TREA

Located on chip prior to dicing and remaining on chip after dicing

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Industry

  • CPC
  • H01L2223/5448
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/5448Located on chip prior to dicing and remaining on chip after dicing
Industries