Forming interconnections between the electronic processing unit and the micromechanical structure

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B81C2203/0792

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/0792Forming interconnections between the electronic processing unit and the micromechanical structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,227,410
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...
- Patent number 12,208,416
- Issue date Jan 28, 2025
- Zhejiang Xiansheng Technology Co., Ltd.
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 12,209,015
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for manufacturing sensing device
- Patent number 12,024,420
- Issue date Jul 2, 2024
- Mitsumi Electric Co., Ltd.
- Etsuji Hayakawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,897,759
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Po Chen Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly substrates including a bond layer
- Patent number 11,787,690
- Issue date Oct 17, 2023
- Knowles Electronics, LLC
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,708,262
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Hsien Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,691,870
- Issue date Jul 4, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Panel transducer scale package and method of manufacturing the same
- Patent number 11,679,975
- Issue date Jun 20, 2023
- Vermon S.A.
- Claire Bantignies
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,667,519
- Issue date Jun 6, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Extended acid etch for oxide removal
- Patent number 11,655,146
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Ta Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with topography
- Patent number 11,618,674
- Issue date Apr 4, 2023
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 11,579,033
- Issue date Feb 14, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS ACOUSTIC ELEMENT
- Publication number 20250039611
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240383743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yu LIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS
- Publication number 20240272004
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...
- Publication number 20240207845
- Publication date Jun 27, 2024
- IMEC vzw
- Lei ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS LOUDSPEAKER MANUFACTURING METHOD AND MEMS LOUDSPEAKER
- Publication number 20240174513
- Publication date May 30, 2024
- AAC Kaitai Technologies (Wuhan) CO., LTD
- Qiang Dan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE
- Publication number 20240174514
- Publication date May 30, 2024
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240140782
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...
- Publication number 20230406697
- Publication date Dec 21, 2023
- ROBERT BOSCH GmbH
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20230399225
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- PO CHEN YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230382713
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- RAMACHANDRAMURTHY PRADEEP YELEHANKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230348259
- Publication date Nov 2, 2023
- Vanguard International Semiconductor Corporation
- WAI MUN CHONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
- Publication number 20230303389
- Publication date Sep 28, 2023
- eXo Imaging, Inc.
- Liang WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTENDED ACID ETCH FOR OXIDE REMOVAL
- Publication number 20230264949
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY
- Publication number 20230202835
- Publication date Jun 29, 2023
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...
- Publication number 20230110259
- Publication date Apr 13, 2023
- STMicroelectronics (Malta) Ltd.
- Kevin FORMOSA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT
- Publication number 20230030627
- Publication date Feb 2, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20230036136
- Publication date Feb 2, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Semiconductor Structure and Method of Forming the Same
- Publication number 20220380208
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.,
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...
- Publication number 20220362804
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Hsuan Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Forming interconnections between the electronic processing unit and the micromechanical structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for forming the same

CMUT-on-CMOS ultrasonic transducer by bonding active wafers and man...

MEMS packages and methods of manufacture thereof

Microelectronics package with vertically stacked MEMS device and co...

Method for producing a wafer connection

Semiconductor integrated device with electrical contacts between st...

Sensing device and method for manufacturing sensing device

Method of manufacturing electronic devices and corresponding electr...

Semiconductor package and method for manufacturing the same

MEMS device having a metallization structure embedded in a dielectr...

Signal processing circuit for triple-membrane MEMS device

Micromechanical sensor device having an ASIC chip integrated into a...

Semiconductor device and method for forming the same

Microelectromechanical system (MEMS) sensor packages and methods fo...

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Microfabricated ultrasonic transducers and related apparatus and me...

MEMS assembly substrates including a bond layer

Actuator layer patterning with polysilicon and etch stop layer

Manufacturing method of semiconductor structure

Semiconductor device including a microelectromechanical structure a...

MEMS packages and methods of manufacture thereof

Panel transducer scale package and method of manufacturing the same

Semiconductor device including a microelectromechanical structure a...

MEMS packaging structure and manufacturing method therefor

Extended acid etch for oxide removal

Actuator layer patterning with topography

Semiconductive structure and manufacturing method thereof

MEMS pressure sensor

Microfabricated ultrasonic transducer having individual cells with...

Patents Applicationslast 30 patents

MEMS ACOUSTIC ELEMENT

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

OVER-THE-SINK DRYING ELEMENT

MICROELECTROMECHANICAL DEVICE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

MICROFLUIDIC DEVICE AND A METHOD FOR MANUFACTURING A MICROFLUIDIC D...

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

MEMS LOUDSPEAKER MANUFACTURING METHOD AND MEMS LOUDSPEAKER

SIGNAL PROCESSING CIRCUIT FOR TRIPLE-MEMBRANE MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

MEMS PRESSURE SENSOR

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

MEMS Packages and Methods of Manufacture Thereof

EXTENDED ACID ETCH FOR OXIDE REMOVAL

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

METHOD OF MANUFACTURING ELECTRONIC DEVICES AND CORRESPONDING ELECTR...

SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Stacked Semiconductor Structure and Method of Forming the Same

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

SEMICONDUCTOR DEVICE HAVING MICROELECTROMECHANICAL SYSTEMS DEVICES...