10, 2023
- Zhejiang University
- Lufeng Che
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device built using the BEOL metal layers of a solid state semi...
- Patent number 11,780,725
- Issue date Oct 10, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS stress reduction structure embedded into package
- Patent number 11,760,627
- Issue date Sep 19, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method for manufacturing mems device
- Patent number 11,753,296
- Issue date Sep 12, 2023
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,713,242
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface micromechanical element and method for manufacturing the same
- Patent number 11,697,586
- Issue date Jul 11, 2023
- Teknologian tutkimuskeskus VTT Oy
- Aarne Oja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 11,655,142
- Issue date May 23, 2023
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS vibrator and MEMS oscillator
- Patent number 11,655,145
- Issue date May 23, 2023
- Kaneka Corporation
- Junji Sone
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Particle filter for MEMS device
- Patent number 11,649,162
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing delamination in sensor package
- Patent number 11,584,638
- Issue date Feb 21, 2023
- Invensense, Inc.
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,565,934
- Issue date Jan 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with flexible interconnect
- Patent number 11,542,152
- Issue date Jan 3, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing micromechanical diaphragm sensors
- Patent number 11,519,803
- Issue date Dec 6, 2022
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package, MEMS microphone and method of manufacturing the MEMS...
- Patent number 11,350,220
- Issue date May 31, 2022
- SAE Magnetics (H. K.) Ltd.
- Masashi Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device built using the BEOL metal layers of a solid state semi...
- Patent number 11,312,617
- Issue date Apr 26, 2022
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device built using the BEOL metal layers of a solid state semi...
- Patent number 11,267,692
- Issue date Mar 8, 2022
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carrier substrate for stress sensitive device and method of manufac...
- Patent number 11,234,082
- Issue date Jan 25, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a MEMS unit for a micromechanical pressure...
- Patent number 11,208,319
- Issue date Dec 28, 2021
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,174,158
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,150,092
- Issue date Oct 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Imanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device stress-reducing structure
- Patent number 11,142,453
- Issue date Oct 12, 2021
- TDK Corporation
- Klaus Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical sensor
- Patent number 11,111,137
- Issue date Sep 7, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20240002217
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20230406693
- Publication date Dec 21, 2023
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20230249962
- Publication date Aug 10, 2023
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL...
- Publication number 20230213389
- Publication date Jul 6, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Geoffroy DUMONT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
- Publication number 20230126914
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE
- Publication number 20220396472
- Publication date Dec 15, 2022
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220348456
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING DECREASED CONTACT RESISTANCE
- Publication number 20220289565
- Publication date Sep 15, 2022
- Qorvo US, Inc.
- Shibajyoti Ghosh Dastider
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF
- Publication number 20220185661
- Publication date Jun 16, 2022
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20220063994
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING DELAMINATION IN SENSOR PACKAGE.
- Publication number 20220033252
- Publication date Feb 3, 2022
- Efren Lacap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POLYAMIC ACID COMPOSITION FOR PACKAGING ELECTRONIC COMPONENTS, AND...
- Publication number 20220010070
- Publication date Jan 13, 2022
- PI Advanced Materials Co., Ltd.
- Ik Sang Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POLYAMIC ACID COMPOSITION FOR PACKAGING ELECTRONIC COMPONENTS, AND...
- Publication number 20220002489
- Publication date Jan 6, 2022
- PI Advanced Materials Co., Ltd.
- Gyeong Hyeon Ro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS-ISOLATED MEMS DEVICE COMPRISING SUBSTRATE HAVING CAVITY AND...
- Publication number 20210380403
- Publication date Dec 9, 2021
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20210348976
- Publication date Nov 11, 2021
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20210323812
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
- Publication number 20210238030
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS...
- Publication number 20210227334
- Publication date Jul 22, 2021
- SAE Magnetics (H.K.) Ltd.
- Masashi Shiraishi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210206628
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan TSAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...
- Publication number 20210206624
- Publication date Jul 8, 2021
- Nanusens SL
- Josep Montanyà Silvestre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD FOR A MEMS DEVICE
- Publication number 20210061652
- Publication date Mar 4, 2021
- IMEC vzw
- Deniz SABUNCUOGLU TEZCAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTICLE FILTER FOR MEMS DEVICE
- Publication number 20210047175
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
- Publication number 20210047176
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT
- Publication number 20210032098
- Publication date Feb 4, 2021
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Surface micromechanical element and method for manufacturing the same
- Publication number 20210002127
- Publication date Jan 7, 2021
- Teknologian Tutkimuskeskus VTT Oy
- Aarne Oja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS VIBRATOR AND MEMS OSCILLATOR
- Publication number 20200399120
- Publication date Dec 24, 2020
- Kaneka Corporation
- Junji Sone
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE
- Publication number 20200391999
- Publication date Dec 17, 2020
- Murata Manufacturing Co., Ltd.
- Masakazu Fukumitsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20200354214
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for reducing stress inside of the package structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micromechanical sensor device having an ASIC chip integrated into a...

Mems device having a rugged package and fabrication process thereof

Support structure for MEMS device with particle filter

Sensor devices with gas-permeable cover and associated production m...

MEMS assembly substrates including a bond layer

Low-stress packaging structure for MEMS acceleration sensor chip

MEMS device built using the BEOL metal layers of a solid state semi...

MEMS stress reduction structure embedded into package

MEMS device and method for manufacturing mems device

MEMS device with dummy-area utilization for pressure enhancement

Surface micromechanical element and method for manufacturing the same

Method of manufacturing a sensor device and moulding support structure

MEMS vibrator and MEMS oscillator

Particle filter for MEMS device

Reducing delamination in sensor package

Semiconductor package structures and methods of manufacturing the same

Semiconductor package with flexible interconnect

Semiconductor device packages and methods of manufacturing the same

Method for manufacturing micromechanical diaphragm sensors

Structures for packaging stress-sensitive micro-electro-mechanical...

Semiconductor package structure and method for manufacturing the same

MEMS package, MEMS microphone and method of manufacturing the MEMS...

Mems device built using the BEOL metal layers of a solid state semi...

Mems device built using the BEOL metal layers of a solid state semi...

Carrier substrate for stress sensitive device and method of manufac...

Method for manufacturing a MEMS unit for a micromechanical pressure...

MEMS device with dummy-area utilization for pressure enhancement

Sensor

MEMS device stress-reducing structure

Method for manufacturing a micromechanical sensor

Patents Applicationslast 30 patents

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL...

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

MEMS STRESS REDUCTION STRUCTURE EMBEDDED INTO PACKAGE

STRESS ISOLATED DEVICE PACKAGE AND METHOD OF MANUFACTURE

MEMS DEVICE HAVING DECREASED CONTACT RESISTANCE

MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

REDUCING DELAMINATION IN SENSOR PACKAGE.

POLYAMIC ACID COMPOSITION FOR PACKAGING ELECTRONIC COMPONENTS, AND...

POLYAMIC ACID COMPOSITION FOR PACKAGING ELECTRONIC COMPONENTS, AND...

STRESS-ISOLATED MEMS DEVICE COMPRISING SUBSTRATE HAVING CAVITY AND...

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER

MEMS Package, MEMS Microphone and Method of Manufacturing the MEMS...

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMI...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

FABRICATION METHOD FOR A MEMS DEVICE

PARTICLE FILTER FOR MEMS DEVICE

SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER

SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Surface micromechanical element and method for manufacturing the same

MEMS VIBRATOR AND MEMS OSCILLATOR

MEMS DEVICE AND METHOD FOR MANUFACTURING MEMS DEVICE

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...