Guiding structures both on and outside the body

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H01L2224/81141

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81141Guiding structures both on and outside the body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solder bridging elimination for bulk solder C2S intercon...
- Patent number 11,670,612
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Device-bonded body, image pickup module, endoscope and method for m...
- Patent number 11,043,524
- Issue date Jun 22, 2021
- Olympus Corporation
- Takashi Nakayama
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,790,253
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,600,751
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 10,438,910
- Issue date Oct 8, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-chip alignment
- Patent number 10,410,989
- Issue date Sep 10, 2019
- University of Notre Dame du Lac
- Douglas C. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
- Patent number 10,388,626
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,290,599
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,192,839
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,893,026
- Issue date Feb 13, 2018
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,721,916
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structures that implement two-phase cooling with radial...
- Patent number 9,648,782
- Issue date May 9, 2017
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge coupling alignment using embedded features
- Patent number 9,583,684
- Issue date Feb 28, 2017
- Intel Corporation
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 9,553,053
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having magnetic alignment marks and underfill...
- Patent number 9,548,290
- Issue date Jan 17, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
- Publication number 20240153908
- Publication date May 9, 2024
- HKC Corporation Limited
- YANG PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MOUNTING SUBSTRATE, MICRO-LED DISPLAY, AND METHOD OF MANU...
- Publication number 20220352118
- Publication date Nov 3, 2022
- Sharp Kabushiki Kaisha
- Yoshiyuki HARUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly Packaging Method, Semiconductor Assembly and...
- Publication number 20220216176
- Publication date Jul 7, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20190164921
- Publication date May 30, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20190157238
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...
- Publication number 20140361427
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140252604
- Publication date Sep 11, 2014
- TOHOKU-MICROTEC CO., LTD
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140206144
- Publication date Jul 24, 2014
- KABUSHIKI KAISHA TOSHIBA
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140206143
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140203428
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES
- Publication number 20140175477
- Publication date Jun 26, 2014
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In System Reflow of Low Temperature Eutectic Bond Balls
- Publication number 20140144971
- Publication date May 29, 2014
- Research Triangle Institute
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...
- Publication number 20140103522
- Publication date Apr 17, 2014
- OLYMPUS CORPORATION
- Yoshiaki Takemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MULTI-SCALE ALIGNMENT AND FASTENING
- Publication number 20140090234
- Publication date Apr 3, 2014
- University of Massachusetts
- David Kazmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY
- Publication number 20140084454
- Publication date Mar 27, 2014
- Apple Inc.
- Shawn X. ARNOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...
- Publication number 20140071628
- Publication date Mar 13, 2014
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS

Guiding structures both on and outside the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor product with interlocking metal-to-metal bonds and me...

Advanced device assembly structures and methods

Method for solder bridging elimination for bulk solder C2S intercon...

Packages for semiconductor devices, packaged semiconductor devices,...

3D integrated circuit (3DIC) structure

Enhanced adhesive materials and processes for 3D applications

Device-bonded body, image pickup module, endoscope and method for m...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor devices, methods of manufacture thereof, and semicond...

Conductive pillar shaped for solder confinement

Enhanced adhesive materials and processes for 3D applications

Bonded semiconductor package and related methods

Conductive pillar shaped for solder confinement

Semiconductor product with interlocking metal-to-metal bonds and me...

Inter-chip alignment

Semiconductor device and method of forming flipchip interconnect st...

Conductive pillar shaped for solder confinement

Conductive pillar shaped for solder confinement

Conductive connections, structures with such connections, and metho...

Conductive connections, structures with such connections, and metho...

Systems, methods and devices for inter-substrate coupling

Conductive connections, structures with such connections, and metho...

Semiconductor devices, methods of manufacture thereof, and semicond...

Systems, methods and devices for inter-substrate coupling

Concentric bump design for the alignment in die stacking

Chip stack structures that implement two-phase cooling with radial...

Method for aligning micro-electronic components

Edge coupling alignment using embedded features

Bump structure for yield improvement

Semiconductor device having magnetic alignment marks and underfill...

Patents Applicationslast 30 patents

DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

MICRO-LED MOUNTING SUBSTRATE, MICRO-LED DISPLAY, AND METHOD OF MANU...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Semiconductor Assembly Packaging Method, Semiconductor Assembly and...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

Advanced Device Assembly Structures And Methods

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND...

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for Bonding Semiconductor Devices

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

EDGE COUPLING ALIGNMENT USING EMBEDDED FEATURES

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

In System Reflow of Low Temperature Eutectic Bond Balls

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANFAC...

APPARATUS AND METHODS FOR MULTI-SCALE ALIGNMENT AND FASTENING

DIRECT MULTIPLE SUBSTRATE DIE ASSEMBLY

CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL...