Interconnection or interfacing through or under capping or via rear of substrate in microsensors

Industry

CPC
G01B2210/64

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Parent Industries

GPHYSICS G01Measuring instruments G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS G01B2210/00Aspects not specifically covered by any group under G01B

Current Industry

G01B2210/64Interconnection or interfacing through or under capping or via rear of substrate in microsensors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transistor and circuit incorporating same
- Patent number 5,683,919
- Issue date Nov 4, 1997
- Texas Instruments Incorporated
- Hua Quen Tserng
- G01 - MEASURING TESTING
Information Patent Grant
Sealed cavity arrangement method
- Patent number 5,591,679
- Issue date Jan 7, 1997
- Sensonor A/S
- Henrik Jakobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backside contact of sensor microstructures
- Patent number 5,511,428
- Issue date Apr 30, 1996
- Massachusetts Institute of Technology
- Howard D. Goldberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having sealed electrical feedthrough
- Patent number 5,041,900
- Issue date Aug 20, 1991
- Hamilton Standard Controls, Inc.
- Frank Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of sealing an electrical feedthrough in a semiconductor device
- Patent number 4,849,374
- Issue date Jul 18, 1989
- Spectrol Reliance Limited
- Frank Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for mounting semiconductors
- Patent number 4,780,572
- Issue date Oct 25, 1988
- NGK Spark Plug Co., Ltd
- Kazuo Kondo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making silicon capacitive pressure sensor with glass laye...
- Patent number 4,773,972
- Issue date Sep 27, 1988
- Ford Motor Company
- Mati Mikkor
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having improved lead attachment
- Patent number 4,516,148
- Issue date May 7, 1985
- The Board of Trustees of the Leland Stanford, Jr. University
- Phillip W. Barth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultra-thin microelectronic pressure sensors
- Patent number 4,463,336
- Issue date Jul 31, 1984
- United Technologies Corporation
- James F. Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultra-thin microelectronic pressure sensors
- Patent number 4,426,768
- Issue date Jan 24, 1984
- United Technologies Corporation
- James F. Black
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of fabricating transducers employing flat bondable surfaces...
- Patent number 4,208,782
- Issue date Jun 24, 1980
- Kulite Semiconductor Products, Inc.
- Anthony D. Kurtz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducers employing flat bondable surfaces with bur...
- Patent number 4,202,217
- Issue date May 13, 1980
- Kulite Semiconductor Products, Inc.
- Anthony D. Kurtz
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Interconnection or interfacing through or under capping or via rear of substrate in microsensors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transistor and circuit incorporating same

Sealed cavity arrangement method

Backside contact of sensor microstructures

Semiconductor device having sealed electrical feedthrough

Method of sealing an electrical feedthrough in a semiconductor device

Device for mounting semiconductors

Method of making silicon capacitive pressure sensor with glass laye...

Semiconductor device having improved lead attachment

Ultra-thin microelectronic pressure sensors

Ultra-thin microelectronic pressure sensors

Methods of fabricating transducers employing flat bondable surfaces...

Semiconductor transducers employing flat bondable surfaces with bur...