Layer connectors

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CPC
H01L24/26

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/26Layer connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
3D chip with shared clock distribution network
- Patent number 12,142,528
- Issue date Nov 12, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package structure
- Patent number 12,125,760
- Issue date Oct 22, 2024
- Richwave Technology Corp.
- Yu-Lung Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out (InFO) package structure
- Patent number 12,094,830
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a deformable flow blocking mem...
- Patent number 12,094,798
- Issue date Sep 17, 2024
- Mitsubishi Electric Corporation
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,046,583
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,046,571
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall coatings and related methods
- Patent number 12,040,192
- Issue date Jul 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 12,009,297
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Morae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device including electronic components and pin holes
- Patent number 11,935,991
- Issue date Mar 19, 2024
- Nichia Corporation
- Shinya Okura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, display device, and manufacturing method of displa...
- Patent number 11,923,330
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Jung Hoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,916,035
- Issue date Feb 27, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die including cavities
- Patent number 11,908,699
- Issue date Feb 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backmetal removal methods
- Patent number 11,901,184
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with die support structure for thin die
- Patent number 11,894,234
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 11,881,454
- Issue date Jan 23, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 11,842,894
- Issue date Dec 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 11,792,924
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Taehyeun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,791,324
- Issue date Oct 17, 2023
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming first protective film
- Patent number 11,781,033
- Issue date Oct 10, 2023
- Lintec Corporation
- Masanori Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition, semiconductor device, and electric...
- Patent number 11,784,153
- Issue date Oct 10, 2023
- Kyocera Corporation
- Masakazu Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371778
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240363576
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...
- Publication number 20240355777
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNGHYUN BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE WARPAGE CONTROL SPACERS
- Publication number 20240347432
- Publication date Oct 17, 2024
- Nokia Solutions and Networks Oy
- Alex Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL COATINGS AND RELATED METHODS
- Publication number 20240332025
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321847
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT
- Publication number 20240312895
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS
- Publication number 20240234320
- Publication date Jul 11, 2024
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240213204
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS
- Publication number 20240203744
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
- Publication number 20240136333
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
- Publication number 20240128210
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amit Ashara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...
- Publication number 20240128224
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jung Hoon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES
- Publication number 20230420435
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE PLATE HAVING SIDEWALL, POWER SEMICONDUCTOR MODULE COMPRISING T...
- Publication number 20230420315
- Publication date Dec 28, 2023
- Hitachi Energy Switzerland AG
- Biwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
- Publication number 20230420419
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...
- Publication number 20230411335
- Publication date Dec 21, 2023
- Kyocera Corporation
- Masakazu FUJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCO...
- Publication number 20230399492
- Publication date Dec 14, 2023
- FUJIFILM CORPORATION
- Junji KAWAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL
- Publication number 20230378124
- Publication date Nov 23, 2023
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...
- Publication number 20230343803
- Publication date Oct 26, 2023
- Sony Semiconductor Solutions Corporation
- Toshiaki IWAFUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME
- Publication number 20230307342
- Publication date Sep 28, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages Formed Using RDL-Last Process
- Publication number 20230268317
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D chip with shared clock distribution network

Bridge interconnection with layered interconnect structures

Method for fabricating electronic package structure

Method for manufacturing a structure

Integrated fan-out (InFO) package structure

Power semiconductor device including a deformable flow blocking mem...

Method for manufacturing light emitting devices

Semiconductor die contact structure and method

Electrical redundancy for bonded structures

Low temperature bonded structures

Die sidewall coatings and related methods

Semiconductor device and semiconductor package

In-package 3D antenna

Package comprising spacers between integrated devices

Light emitting device including electronic components and pin holes

Adhesive member, display device, and manufacturing method of displa...

Package structure and manufacturing method thereof

Semiconductor packages with die including cavities

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Backmetal removal methods

Semiconductor packages with die support structure for thin die

Stacked IC structure with orthogonal interconnect layers

Electrical redundancy for bonded structures

Printed circuit board and manufacturing method thereof

Light emitting device

Method of forming first protective film

Thermosetting resin composition, semiconductor device, and electric...

Method of room temperature covalent bonding

Display module and method of manufacturing the same

EMI shielding for flip chip package with exposed die backside

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...

CONFIGURABLE WARPAGE CONTROL SPACERS

DIE SIDEWALL COATINGS AND RELATED METHODS

SEMICONDUCTOR PACKAGE

POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

STACKED IC STRUCTURE WITH ORTHOGONAL INTERCONNECT LAYERS

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

SEMICONDUCTOR PACKAGES WITH DIE INCLUDING CAVITIES AND RELATED METHODS

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

Thermally Conductive IC Spacer with Integrated Electrical Isolation

ADHESIVE MEMBER, DISPLAY DEVICE, AND MANUFACTURING METHOD OF DISPLA...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES

BASE PLATE HAVING SIDEWALL, POWER SEMICONDUCTOR MODULE COMPRISING T...

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICA...

SEMICONDUCTOR PACKAGE

UNDERFILL COMPOSITION, COATING FILM, CURED FILM, MULTILAYER INTERCO...

MICROELECTRONIC ASSEMBLY WITH UNDERFILL FLOW CONTROL

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC...

CHIP-ON-FILM PACKAGE

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME

Packages Formed Using RDL-Last Process