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last 30 patents
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Patent Grant
Method and apparatus for treating substrate
Patent number
11,972,939
Issue date
Apr 30, 2024
Semes Co., Ltd.
Ohyeol Kwon
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Injection device and inspection and repairing method
Patent number
11,971,444
Issue date
Apr 30, 2024
PlayNitride Display Co., Ltd.
Cheng-Cian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging ellipsometry (IE)-based inspection method and method of fab...
Patent number
11,972,960
Issue date
Apr 30, 2024
Samsung Electronics Co., Ltd.
Myungjun Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,967,534
Issue date
Apr 23, 2024
Kokusai Electric Corporation
Tsukasa Kamakura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and measurement method for the package structure
Patent number
11,965,731
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
On-product overlay targets
Patent number
11,967,535
Issue date
Apr 23, 2024
KLA Corporation
Amnon Manassen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for automatically processing wafers
Patent number
11,961,772
Issue date
Apr 16, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Peng Yang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and a system for characterising structures etched in a subst...
Patent number
11,959,736
Issue date
Apr 16, 2024
UNITY SEMICONDUCTOR
Wolfgang Alexander Iff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SiC epitaxial wafer, production method therefor, and defect identif...
Patent number
11,961,736
Issue date
Apr 16, 2024
Resonac Corporation
Ling Guo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer device structure and methods for making the same
Patent number
11,961,826
Issue date
Apr 16, 2024
Harry-Hak-Lay Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and a system for combined characterisation of structures etc...
Patent number
11,959,737
Issue date
Apr 16, 2024
UNITY SEMICONDUCTOR
Wolfgang Alexander Iff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer searching method and device
Patent number
11,960,814
Issue date
Apr 16, 2024
Powerchip Semiconductor Manufacturing Corporation
Jr-Rung Shiu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Automated inspection tool
Patent number
11,961,770
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Han Lin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Model-based failure mitigation for semiconductor processing systems
Patent number
11,955,358
Issue date
Apr 9, 2024
Applied Materials, Inc.
Anshul Ashok Vyas
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method of fabricating a semiconductor device
Patent number
11,955,387
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Seongkeun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for evaluating defective region of wafer
Patent number
11,955,386
Issue date
Apr 9, 2024
SK SILTRON CO., LTD.
Jae Hyeong Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,955,398
Issue date
Apr 9, 2024
Fuji Electric Co., Ltd.
Eri Ogawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transmission-based temperature measurement of a workpiece in a ther...
Patent number
11,955,388
Issue date
Apr 9, 2024
Beijing E-Town Semiconductor Technology Co., Ltd.
Michael Storek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process monitoring of deep structures with X-ray scatterometry
Patent number
11,955,391
Issue date
Apr 9, 2024
KLA-Tencor Corporation
Antonio Arion Gellineau
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
System and method for measuring device inside through-silicon via s...
Patent number
11,955,392
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shuo-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and system for testing flatness
Patent number
11,948,845
Issue date
Apr 2, 2024
BOE Technology Group Co., Ltd.
Shaodong Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Implementation of deep neural networks for testing and quality cont...
Patent number
11,947,890
Issue date
Apr 2, 2024
SanDisk Technologies LLC
Cheng-Chung Chu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for producing nitride semiconductor laminate, silicon semico...
Patent number
11,946,874
Issue date
Apr 2, 2024
Sumitomo Chemical Company, Limited
Fumimasa Horikiri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Analyzing in-plane distortion
Patent number
11,948,846
Issue date
Apr 2, 2024
Applied Materials, Inc.
Wenjiao Wang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inspection apparatus and inspection method using same
Patent number
11,946,881
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Martin Priwisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film thickness measuring apparatus and film thickness measuring met...
Patent number
11,939,665
Issue date
Mar 26, 2024
Tokyo Electron Limted
Masato Shinada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer temperature measurement in an ion implantation system
Patent number
11,942,343
Issue date
Mar 26, 2024
Advanced Ion Beam Technology, Inc.
Chien-Li Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inspection method for detecting a defective bonding interface in a...
Patent number
11,942,379
Issue date
Mar 26, 2024
UNITY SEMICONDUCTOR
Dario Alliata
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR EVALUATING CRYSTAL DEFECTS IN SILICON CARBIDE SINGLE CRY...
Publication number
20240142390
Publication date
May 2, 2024
Shin-Etsu Handotai Co., Ltd.
Yutaka SHIGA
C30 - CRYSTAL GROWTH
Information
Patent Application
PROCESSING METHOD OF BONDED WAFER
Publication number
20240145248
Publication date
May 2, 2024
Disco Corporation
Hayato IGA
B32 - LAYERED PRODUCTS
Information
Patent Application
SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240145315
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
EUNHEE JEANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240145489
Publication date
May 2, 2024
SAMSUNG DISPLAY CO., LTD.
Ho Kyun AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMI...
Publication number
20240136234
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Mingyoo CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
Publication number
20240136231
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Donggap SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER
Publication number
20240136232
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Inkeun BAEK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER, PROCESSING APPARATUS FOR OVERLAY SHIFT AND PRO...
Publication number
20240134291
Publication date
Apr 25, 2024
WINBOND ELECTRONICS CORP.
Meng-Hsien TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MONITORING GATE OXIDE THICKNESS
Publication number
20240136233
Publication date
Apr 25, 2024
Shanghai Huali Integrated Circuit Corporation
Haibo LEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEM...
Publication number
20240136235
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Mamoru MATSUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS FOR DETECTING CLUSTERS OF WAFER DEFECTS
Publication number
20240128128
Publication date
Apr 18, 2024
SAMSUNG ELECTRONICS CO,. LTD.
KIBUM LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LUMINESCENCE METHOD FOR THE IN-LINE DETECTION OF ATOMIC SCALE DEFEC...
Publication number
20240128129
Publication date
Apr 18, 2024
The University of Hong Kong
Chi Chung Francis Ling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR EVALUATING SEMICONDUCTOR WAFER, METHOD FOR SELECTING SEM...
Publication number
20240128130
Publication date
Apr 18, 2024
Shin-Etsu Handotai Co., Ltd.
Junya SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Method for Reducing Substrate Thickness and Surface R...
Publication number
20240128066
Publication date
Apr 18, 2024
SPTS TECHNOLOGIES LIMITED
Roland Mumford
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCH GATE TYPE IGBT
Publication number
20240120390
Publication date
Apr 11, 2024
WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
TETSUYA OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240120423
Publication date
Apr 11, 2024
WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
TETSUYA OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SETUP METHOD FOR ADJUSTING THE TEMPERATURE CONDITIONS OF AN EPITAXY...
Publication number
20240120240
Publication date
Apr 11, 2024
SOITEC
YoungPil Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMPROVED TARGETS FOR DIFFRACTION-BASED OVERLAY ERROR METROLOGY
Publication number
20240118606
Publication date
Apr 11, 2024
KLA Corporation
Itay GDOR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240120291
Publication date
Apr 11, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF CORRECTING OVERLAY, METHOD OF CONTROLLING SEMICONDUCTOR P...
Publication number
20240118627
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Jeongjin Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORRECTING TARGET LOCATIONS FOR TEMPERATURE IN SEMICONDUCTOR APPLIC...
Publication number
20240120221
Publication date
Apr 11, 2024
KLA Corporation
Min-Yeong Moon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MATCHING PRE-PROCESSING AND POST-PROCESSING SUBSTRATE SAMPLES
Publication number
20240112961
Publication date
Apr 4, 2024
LAM RESEARCH CORPORATION
Yu Lu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SUBSTRATE TEST APPARATUS AND METHOD
Publication number
20240110879
Publication date
Apr 4, 2024
SEMES CO., LTD.
Gyunam PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE INSPECTION SYSTEM AND A METHOD OF USE THEREOF
Publication number
20240102169
Publication date
Mar 28, 2024
JNK TECH
Youngjin Choi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
END-TO-END MEASUREMENT FOR SEMICONDUCTOR SPECIMENS
Publication number
20240105522
Publication date
Mar 28, 2024
APPLIED MATERIALS ISRAEL LTD.
Tomer Haim PELED
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD FOR TESTING THE STRESS ROBUSTNESS OF A SEMICONDUCTOR SUBSTRATE
Publication number
20240105523
Publication date
Mar 28, 2024
Siltronic AG
Ludwig Koester
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICE, DIE BONDING SYSTEM, AND DIE BONDING METHOD
Publication number
20240105524
Publication date
Mar 28, 2024
Samsung Electronics Co., Ltd.
Hyungjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFECT ANALYSIS DEVICE AND DEFECT ANALYSIS METHOD USING THE SAME
Publication number
20240102942
Publication date
Mar 28, 2024
SAMSUNG DISPLAY CO., LTD.
YEON KEON MOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR DETERMINING PARAMETERS OF THREE DIMENSIONAL NANOSTRUCTUR...
Publication number
20240102950
Publication date
Mar 28, 2024
Industrial Technology Research Institute
Chun-Ting LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20240105569
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
ByungHyun KWAK
H01 - BASIC ELECTRIC ELEMENTS