Located on chip prior to dicing and remaining on chip after dicing

Industry

CPC
H01L2223/5448

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/5448Located on chip prior to dicing and remaining on chip after dicing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,921,134
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,881,415
- Issue date Jan 23, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,817,445
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including at least one die position checker
- Patent number 11,764,160
- Issue date Sep 19, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,653
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
- Patent number 11,658,099
- Issue date May 23, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing display device
- Patent number 11,637,034
- Issue date Apr 25, 2023
- Samsung Display Co., Ltd.
- Kyung Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,619,658
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having integrated circuit component with conducti...
- Patent number 11,417,569
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic semiconductor component and method for producing an elec...
- Patent number 11,367,691
- Issue date Jun 21, 2022
- OSRAM OLED GmbH
- Matthias Kiessling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,270,989
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...
- Publication number 20240030199
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY
- Publication number 20240006373
- Publication date Jan 4, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YOU-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
- Publication number 20230402396
- Publication date Dec 14, 2023
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE FOR SEMICONDUCTOR PACKAGE INCLUDING PERIPHERAL...
- Publication number 20230395521
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT...
- Publication number 20230378085
- Publication date Nov 23, 2023
- Exagan SAS
- Matthieu NONGAILLARD
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230361017
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230335533
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE
- Publication number 20230317521
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...
- Publication number 20230282594
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230085198
- Publication date Mar 16, 2023
- InnoLux Corporation
- Liang-Lu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME
- Publication number 20220319925
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20220189942
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME
- Publication number 20220181266
- Publication date Jun 9, 2022
- Osram Opto Semiconductors GmbH
- Michael BRANDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD
- Publication number 20220173066
- Publication date Jun 2, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
- Publication number 20220037265
- Publication date Feb 3, 2022
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
- Publication number 20220020696
- Publication date Jan 20, 2022
- Disco Corporation
- Yoshinobu SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210398942
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER
- Publication number 20210343549
- Publication date Nov 4, 2021
- PEP INNOVATION PTE LTD.
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20210305064
- Publication date Sep 30, 2021
- Hwee Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
- Publication number 20210265455
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20210265247
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...
- Publication number 20210183719
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyoko NISHIDONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210175205
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20210118809
- Publication date Apr 22, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS

Located on chip prior to dicing and remaining on chip after dicing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor integrated fluxgate device shielded by discrete magne...

Display device having information code on a lateral side of display...

Method for fabricating a chip package

Integrated fan-out package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method of packaging chip and chip package structure

Electronic component, electric device including the same

Mounting device and mounting method

Chip scale package semiconductor device and method of manufacture

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device and method of manufacturing the same

Semiconductor packages including at least one die position checker

Alignment mark design for packages

Semiconductor device package and method for manufacturing the same

Flip chip curved sidewall self-alignment features for substrate and...

Apparatus and method for manufacturing display device

Semiconductor integrated fluxgate device shielded by discrete magne...

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Chip assembly

Polymer resin and compression mold chip scale package

Method for transfer of semiconductor devices onto glass substrates

Semiconductor device and method of manufacturing the same

Semiconductor device package and manufacturing method thereof

Package structure having integrated circuit component with conducti...

Electronic semiconductor component and method for producing an elec...

Method of surface-mounting components

Systems and methods for bonding semiconductor elements

Integrated fan-out package and manufacturing method thereof

Semiconductor device packages, packaging methods, and packaged semi...

Patents Applicationslast 30 patents

INTEGRATED PASSIVE DEVICE DIES AND METHODS OF FORMING AND PLACEMENT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY

SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

INTERPOSER STRUCTURE FOR SEMICONDUCTOR PACKAGE INCLUDING PERIPHERAL...

METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE

SEMICONDUCTOR WAFER AND SEMICONDUCTOR DIES FORMED THEREFROM INCLUDI...

MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT COMPONENT AND PACKAGE STRUCTURE HAVING THE SAME

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME

FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER

WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH BUFFER LAYER

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING