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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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H01L24/26
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Patents Grants
last 30 patents
Information
Patent Grant
Package comprising spacers between integrated devices
Patent number
11,948,909
Issue date
Apr 2, 2024
QUALCOMM Incorporated
Yangyang Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device including electronic components and pin holes
Patent number
11,935,991
Issue date
Mar 19, 2024
Nichia Corporation
Shinya Okura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
11,923,330
Issue date
Mar 5, 2024
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,916,035
Issue date
Feb 27, 2024
Powertech Technology Inc.
Shang-Yu Chang Chien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with die including cavities
Patent number
11,908,699
Issue date
Feb 20, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
Patent number
11,908,819
Issue date
Feb 20, 2024
Apple Inc.
Jun Chung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backmetal removal methods
Patent number
11,901,184
Issue date
Feb 13, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with die support structure for thin die
Patent number
11,894,234
Issue date
Feb 6, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked IC structure with orthogonal interconnect layers
Patent number
11,881,454
Issue date
Jan 23, 2024
Adeia Semiconductor Inc.
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical redundancy for bonded structures
Patent number
11,842,894
Issue date
Dec 12, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and manufacturing method thereof
Patent number
11,792,924
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Taehyeun Ha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
11,791,324
Issue date
Oct 17, 2023
Nichia Corporation
Kenji Ozeki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming first protective film
Patent number
11,781,033
Issue date
Oct 10, 2023
Lintec Corporation
Masanori Yamagishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
Patent number
11,784,153
Issue date
Oct 10, 2023
Kyocera Corporation
Masakazu Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of room temperature covalent bonding
Patent number
11,760,059
Issue date
Sep 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Qin-Yi Tong
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Display module and method of manufacturing the same
Patent number
11,715,729
Issue date
Aug 1, 2023
Samsung Electronics Co., Ltd.
Yoonsuk Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMI shielding for flip chip package with exposed die backside
Patent number
11,715,703
Issue date
Aug 1, 2023
STATS ChipPAC Pte. Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic switching device and method of manufacturing the same
Patent number
11,701,728
Issue date
Jul 18, 2023
Samsung Electronics Co., Ltd.
Jinseong Heo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wound body of sheet for sintering bonding with base material
Patent number
11,697,567
Issue date
Jul 11, 2023
Nitto Denko Corporation
Ryota Mita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bridge interconnection with layered interconnect structures
Patent number
11,694,960
Issue date
Jul 4, 2023
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages formed using RDL-last process
Patent number
11,670,617
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including sensor placed under display
Patent number
11,663,847
Issue date
May 30, 2023
Samsung Electronics Co., Ltd.
Yunjang Jin
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Light-emitting display unit and display apparatus
Patent number
11,652,077
Issue date
May 16, 2023
PlayNitride Display Co., Ltd.
Po-Jen Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar cell module including solar cells
Patent number
11,652,178
Issue date
May 16, 2023
Panasonic Holdings Corporation
Haruhisa Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package structure and fabrication method thereof
Patent number
11,615,997
Issue date
Mar 28, 2023
Richwave Technology Corp.
Yu-Lung Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flux
Patent number
11,571,772
Issue date
Feb 7, 2023
Senju Metal Industry Co., Ltd.
Takahiro Nishizaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser marked code pattern for representing tracing number of chip
Patent number
11,562,928
Issue date
Jan 24, 2023
OmniVision Technologies, Inc.
Wei-Feng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D chip with shared clock distribution network
Patent number
11,557,516
Issue date
Jan 17, 2023
Adeia Semiconductor Inc.
Javier DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
11,515,272
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low temperature bonded structures
Patent number
11,515,279
Issue date
Nov 29, 2022
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
Publication number
20240145420
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
Publication number
20240136333
Publication date
Apr 25, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
Publication number
20240128210
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Amit Ashara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
Publication number
20240128224
Publication date
Apr 18, 2024
SAMSUNG DISPLAY CO., LTD.
Jung Hoon SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
Publication number
20240038723
Publication date
Feb 1, 2024
International Business Machines Corporation
Jae-Woong Nah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES
Publication number
20230420435
Publication date
Dec 28, 2023
Nichia Corporation.
Kenji OZEKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BASE PLATE HAVING SIDEWALL, POWER SEMICONDUCTOR MODULE COMPRISING T...
Publication number
20230420315
Publication date
Dec 28, 2023
Hitachi Energy Switzerland AG
Biwei ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
Publication number
20230420419
Publication date
Dec 28, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
Publication number
20230411335
Publication date
Dec 21, 2023
Kyocera Corporation
Masakazu FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230402424
Publication date
Dec 14, 2023
Samsung Electronics Co., Ltd.
Yongjin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCO...
Publication number
20230399492
Publication date
Dec 14, 2023
FUJIFILM CORPORATION
Junji KAWAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
Publication number
20230378124
Publication date
Nov 23, 2023
Intel Corporation
Frederick Atadana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20230369274
Publication date
Nov 16, 2023
Taiwan Semiconduction Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
Publication number
20230343803
Publication date
Oct 26, 2023
Sony Semiconductor Solutions Corporation
Toshiaki IWAFUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-FILM PACKAGE
Publication number
20230326896
Publication date
Oct 12, 2023
Chipbond Technology Corporation
Sheng-Jen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME
Publication number
20230307342
Publication date
Sep 28, 2023
LG Innotek Co., Ltd.
Il Sik NAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packages Formed Using RDL-Last Process
Publication number
20230268317
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE BONDED STRUCTURES
Publication number
20230268307
Publication date
Aug 24, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
Publication number
20230223375
Publication date
Jul 13, 2023
QUALCOMM Incorporated
Yangyang SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING MODULE AND ELECTRONIC DEVICE
Publication number
20230207510
Publication date
Jun 29, 2023
VIVO MOBILE COMMUNICATION CO., LTD.
Yuegang ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS
Publication number
20230197886
Publication date
Jun 22, 2023
Rohm Co., Ltd.
Kazuya Masuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE
Publication number
20230197548
Publication date
Jun 22, 2023
RICHWAVE TECHNOLOGY CORP.
Yu-Lung Wen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CHIP WITH SHARED CLOCK DISTRIBUTION NETWORK
Publication number
20230137580
Publication date
May 4, 2023
Adeia Semiconductor Inc.
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESI...
Publication number
20230132513
Publication date
May 4, 2023
Mitsubishi Electric Corporation
Ryuichi ISHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDE COOLING-TYPE SEMICONDUCTOR DEVICE
Publication number
20230119737
Publication date
Apr 20, 2023
Hyundai Motor Company
Young Seok Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Display Device
Publication number
20230121603
Publication date
Apr 20, 2023
LG Display Co., Ltd.
Hoiyong KWON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
Publication number
20230085734
Publication date
Mar 23, 2023
Samsung Electronics Co., Ltd.
Sunjae KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20230048729
Publication date
Feb 16, 2023
Samsung Electronics Co., Ltd.
YEONGKWON KO
H01 - BASIC ELECTRIC ELEMENTS