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High-frequency adaptations
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Patents Grants
last 30 patents
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Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple conductive posts
Patent number
11,973,043
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods related to switch body connections to achieve soft breakdown
Patent number
11,973,115
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Ambarish Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
Patent number
11,973,033
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Output-integrated transistor device packages
Patent number
11,967,936
Issue date
Apr 23, 2024
MACOM Technology Solutions Holdings, Inc.
Marvin Marbell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High frequency and high power thin-film component
Patent number
11,967,609
Issue date
Apr 23, 2024
KYOCERA AVX Components Corporation
Cory Nelson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ex-situ manufacture of metal micro-wires and FIB placement in IC ci...
Patent number
11,967,569
Issue date
Apr 23, 2024
Texas Instruments Incorporated
Michael Lee Dawson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modularized power amplifier devices and architectures
Patent number
11,967,937
Issue date
Apr 23, 2024
Viasat, Inc.
Shih Peng Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,752
Issue date
Apr 23, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho Kyung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,759
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Soon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and method
Patent number
11,961,809
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,961,813
Issue date
Apr 16, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,961,814
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hsun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass based empty substrate integrated waveguide devices
Patent number
11,962,057
Issue date
Apr 16, 2024
3D GLASS SOLUTIONS, INC.
Jeb H. Flemming
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna structure and image display device including the same
Patent number
11,955,432
Issue date
Apr 9, 2024
Dongwoo Fine-Chem Co., Ltd.
Yoon Ho Huh
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Semiconductor device package including multiple substrates with dif...
Patent number
11,955,419
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Yi Chun Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
High-frequency module and communication device
Patent number
11,955,933
Issue date
Apr 9, 2024
Murata Manufacturing Co., Ltd.
Atsushi Horita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising interconnects in a core layer configured for s...
Patent number
11,955,409
Issue date
Apr 9, 2024
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light receiving module comprising stem and block on an upper surfac...
Patent number
11,953,375
Issue date
Apr 9, 2024
Mitsubishi Electric Corporation
Kazuki Yamaji
G01 - MEASURING TESTING
Information
Patent Grant
Differential on-chip loop antenna
Patent number
11,955,728
Issue date
Apr 9, 2024
Intel Corporation
Nir Weisman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
Patent number
11,955,426
Issue date
Apr 9, 2024
Intel Corporation
Huong Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite structure, intended for a planar co-integration of electr...
Patent number
11,955,375
Issue date
Apr 9, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Marilyne Roumanie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-equalized and self-crosstalk-compensated 3D transmission line...
Patent number
11,955,436
Issue date
Apr 9, 2024
Intel Corporation
Khang Choong Yong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
Publication number
20240145402
Publication date
May 2, 2024
CYPRESS SEMICONDUCTOR CORPORATION
Mark PAVIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
Publication number
20240145526
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Active Microelectronic Assembly Containing A Decoupling Capacitor
Publication number
20240145449
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER AND RADIO FREQUENCY MODULE
Publication number
20240146262
Publication date
May 2, 2024
Mitsubishi Electric Corporation
Ko KANAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
Publication number
20240145414
Publication date
May 2, 2024
Wolfspeed, Inc.
Gerard Bouisse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240145413
Publication date
May 2, 2024
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Makoto NISHIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
Publication number
20240145415
Publication date
May 2, 2024
PanelSemi Corporation
HSIEN-TE CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip-On-Wafer Assembly Containing A Decoupling Capacitor
Publication number
20240145451
Publication date
May 2, 2024
KYOCERA AVX Components Corporation
Laurent Desclos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
Publication number
20240128635
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
Publication number
20240128041
Publication date
Apr 18, 2024
Skyworks Solutions, Inc.
Bo Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20240128201
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SYSTEM INTEGRATION
Publication number
20240128238
Publication date
Apr 18, 2024
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CHIP CARRIER PACKAGE
Publication number
20240128170
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Effect Protection and Electrostatic Discharge Protection fo...
Publication number
20240120639
Publication date
Apr 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsiang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
Publication number
20240120297
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120640
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Jenchun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS
Publication number
20240120651
Publication date
Apr 11, 2024
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
Publication number
20240113049
Publication date
Apr 4, 2024
Intel Corporation
Kristof Kuwawi Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE BANDGAP TRANSISTOR LAYOUT WITH FOLDED GATE
Publication number
20240113180
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre BLIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...
Publication number
20240113413
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
Publication number
20240113038
Publication date
Apr 4, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH ANTENNAS
Publication number
20240113052
Publication date
Apr 4, 2024
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SWITCHING MODULE
Publication number
20240113667
Publication date
Apr 4, 2024
KYOSAN ELECTRIC MFG. CO., LTD.
Hiroshi Kunitama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE BANDGAP TRANSISTOR LAYOUT WITH DRAIN ON OUTER EDGE
Publication number
20240113051
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre Blin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EFFICIENCY IMPROVEMENTS FOR MULTI-STAGE POWER AMPLIFIERS
Publication number
20240113669
Publication date
Apr 4, 2024
MACOM Technology Solutions Holdings, Inc.
Gerard J.L Bouisse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER
Publication number
20240113006
Publication date
Apr 4, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Publication number
20240113050
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Juan Herbsommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIELD EFFECT TRANSISTOR WITH INTEGRATED SERIES CAPACITANCE
Publication number
20240105712
Publication date
Mar 28, 2024
Wolfspeed, Inc.
Jeremy Fisher
H01 - BASIC ELECTRIC ELEMENTS